Prosecution Insights
Prosecution Insights
120 pending office actions • 53 art units • 101 examiners • 0 of 120 (0%) have an AI response strategy ready • 91 patents granted in the last 365 days
Based on the USPTO statutory response window for each pending office action. 32 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Every pending office action with a known statutory deadline, placed on a days-until-due axis. Dots left of Today are overdue; the further right, the more runway. Cases that share a deadline window stack vertically. 32 of the docket's apps have a known mailing date.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §101 + other | 7 (6%) |
| §103 only | 55 (46%) |
| §102 only | 8 (7%) |
| §112 only | 3 (2%) |
| Double-patenting only | 3 (2%) |
| Double-patenting + other | 2 (2%) |
| Multi-statute (no §101) | 41 (34%) |
| No statute on record | 1 (1%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| CHAU, LINDA N | 3 | 44.5% | +15.9% |
| MILLER, BETHANY MACKENZIE | 3 | 54.7% | +48.8% |
| REMAVEGE, CHRISTOPHER | 3 | 57.8% | +26.4% |
| DEO, DUY VU NGUYEN | 3 | 82.4% | +7.0% |
| LU, JIONG-PING | 3 | 83.5% | +7.9% |
| BARRON, JEREMIAH JOHN | 2 | 78.1% | +2.7% |
| NORDMEYER, PATRICIA L | 2 | 56.5% | +37.1% |
| BURNS, TREMESHA WILLIS | 2 | 78.1% | +17.3% |
| FREEMAN, JOHN D | 2 | 45.6% | +6.9% |
| RUMMEL, JULIA L | 2 | 34.7% | +52.3% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 1 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18294889 | POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP AND POLISHING METHOD | LU, JIONG-PING | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18690073 | RADIO WAVE TRANSMITTING MEMBER, EMBLEM, AND OBJECT DETECTING STRUCTURE | LE, HAILEY R | 52d overdue |
| 18579803 | RESIN COMPOSITION FOR DICING PROTECTION LAYER AND TREATMENT METHOD FOR SEMICONDUCTOR WAFER | UTECH, BENJAMIN L | 30d overdue |
| 18354873 | HEAT CONDUCTING COMPOSITION | ZHANG, RUIYUN | 30d overdue |
| 18686043 | POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | LU, JIONG-PING | 23d overdue |
| 18264534 | POLISHING LIQUID, POLISHING LIQUID SET AND POLISHING METHOD | LU, JIONG-PING | 10d overdue |
| 18573782 | METHOD FOR PRODUCING BONDED BODY | COPENHEAVER, BLAINE R | 5d overdue |
| 18546197 | COMPOSITION CONTAINING (METH)ACRYLAMIDE COMPOUND AND COMPOUND HAVING POLYOXYALKYLENE CHAIN | BROOKS, KREGG T | 3d overdue |
| 18778266 | METHOD FOR PRODUCING STRUCTURE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE | WRIGHT, ALEXANDER SCOTT | 12d |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18861341 | FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM | CHAU, LINDA N | 9d overdue |
| 18859112 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | MILLER, BETHANY MACKENZIE | 5d |
| 18861283 | FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM | CHAU, LINDA N | 50d |
| 18861571 | STRUCTURE, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING STRUCTURE | MILLER, BETHANY MACKENZIE | — |
| 18861003 | POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD | REMAVEGE, CHRISTOPHER | — |
