Prosecution Insights
Prosecution Insights
Tech Center 3600 • Art Units: 2800 2835 2841 2847 2848 3611
This examiner grants 79% of resolved cases
Tuan T. Dinh has resolved 1198 cases in Art Unit 2800, located in Tech Center 3600. The examiner's allowance rate is 78.8%, and the median days to allowance is 1064. The interview lift of 22.1% is significant, indicating that interviews are a highly effective strategy for overcoming rejections and securing an allowance. This profile suggests that direct communication is a key factor in the examiner's decision-making process.
In Tech Center 3600, practitioners can notably improve their chances of allowance by engaging in direct communication, leveraging the 22.1% lift. The 78.8% baseline allowance rate is already strong, but the lift makes success even more likely. The 1064-day median to allowance is a standard timeline that applicants should plan for. With 1198 resolved cases, the data is robust and highlights the value of interviews. Practitioners should consider the 22.1% lift as a primary tool for navigating the 1064-day process and improving the already favorable 78.8% success rate in Art Unit 2800.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18937936 | ELECTRONIC DEVICE INCLUDING SUBSTRATE INCLUDING COATING LAYER | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18749099 | APPARATUSES HAVING VIA STRUCTURES TO REDUCE CROSSTALK EFFECTS | Final Rejection | Samsung Electronics Co., Ltd. |
| 17293050 | SUPPORT COMPOSITE PLATE, MANUFACTURING METHOD THEREOF, AND DISPLAY MODULE | Non-Final OA | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18724156 | CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | Final Rejection | HUAWEI TECHNOLOGIES CO., LTD. |
| 18327100 | Modular Printed Circuit Boards with Connectors | Final Rejection | Intel Corporation |
| 18117818 | INTEGRATED ANTIOXIDANT AND SEALANT SOLUTION TO ADDRESS TEMPERATURE HUMIDITY RELIABILITY ISSUE OF LIQUID METAL INTERCONNECT | Final Rejection | Intel Corporation |
| 17853018 | INTERCONNECT BRIDGE WITH SIMILAR CHANNEL LENGTHS | Non-Final OA | Intel Corporation |
| 17553189 | POWER DELIVERY TECHNIQUES FOR GLASS SUBSTRATE WITH HIGH DENSITY SIGNAL VIAS | Non-Final OA | Intel Corporation |
| 18716188 | POWER SUPPLY MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18632413 | Plateable Single Layer Capacitor | Final Rejection | KYOCERA AVX Components Corporation |
| 18863441 | CIRCUIT BOARD, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE | Non-Final OA | HONOR DEVICE CO., LTD. |
| 18704680 | DOUBLE-SIDED COPPER CLAD LAMINATE, CAPACITOR ELEMENT AND PRINTED WIRING BOARD WITH BUILT-IN CAPACITOR, AND METHOD FOR MANUFACTURING DOUBLE-SIDED COPPER CLAD LAMINATE | Final Rejection | MITSUI MINING & SMELTING CO., LTD. |
| 18284643 | MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE | Non-Final OA | MITSUI MINING & SMELTING CO., LTD. |
| 19019995 | SEMICONDUCTOR STORAGE DEVICE | Non-Final OA | Kioxia Corporation |
| 18459419 | POWER CONVERSION MODULE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18378810 | FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES | Final Rejection | Meta Platforms Technologies, LLC |
| 17429909 | ELECTROSTATIC CHUCK WITH POWDER COATING | Non-Final OA | Lam Research Corporation |
| 18775762 | COMPLIANT PIN | Non-Final OA | HONEYWELL INTERNATIONAL INC. |
| 18636337 | TOOLLESS COMPRESSION ATTACHED MEMORY MODULE INSTALLATION IN INFORMATION HANDLING SYSTEMS | Final Rejection | Dell Products L.P. |
| 18937697 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING MOUNTING BOARD | Non-Final OA | TDK Corporation |
| 18708255 | MODULE, IMAGE DISPLAY DEVICE LAMINATE, IMAGE DISPLAY DEVICE, MANUFACTURING METHOD OF MODULE, AND WIRING BOARD | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18450482 | Exerting-Pressure Device and Electronic Apparatus Comprising the Same | Non-Final OA | Tyco Electronics (Shanghai) Co., Ltd. |
| 18923638 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
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