Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Group I, claims 1-5 in the reply filed on 05/30/2025 is acknowledged.
Claims 6-8 and 11 withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected invention, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 05/30/2025.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1-6 rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 1 recites the limitation "the prepreg" in lines 4, 8, 10, 12. There is insufficient antecedent basis for this limitation in the claim.
Claim 5 recites the limitation "the prepreg" in line 5. There is insufficient antecedent basis for this limitation in the claim.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claim(s) 1-2 is/are rejected under 35 U.S.C. 102(a)(2) as being anticipated by KAMOSHITA et al. (JP 2004063991).
Regarding claim 1, KAMOSHITA et al. (JP 2004063991) discloses a method for
manufacturing a substrate material for a semiconductor package, comprising:
increasing a temperature of a laminated body comprising a metal foil, one or more prepregs, and a metal foil, the metal foils and the prepreg being laminated in this order, to a hot- press temperature while pressurizing the laminated body [0021]; and
heating the laminated body to a temperature higher than or equal to the hot-press temperature while pressurizing the laminated body to form a substrate material comprising an insulating substrate including the prepreg, and the metal foil provided on both surfaces of the insulating substrate [0021], in this order,
wherein the prepreg contains an inorganic fiber base material, and a thermosetting resin composition impregnated in the inorganic fiber base material, and a content of the thermosetting resin composition is 40 to 80% by mass on the basis of a mass of the prepreg [0012], and
in increasing the temperature of the laminated body to the hot-press temperature while pressurizing the laminated body, the laminated body is heated in a heating condition in which the lowest melt viscosity of the prepreg is 5000 Pa-s or less [0005], claim 1.
Regarding claim 2, KAMOSHITA et al. discloses the minimum melting viscosity is 3,000 Pas – 7,000 pas (abstract, claim 1).
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
a) KAWAKITA et al. (US 2006/0064871) discloses a method of manufacturing circuit board.
b) JORDAN et al. (US 2014/0167333) discloses radiation curable resin systems for composite materials and methods for use thereof.
c) HOZUMI et al. (JP 2013209626) discloses prepreg and prepreg manufacturing method.
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STELLA YI
Examiner
Art Unit 1742
/STELLA K YI/Primary Examiner, Art Unit 1742
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