| 18860583 | SHEET PROVIDED WITH HEAT INSULATING LAYER AND ADHESIVE LAYER | NORDMEYER, PATRICIA L | — |
| 18859963 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | BURNS, TREMESHA WILLIS | — |
| 18858330 | MEMBER FOR SEMICONDUCTOR DEVICE PRODUCTION, AND METHOD FOR PRODUCING SAME | BURNS, TREMESHA WILLIS | — |
| Art Unit | Apps |
|---|---|
| 1787 | 7 |
| 1713 | 7 |
| 1788 | 4 |
| 1785 | 4 |
| 1746 | 3 |
| 1784 | 3 |
| 1783 | 3 |
| 1764 | 3 |
| 1771 | 2 |
| 1717 | 2 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 18877000 | PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET | DUCHENEAUX, FRANK D | 1788 | §103 | Final Rejection | 35d | Pending | Dec 19, 2024 |
| 18875281 | CONNECTING MEMBER AND METHOD FOR MANUFACTURING CONNECTING MEMBER | MCNALLY, DANIEL | 1746 | §102§103 | Non-Final OA | — | Pending | Dec 16, 2024 |
| 18871881 | CONNECTED BODY OF METAL MATERIALS AND METHOD FOR CONNECTING METAL MATERIALS | WANG, XIAOBEI | 1784 | §103 | Final Rejection | 9d overdue | Pending | Dec 05, 2024 |
| 18867657 | IMAGE PROCESSING DEVICE, IMAGE PROCESSING METHOD, AND PROGRAM | SIMPSON, LIXI CHOW | — | §102§103 | Non-Final OA | — | Pending | Nov 20, 2024 |
| 18866632 | LAYERED BODY | BARRON, JEREMIAH JOHN | 1787 | §102§112Other | Non-Final OA | — | Pending | Nov 18, 2024 |
| 18866650 | SENSOR COVER | BARRON, JEREMIAH JOHN | 2858 | §102§112Other | Non-Final OA | — | Pending | Nov 18, 2024 |
| 18864553 | ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR | BRANCH, CATHERINE S | 1748 | DP | Non-Final OA | — | Pending | Nov 11, 2024 |
| 18864550 | ADHESIVE SET, ADHESIVE BODY, AND MANUFACTURING METHOD THEREFOR | PATEL, VISHAL I | 1746 | §103 | Non-Final OA | — | Pending | Nov 11, 2024 |
| 18861878 | HEAT CONDUCTION SHEET, HEAT DISSIPATING DEVICE, AND METHOD OF MANUFACTURING HEAT CONDUCTION SHEET | DUMBRIS, SETH M | 1784 | §103§112Other | Non-Final OA | — | Pending | Oct 31, 2024 |
| 18932740 | SiC INGOT AND METHOD FOR MANUFACTURING SiC SUBSTRATE | KUNEMUND, ROBERT M | — | §103 | Non-Final OA | — | Pending | Oct 31, 2024 |
| 18861630 | LUBRICANT FOR MAGNETIC RECORDING MEDIA | VASISTH, VISHAL V | 1771 | §102§103DP | Non-Final OA | — | Pending | Oct 30, 2024 |
| 18861586 | RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE | SMITH, GRAHAM P | 2845 | §103 | Non-Final OA | 84d | Pending | Oct 30, 2024 |
| 18861660 | METHOD FOR MANUFACTURING SUBSTRATE WITH CONDUCTIVE VIAS AND METHOD FOR MANUFACTURING WIRING BOARD WITH CONDUCTIVE VIAS | DAGENAIS, KRISTEN A | 1717 | §103 | Final Rejection | — | Pending | Oct 30, 2024 |
| 18861289 | RELEASE FILM AND METHOD OF PRODUCING SEMICONDUCTOR PACKAGE | FLORES JR, DONALD M | 1781 | §102§103§112Other | Non-Final OA | — | Pending | Oct 29, 2024 |
| 18861283 | FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM | CHAU, LINDA N | 1785 | §103 | Non-Final OA | 50d | Pending | Oct 29, 2024 |
| 18861571 | STRUCTURE, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING STRUCTURE | MILLER, BETHANY MACKENZIE | 1787 | §102§112 | Non-Final OA | — | Pending | Oct 29, 2024 |
| 18861341 | FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM | CHAU, LINDA N | 1785 | §103 | Final Rejection | 9d overdue | Pending | Oct 29, 2024 |
