Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818 2831
This examiner grants 93% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18825437 | SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18396340 | CHIP PACKAGING METHOD AND CHIP PACKAGE BASED ON PANEL FORM | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18712265 | Display Panel and Preparation Method Therefor, and Display Apparatus | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18611442 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18644145 | ELECTRONIC DEVICE AND TILED ELECTRONIC DEVICE | Non-Final OA | Innolux Corporation |
| 18542156 | PACKAGING FOR MICRO-ELECTROMECHANICAL SYSTEM (MEMS) DEVICE | Non-Final OA | QUALCOMM Incorporated |
| 18690472 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Mitsubishi Electric Corporation |
| 18245185 | METHOD FOR PRODUCING A PACKAGE, AND OPTOELECTRONIC DEVICE | Non-Final OA | ams-OSRAM International GmbH |
| 18676228 | DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | Wuhan Tianma Micro-Electronics Co., Ltd. |
| 18784544 | CHANNEL LAST PROCESS FOR DUMMY GATE VOID DEFECT REDUCTION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18773592 | MANUFACTURING METHOD OF PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18773229 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18768421 | VERTICAL INTERCONNECT STRUCTURES WITH INTEGRATED CIRCUITS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18760292 | CRACK STOP RING TRENCH TO PREVENT EPITAXY CRACK PROPAGATION | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18308866 | CHIP PACKAGE STRUCTURE WITH ANTI-WARPAGE STRUCTURE AND METHOD FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18771613 | THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING EMBEDDED INTEGRATED PASSIVE DEVICE AND METHODS OF MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18690574 | OVERHANG PATTERN FOR ADVANCED OLED PATTERNING | Non-Final OA | Applied Materials, Inc. |
| 18673298 | INTERCONNECT STRUCTURE | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18494857 | Method for Manufacturing Electrically Conductive Terminal and Electrically Conductive Terminal | Non-Final OA | Tyco Electronics (Shanghai) Co., Ltd. |
| 18748383 | SEMICONDUCTOR DEVICE INCLUDING AN INTEGRATED TIM-ON-DIE | Non-Final OA | SanDisk Technologies, Inc. |
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