Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 92% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18396340 | CHIP PACKAGING METHOD AND CHIP PACKAGE BASED ON PANEL FORM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18244429 | NONVOLATILE MEMORY PACKAGE, STORAGE DEVICE HAVING THE SAME, AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18357484 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18525424 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 17709481 | THREE-DIMENSIONAL STACK COOLING WINGS | Non-Final OA | Intel Corporation |
| 18762826 | CHIP-ON-WAFER-ON-SUBSTRATE PACKAGE WITH IMPROVED YIELD | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18308866 | CHIP PACKAGE STRUCTURE WITH ANTI-WARPAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18493020 | THREE-DIMENSIONAL MEMORY DEVICES WITH LATERAL BLOCK ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18358727 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF INCLUDING EXPANDED SUPPORT OPENINGS AND DOUBLE SPACER WORD LINE CONTACT FORMATION | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18451159 | MEMORY DEVICE | Non-Final OA | MACRONIX INTERNATIONAL CO., LTD. |
| 18245185 | METHOD FOR PRODUCING A PACKAGE, AND OPTOELECTRONIC DEVICE | Non-Final OA | ams-OSRAM International GmbH |
| 18402649 | ELECTRONIC ASSEMBLY | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
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