| 18861396 | CONDUCTIVE ADHESIVE FILM, METHOD OF TREATING ADHEREND, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | HANDVILLE, BRIAN | 1783 | §103 | Non-Final OA | — | Pending | Oct 29, 2024 |
| 18861003 | POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD | REMAVEGE, CHRISTOPHER | — | §103 | Non-Final OA | — | Pending | Oct 28, 2024 |
| 18860583 | SHEET PROVIDED WITH HEAT INSULATING LAYER AND ADHESIVE LAYER | NORDMEYER, PATRICIA L | 1788 | §102§103 | Non-Final OA | — | Pending | Oct 25, 2024 |
| 18859963 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | BURNS, TREMESHA WILLIS | — | §103 | Non-Final OA | — | Pending | Oct 24, 2024 |
| 18859872 | RELIABILITY TEST METHOD FOR PRINTED WIRING BOARD SUBSTRATE | WOODWARD, NATHANIEL T | — | §103Other | Non-Final OA | — | Pending | Oct 24, 2024 |
| 18859278 | RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | FREEMAN, JOHN D | — | §103 | Non-Final OA | — | Pending | Oct 23, 2024 |
| 18859196 | RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATE, PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE | CHOI, PETER Y | 1786 | §102§103§112 | Non-Final OA | — | Pending | Oct 23, 2024 |
| 18859112 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | MILLER, BETHANY MACKENZIE | 1787 | §103Other | Final Rejection | 5d | Pending | Oct 22, 2024 |
| 18858768 | BINDER PITCH FOR PRODUCING CARBON MATERIAL AND METHOD FOR PRODUCING CARBON MATERIAL | VALENCIA, JUAN C | 1771 | §103§112 | Non-Final OA | — | Pending | Oct 22, 2024 |
| 18858330 | MEMBER FOR SEMICONDUCTOR DEVICE PRODUCTION, AND METHOD FOR PRODUCING SAME | BURNS, TREMESHA WILLIS | 2847 | §102 | Non-Final OA | — | Pending | Oct 21, 2024 |
| 18858192 | RESIST PATTERN INSPECTION METHOD, RESIST PATTERN MANUFACTURING METHOD, SUBSTRATE SELECTION METHOD, AND MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE SUBSTRATE OR PRINTED CIRCUIT BOARD | TRAN, BINH X | 1713 | §101§102§103DP | Non-Final OA | — | Pending | Oct 18, 2024 |
| 18857335 | ABRASIVE GRAIN, SELECTION METHOD THEREFOR, POLISHING AGENT, MULTI-LIQUID POLISHING AGENT, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | DEO, DUY VU NGUYEN | — | §102§103§112 | Non-Final OA | — | Pending | Oct 16, 2024 |
| 18856465 | CMP POLISHING LIQUID AND POLISHING METHOD | DEO, DUY VU NGUYEN | — | §102§103 | Non-Final OA | — | Pending | Oct 11, 2024 |
| 18856062 | FILM FOR TEMPORARY FIXING, LAMINATE FOR TEMPORARY FIXING, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, COMPOSITION FOR TEMPORARY FIXING | MILLER, BETHANY MACKENZIE | 1787 | §102 | Non-Final OA | — | Pending | Oct 11, 2024 |
| 18855859 | EVALUATION SYSTEM, EVALUATION METHOD, AND EVALUATION PROGRAM | LU, TOM Y | — | §102 | Non-Final OA | — | Pending | Oct 10, 2024 |
| 18855760 | IMAGE ANALYSIS SYSTEM, IMAGE ANALYSIS METHOD, AND IMAGE ANALYSIS PROGRAM | PATEL, JAYESH A | 2677 | §103 | Non-Final OA | — | Pending | Oct 10, 2024 |
| 18855406 | POLYCRYSTALLINE ALUMINA ABRASIVE GRAINS, METHOD FOR PRODUCING THE SAME, AND GRINDSTONE | MCDONOUGH, JAMES E | 1734 | §103 | Non-Final OA | 14d | Pending | Oct 09, 2024 |
