DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Objections
Claim 18 is objected to because of the following informalities:
Regarding claim 18, line 5, the term “their” is unclear. What does applicant mean of “their” and what “their” refers to? Please, revise.
Appropriate correction is required.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claim(s) 18 is/are rejected under 35 U.S.C. 102a(1) as being anticipated by Uzoh (U.S. 2017/0047307), hereafter Uzoh.
As best understood to claim 18, Uzoh discloses a wiring substrate as shown in figures 1-2 comprising:
a first substrate (110, para-0055+) being a rigid substrate;
a second substrate (120); and
a plurality of bumps (130) interposed between the first and second substrates (110, 120) and bonding the first substrate (110) and the second substrate (120), the bumps (130) comprising no solder in [[their]] intermediate portions,
wherein the bumps (130) are composed of a metal (para-0009+) OR alloy having a melting point of 600°C OR more and have a height of 0.6 µm OR more.
As to claim 19, Uzoh discloses the first substrate (110) comprises a rigid carrier (para-0057, 0059) and a redistribution layer (140) on the rigid carrier, and wherein the redistribution layer and the second substrate are bonded by the plurality of bumps (130).
As to claim 20, Uzoh discloses the rigid carrier (110) is composed of (1) glass, (2) a substrate comprising silicon, or (3) alumina, para-0057, 0059.
As to claim 21, Uzoh discloses the bumps (130) are regularly arranged at a pitch (center-to-center distance) of 1 µm or more and 40 µm or less, para-0217.
Response to Arguments
Applicant’s arguments with respect to claim(s) 18-21 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument.
Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
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/TUAN T DINH/Primary Examiner, Art Unit 2847
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