Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2831
This examiner grants 93% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18396340 | CHIP PACKAGING METHOD AND CHIP PACKAGE BASED ON PANEL FORM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18712265 | Display Panel and Preparation Method Therefor, and Display Apparatus | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18699610 | ORGANIC ELECTROLUMINESCENT DEVICE AND DISPLAY EQUIPMENT | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18416179 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., LTD. |
| 18542156 | PACKAGING FOR MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE | Non-Final OA | QUALCOMM Incorporated |
| 18644145 | ELECTRONIC DEVICE AND TILED ELECTRONIC DEVICE | Non-Final OA | Innolux Corporation |
| 18690472 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Mitsubishi Electric Corporation |
| 18308866 | CHIP PACKAGE STRUCTURE WITH ANTI-WARPAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
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