| 18854969 | COATING LIQUID, METHOD FOR PRODUCING COATING LIQUID, AND METHOD FOR PRODUCING COMPOSITE MATERIAL | RUMMEL, JULIA L | 1784 | §103Other | Non-Final OA | — | Pending | Oct 08, 2024 |
| 18854970 | COATING LIQUID, METHOD FOR PRODUCING COATING LIQUID, AND METHOD FOR PRODUCING COMPOSITE MATERIAL | RUMMEL, JULIA L | — | §103 | Non-Final OA | — | Pending | Oct 08, 2024 |
| 18854547 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR DEVICE | ESTRADA, ANGEL R | 2841 | §102 | Non-Final OA | — | Pending | Oct 07, 2024 |
| 18287221 | RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND RECESS FILLING METHOD | KHAN, TAHSEEN | — | §103 | Non-Final OA | — | Pending | Oct 04, 2024 |
| 18896017 | METHOD FOR MANUFACTURING MAGNETIC RECORDING MEDIUM AND HEAT TREATMENT APPARATUS USED THEREFOR | TADAYYON ESLAMI, TABASSOM | 1718 | §103§112 | Non-Final OA | — | Pending | Sep 25, 2024 |
| 18849810 | PHOTOSENSITIVE MULTILAYER RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | RUMMEL, IAN A | — | §112 | Non-Final OA | — | Pending | Sep 23, 2024 |
| 18849889 | PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | POWERS, LAURA C | 1785 | §112 | Final Rejection | — | Pending | Sep 23, 2024 |
| 18848282 | DEFECT ANALYZER, METHOD FOR ANALYZING DEFECT, AND PROGRAM | LIEW, ALEX KOK SOON | — | §103 | Non-Final OA | — | Pending | Sep 18, 2024 |
| 18883215 | HEATING DEVICE AND METHOD OF MANUFACTURING MAGNETIC RECORDING MEDIUM | CHAU, LINDA N | 1785 | §102§103§112Other | Non-Final OA | — | Pending | Sep 12, 2024 |
| 18843562 | FILM MANUFACTURING METHOD, FILM, WOUND BODY, CONNECTION STRUCTURE, METHOD FOR MANUFACTURING CONNECTION STRUCTURE, AND REMOVING DEVICE | NORDMEYER, PATRICIA L | 1788 | §102§103 | Non-Final OA | — | Pending | Sep 03, 2024 |
| 18843025 | ANTI-FOGGING AGENT, ANTI-FOGGING METHOD FOR VEHICLE LAMP STRUCTURE, AND VEHICLE LAMP STRUCTURE | FERRE, ALEXANDRE F | 1788 | §103 | Final Rejection | 5d | Pending | Aug 30, 2024 |
| 18839049 | ETCHING METHOD | REMAVEGE, CHRISTOPHER | — | §103 | Non-Final OA | — | Pending | Aug 16, 2024 |
| 18836354 | DICING/DIE-BONDING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | AHMED, SHAHED | — | §103 | Non-Final OA | — | Pending | Aug 07, 2024 |
| 18780724 | METHOD FOR EVALUATING SiC SUBSTRATE, METHOD FOR MANUFACTURING SiC SUBSTRATE, AND SiC SUBSTRATE EVALUATION DEVICE | LEE, SHUN K | 2884 | §103 | Final Rejection | 4d overdue | Pending | Jul 23, 2024 |
| 18778266 | METHOD FOR PRODUCING STRUCTURE AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE | WRIGHT, ALEXANDER SCOTT | 1745 | §102§103 | Non-Final OA | 12d | Pending | Jul 19, 2024 |
| 18727697 | PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGES | FAYETTE, NATHALIE RENEE | — | §102§103§112 | Non-Final OA | — | Pending | Jul 10, 2024 |
| 18721865 | METHOD OF EVALUATING RESIN MATERIAL, RESIN MATERIAL, METHOD OF PRODUCING RESIN MATERIAL, ELECTRONIC COMPONENT DEVICE, AND METHOD OF PRODUCING ELECTRONIC COMPONENT DEVICE | VILLALUNA, ERIKA J | — | §102§103 | Non-Final OA | — | Pending | Jun 20, 2024 |
