Prosecution Insights
Last updated: August 18, 2026

Examiner: DINH, TUAN T

Tech Center 3600 • Art Units: 2800 2835 2841 2847 2848 3611

This examiner grants 79% of resolved cases

Performance Statistics

78.7%
Allow Rate
+26.7% vs TC avg
1,223
Total Applications
+22.4%
Interview Lift
1064
Avg Prosecution Days
Based on 1185 resolved cases, 2023–2026

Rejection Statute Breakdown

0.1%
§101 Eligibility
38.8%
§102 Novelty
44.4%
§103 Obviousness
6.1%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18771306 PRINTED CIRCUIT BOARD, MEMORY MODULE INCLUDING THE SAME, AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18090268 ELECTRONIC DEVICE INCLUDING WIRELESS CHARGING ANTENNA AND STRUCTURE THEREOF Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18122339 ELECTRONIC CIRCUIT PACKAGES Non-Final OA Apple Inc.
17293050 SUPPORT COMPOSITE PLATE, MANUFACTURING METHOD THEREOF, AND DISPLAY MODULE Non-Final OA Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
18668184 Control Device, in particular Steering Control Device Non-Final OA Robert Bosch GmbH
18572368 COMMUTATION CELL FOR AN INVERTER Non-Final OA ROBERT BOSCH GMBH
18757438 MANUFACTURING METHOD OF ELECTRONIC DEVICE Final Rejection InnoLux Corporation
18139083 SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS Non-Final OA Intel Corporation
17853018 INTERCONNECT BRIDGE WITH SIMILAR CHANNEL LENGTHS Non-Final OA Intel Corporation
18378810 FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES Final Rejection Meta Platforms Technologies, LLC
18716018 SEMICONDUCTOR PACKAGE Non-Final OA LG INNOTEK CO., LTD.
18632413 Plateable Single Layer Capacitor Final Rejection KYOCERA AVX Components Corporation
18704680 DOUBLE-SIDED COPPER CLAD LAMINATE, CAPACITOR ELEMENT AND PRINTED WIRING BOARD WITH BUILT-IN CAPACITOR, AND METHOD FOR MANUFACTURING DOUBLE-SIDED COPPER CLAD LAMINATE Final Rejection MITSUI MINING & SMELTING CO., LTD.
18284643 MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE Non-Final OA MITSUI MINING & SMELTING CO., LTD.
18459419 POWER CONVERSION MODULE Non-Final OA TEXAS INSTRUMENTS INCORPORATED
18775762 COMPLIANT PIN Non-Final OA HONEYWELL INTERNATIONAL INC.
18797085 PRINTED CIRCUIT BOARD Non-Final OA SAMSUNG ELECTRO-MECHANICS CO., LTD.
18178588 MODULE AND ELECTRONIC COMPONENT Non-Final OA Murata Manufacturing Co., Ltd.
18708255 MODULE, IMAGE DISPLAY DEVICE LAMINATE, IMAGE DISPLAY DEVICE, MANUFACTURING METHOD OF MODULE, AND WIRING BOARD Non-Final OA DAI NIPPON PRINTING CO., LTD.
18923638 ELECTRONIC DEVICE Non-Final OA Advanced Semiconductor Engineering, Inc.
18450482 Exerting-Pressure Device and Electronic Apparatus Comprising the Same Non-Final OA Tyco Electronics (Shanghai) Co., Ltd.
17848526 METHODS AND SYSTEMS FOR IMPLEMENTING A MODULAR PLATFORM IMPLEMENTING ACTIVE DEVICES Final Rejection WOLFSPEED, INC.

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