| 18720811 | METHOD FOR PRODUCING POLYMER DISPERSION FOR SOLID ELECTROLYTIC CAPACITOR, AND METHOD FOR PRODUCING SOLID ELECTROLYTIC CAPACITOR | OMGBA, ESSAMA | — | §103 | Non-Final OA | — | Pending | Jun 17, 2024 |
| 18710425 | PREDICTION APPARATUS, TRAINING APPARATUS, PREDICTION METHOD, TRAINING METHOD, PREDICTION PROGRAM, AND TRAINING PROGRAM | EDWARDS, ETHAN WESLEY | — | DP | Non-Final OA | — | Pending | May 15, 2024 |
| 18705992 | REINFORCED SEMICONDUCTOR CHIP PRODUCTION METHOD, SEMICONDUCTOR CHIP WITH FILM, SEMICONDUCTOR CHIP REINFORCEMENT METHOD, REINFORCEMENT FILM AND SEMICONDUCTOR DEVICE | BLACKWELL, ASHLEY NICOLE | — | §102 | Non-Final OA | — | Pending | Apr 30, 2024 |
| 18699792 | RESIN SHEET, LAMINATED BOARD, METAL-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | CHEN, VIVIAN | 1787 | §103§112 | Final Rejection | — | Pending | Apr 09, 2024 |
| 18694641 | COMPOSITION SEARCH METHOD | UDDIN, MD I | — | §101§103 | Non-Final OA | — | Pending | Mar 22, 2024 |
| 18690073 | RADIO WAVE TRANSMITTING MEMBER, EMBLEM, AND OBJECT DETECTING STRUCTURE | LE, HAILEY R | 3648 | §102§103 | Final Rejection | 52d overdue | Pending | Mar 07, 2024 |
| 18687355 | SOLID ELECTROLYTE, ALL-SOLID-STATE BATTERY, AND SOLID ELECTROLYTE MATERIAL | WILKERSON, JORDAN PATRICK | — | §102§103 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18687298 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MATERIAL, AND APPLICATION FOR MANUFACTURING SEMICONDUCTOR DEVICE OF TEMPORARY-FIXING MATERIAL | ERDEM, FAZLI | 2812 | §102 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18687573 | LITHIUM ION CONDUCTIVE SOLID ELECTROLYTE MATERIAL, LITHIUM ION CONDUCTIVE SOLID ELECTROLYTE, METHOD FOR PRODUCING SAID LITHIUM ION CONDUCTIVE SOLID ELECTROLYTE MATERIAL, METHOD FOR PRODUCING SAID LITHIUM ION CONDUCTIVE SOLID ELECTROLYTE, AND ALL-SOLID-STATE BATTERY | KNOWLAN, KEVIN MICHAEL | — | §102§103 | Non-Final OA | — | Pending | Feb 28, 2024 |
| 18686881 | FILM FOR TEMPORARY FIXATION, LAYERED PRODUCT FOR TEMPORARY FIXATION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | FREEMAN, JOHN D | 1787 | §103§112 | Final Rejection | — | Pending | Feb 27, 2024 |
| 18687180 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD | TRAYWICK, ANDREW PRESTON | — | §103 | Non-Final OA | — | Pending | Feb 27, 2024 |
| 18686043 | POLISHING LIQUID, POLISHING METHOD, COMPONENT MANUFACTURING METHOD, AND SEMICONDUCTOR COMPONENT MANUFACTURING METHOD | LU, JIONG-PING | 1713 | §102§103 | Final Rejection | 23d overdue | Pending | Feb 23, 2024 |
| 18682767 | ETCHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT | DUCLAIR, STEPHANIE P. | 1713 | §103 | Final Rejection | 2d overdue | Pending | Feb 09, 2024 |
| 18294859 | POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD | DEO, DUY VU NGUYEN | 1713 | — | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18294889 | POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP AND POLISHING METHOD | LU, JIONG-PING | 1713 | §103 | Final Rejection | — | Pending | Feb 02, 2024 |
| 18294839 | POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD | REMAVEGE, CHRISTOPHER | 1713 | §103DPOther | Non-Final OA | — | Pending | Feb 02, 2024 |
| 18291075 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | CHU, JOHN S Y | — | §103 | Non-Final OA | — | Pending | Jan 22, 2024 |
| 18579803 | RESIN COMPOSITION FOR DICING PROTECTION LAYER AND TREATMENT METHOD FOR SEMICONDUCTOR WAFER | UTECH, BENJAMIN L | 1746 | §103§112 | Non-Final OA | 30d overdue | Pending | Jan 16, 2024 |
| 18394568 | SiC EPITAXIAL WAFER | TRICE III, WILLIAM CLARENCE | 2893 | §103 | Non-Final OA | 8d overdue | Pending | Dec 22, 2023 |
| 18573782 | METHOD FOR PRODUCING BONDED BODY | COPENHEAVER, BLAINE R | 1781 | §102§103§112 | Final Rejection | 5d overdue | Pending | Dec 22, 2023 |
| 18571837 | METHOD FOR PRODUCING ALCOHOLS | CUTLIFF, YATE KAI RENE | — | §103§112 | Non-Final OA | — | Pending | Dec 19, 2023 |
| 18570750 | RADICALLY POLYMERIZABLE RESIN COMPOSITION | FOSS, DAVID ROGER | — | §102§103§112 | Non-Final OA | — | Pending | Dec 15, 2023 |
| 18538445 | WAFER EVALUATION METHOD, WAFER PRODUCTION METHOD AND DEVICE PRODUCTION METHOD | FRANK, RODNEY T | 2855 | §103 | Final Rejection | — | Pending | Dec 13, 2023 |
| 18566877 | RESIN COMPOSITION, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | NGUYEN, KHANH TUAN | 1761 | §103 | Non-Final OA | 51d overdue | Pending | Dec 04, 2023 |
| 18562141 | METHOD FOR PRODUCING BROMOFLUOROMETHANE | PARSA, JAFAR F | — | §103 | Non-Final OA | — | Pending | Nov 17, 2023 |
| 18562166 | PREPREG, LAMINATED PLATE, METAL-CLAD LAMINATED PLATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING PREPREG, AND METHOD FOR MANUFACTURING METAL-CLAD LAMINATED PLATE | EWALD, MARIA VERONICA | 1783 | §103 | Final Rejection | 3d overdue | Pending | Nov 17, 2023 |
| 18560234 | METHOD FOR SELECTING PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, CURED FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | CHAMPION, RICHARD DAVID | — | §102§103 | Non-Final OA | — | Pending | Nov 10, 2023 |
| 18505581 | SUBSTRATE ATTACHING/DETACHING ROBOT, SUBSTRATE ATTACHING/DETACHING METHOD, AND FILM FORMATION APPARATUS | BRAYTON, JOHN JOSEPH | 1794 | §103 | Non-Final OA | — | Pending | Nov 09, 2023 |
| 18289825 | TITANIUM OXIDE PARTICLES AND METHOD FOR PRODUCING SAME | BAUM, ZACHARY JOHN | 1736 | §102§112 | Non-Final OA | — | Pending | Nov 07, 2023 |
| 18269373 | CHLORINE GAS DECOMPOSITION CATALYST, EXHAUST GAS TREATMENT DEVICE, AND METHOD FOR DECOMPOSING CHLORINE GAS | HAILEY, PATRICIA L | 1732 | §102§103§112 | Non-Final OA | — | Pending | Oct 06, 2023 |
| 18281095 | PACKING MATERIAL AND METHOD FOR PRODUCING THE SAME, AND COLUMN FOR SIZE EXCLUSION CHROMATOGRAPHY | MENON, KRISHNAN S | 1777 | §103 | Final Rejection | 3d overdue | Pending | Sep 08, 2023 |
| 18548405 | MATERIAL CHARACTERISTICS PREDICTION METHOD AND MODEL GENERATION METHOD | WONG, WILLIAM | 2144 | §102§103 | Non-Final OA | — | Pending | Aug 30, 2023 |
| 18547235 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, TRANSPARENT ANTENNA, MANUFACTURING METHOD THEREFOR, AND IMAGE DISPLAY DEVICE | PIZIALI, ANDREW T | 1789 | §102§103 | Final Rejection | — | Pending | Aug 21, 2023 |
| 18547226 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, TRANSPARENT ANTENNA AND MANUFACTURING METHOD THEREFOR, AND IMAGE DISPLAY DEVICE | NGUYEN, HA S | 1766 | §102§103Other | Non-Final OA | — | Pending | Aug 21, 2023 |
| 18546187 | COMPOSITION CONTAINING COMPOUND HAVING POLYOXYALKYLENE CHAIN AND COMPOUND HAVING POLY(METH)ACRYLATE CHAIN | TESKIN, FRED M | 1762 | DP | Final Rejection | 26d | Pending | Aug 11, 2023 |
| 18546197 | COMPOSITION CONTAINING (METH)ACRYLAMIDE COMPOUND AND COMPOUND HAVING POLYOXYALKYLENE CHAIN | BROOKS, KREGG T | 1764 | §101§102§103Other | Final Rejection | 3d overdue | Pending | Aug 11, 2023 |
| 18264534 | POLISHING LIQUID, POLISHING LIQUID SET AND POLISHING METHOD | LU, JIONG-PING | 1713 | §102§103 | Non-Final OA | 10d overdue | Pending | Aug 07, 2023 |
| 18263714 | NEGATIVE ELECTRODE MATERIAL FOR LITHIUM-ION SECONDARY BATTERY, METHOD OF EVALUATING SAME, AND METHOD OF PRODUCING SAME, NEGATIVE ELECTRODE FOR LITHIUM-ION SECONDARY BATTERY, AND LITHIUM-ION SECONDARY BATTERY | CANTELMO, GREGG | 1725 | §101§102§103 | Final Rejection | 34d | Pending | Aug 01, 2023 |
| 18354873 | HEAT CONDUCTING COMPOSITION | ZHANG, RUIYUN | 1782 | §102§103§112Other | Non-Final OA | 30d overdue | Pending | Jul 19, 2023 |
| 18261713 | ELECTROCONDUCTIVE MEMBER, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE | SYLVIA, CHRISTINA A | 2817 | §103 | Non-Final OA | — | Pending | Jul 17, 2023 |
| 18261114 | METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, WIRING BOARD, AND SEMICONDUCTOR DEVICE | CHEN, YU | 2896 | §102§103 | Final Rejection | — | Pending | Jul 12, 2023 |
| 18260468 | METHOD FOR PRODUCING WIRING BOARD, LAMINATE AND METHOD FOR PRODUCING SAME | LEGASPI, EUGENE REY DEVERA | 3729 | §102§103§112 | Non-Final OA | — | Pending | Jul 05, 2023 |
| 18259444 | RESIN COMPOSITION, PREPREG, LAMINATED PLATE, RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | FISCHER, JUSTIN R | 1749 | §103 | Non-Final OA | — | Pending | Jun 27, 2023 |
| 18269679 | MOLDED BODY, AUTOMOBILE PART, AND METHOD FOR MANUFACTURING MOLDED BODY | WEYDEMEYER, ETHAN | 1783 | §103 | Final Rejection | 7d | Pending | Jun 26, 2023 |
| 18259079 | NEGATIVE ELECTRODE FOR ALL-SOLID-STATE BATTERY, ALL-SOLID-STATE BATTERY, AND NEGATIVE-ELECTRODE ACTIVE MATERIAL FOR ALL-SOLID-STATE BATTERY | KASS-MULLET, BENJAMIN ELI | 1752 | §103 | Final Rejection | — | Pending | Jun 23, 2023 |
| 18269364 | LITHIUM ION CONDUCTIVE SOLID ELECTROLYTE AND ALL-SOLID-STATE BATTERY | ALBAN, FELICITY BERNARD | 1728 | §103 | Non-Final OA | — | Pending | Jun 23, 2023 |
| 18269416 | TRANSPARENT CONDUCTING FILM LAMINATE | NGUYEN, HA S | 1766 | §102 | Non-Final OA | 2d overdue | Pending | Jun 23, 2023 |
| 18258846 | FILM ADHESIVE AND METHOD FOR MAKING SAME; DICING/DIE BONDING INTEGRATED FILM AND METHOD FOR MAKING SAME; AND SEMICONDUCTOR DEVICE AND METHOD FOR MAKING SAME | TURNER, BRIAN | 2818 | §103 | Final Rejection | — | Pending | Jun 22, 2023 |
| 18258492 | COMPOSITION AND SHEET CONTAINING CURED PRODUCT OF SAME | RIOJA, MELISSA A | 1764 | §103 | Final Rejection | — | Pending | Jun 20, 2023 |
| 18257146 | METHOD FOR EVALUATING COMPATIBILITY OF THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED PLATE, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | LOGIE, MICHAEL J | 2800 | §101§102§103 | Non-Final OA | — | Pending | Jun 13, 2023 |
| 18266880 | POLYCHLOROPRENE LATEX COMPOSITION | FOSS, DAVID ROGER | 1764 | §103 | Final Rejection | 24d overdue | Pending | Jun 13, 2023 |
| 18266752 | FULLERENE PRODUCTION DEVICE AND PRODUCTION METHOD | RUMP, RICHARD M | 1759 | §103 | Non-Final OA | 9d | Pending | Jun 12, 2023 |
| 18265971 | MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE | FISCHER, JUSTIN R | 1749 | §103 | Non-Final OA | — | Pending | Jun 08, 2023 |
| 18256452 | DESIGN ASSISTANCE DEVICE, DESIGN ASSISTANCE METHOD, AND DESIGN ASSISTANCE PROGRAM | ROSEN, ELIZABETH H | — | §101§112 | Non-Final OA | — | Pending | Jun 08, 2023 |
| 18255237 | PASTE | BERRO, ADAM JOSEPH | 1765 | §103 | Final Rejection | — | Pending | May 31, 2023 |
| 18037594 | FIXED BED MULTI-TUBULAR REACTOR FOR PRODUCING ALKENYL ACETATE | LEUNG, JENNIFER A | 1774 | §103 | Final Rejection | — | Pending | May 18, 2023 |
| 18037459 | ANTIFOGGING AGENT, HYDROPHILIZING AGENT, AND ANTIFOGGING METHOD FOR VEHICULAR LAMP STRUCTURE | BAREFORD, KATHERINE A | 1718 | §103Other | Non-Final OA | — | Pending | May 17, 2023 |
| 18026057 | AUTOPHAGY ACTIVATOR | CRAIGO, BAHAR ALAWI | 1699 | §103 | Final Rejection | — | Pending | Apr 27, 2023 |
| 18031496 | COMPOSITION | LIOTT, CAROLINE DUSHECK | 1732 | §103§112 | Final Rejection | — | Pending | Apr 12, 2023 |
| 18031274 | COATING COMPOSITION AND BASE MATERIAL WITH COATING FILM | DAVIDSON IV, CULLEN LEE GARRETT | 1767 | §103Other | Non-Final OA | — | Pending | Apr 11, 2023 |
| 18248591 | METHOD FOR EVALUATING PERFORMANCE OF LUBRICATING LAYER | BEVERIDGE, CONNOR HAMMOND | — | §101§103 | Non-Final OA | — | Pending | Apr 11, 2023 |
| 18127720 | THERMALLY CONDUCTIVE COMPOSITION | WALKER, AJA ARYANNA | 1761 | §103§112 | Final Rejection | — | Pending | Mar 29, 2023 |
| 18245347 | METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE, PREPREG, AND SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE | YI, STELLA KIM | 1744 | §102§112 | Non-Final OA | — | Pending | Mar 15, 2023 |
| 18024894 | LAMINATED STRUCTURE AND OBJECT DETECTION STRUCTURE | AHMED, SHEEBA | 1787 | §102Other | Non-Final OA | 33d | Pending | Mar 06, 2023 |
| 18023151 | CURABLE COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE | BOWMAN, ANDREW J | 1717 | §103 | Final Rejection | 78d overdue | Pending | Feb 24, 2023 |
| 18019614 | MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND WIRING FORMING MEMBER | WALSHON, SCOTT R | 1759 | §103 | Final Rejection | 51d overdue | Pending | Feb 03, 2023 |
| 18017954 | METHOD FOR PRODUCING CIRCUIT BOARD | DOWNES, NATHANAEL JASON | 1794 | §103 | Non-Final OA | 34d | Pending | Jan 25, 2023 |
| 17925175 | CMP POLISHING LIQUID AND POLISHING METHOD | UTECH, BENJAMIN L | 1700 | §112 | Non-Final OA | — | Pending | Nov 14, 2022 |
| 17641101 | TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY, TEMPORARY PROTECTIVE BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | WU, ANDREA | 1763 | §103 | Final Rejection | — | Pending | Mar 08, 2022 |
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