Tech Center 3600 • Art Units: 2800 2835 2841 2847 2848 3611
This examiner grants 79% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18771306 | PRINTED CIRCUIT BOARD, MEMORY MODULE INCLUDING THE SAME, AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18090268 | ELECTRONIC DEVICE INCLUDING WIRELESS CHARGING ANTENNA AND STRUCTURE THEREOF | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18122339 | ELECTRONIC CIRCUIT PACKAGES | Non-Final OA | Apple Inc. |
| 17293050 | SUPPORT COMPOSITE PLATE, MANUFACTURING METHOD THEREOF, AND DISPLAY MODULE | Non-Final OA | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. |
| 18668184 | Control Device, in particular Steering Control Device | Non-Final OA | Robert Bosch GmbH |
| 18572368 | COMMUTATION CELL FOR AN INVERTER | Non-Final OA | ROBERT BOSCH GMBH |
| 18757438 | MANUFACTURING METHOD OF ELECTRONIC DEVICE | Final Rejection | InnoLux Corporation |
| 18139083 | SELF-HEALING CAP FOR LIQUID METAL CONTAINMENT IN SOCKET APPLICATIONS | Non-Final OA | Intel Corporation |
| 17853018 | INTERCONNECT BRIDGE WITH SIMILAR CHANNEL LENGTHS | Non-Final OA | Intel Corporation |
| 18378810 | FLEXIBLE ELECTRONIC SYSTEM FOR FLEXIBLE WEARABLE DEVICES AND OTHER ELECTRONIC DEVICES | Final Rejection | Meta Platforms Technologies, LLC |
| 18716018 | SEMICONDUCTOR PACKAGE | Non-Final OA | LG INNOTEK CO., LTD. |
| 18632413 | Plateable Single Layer Capacitor | Final Rejection | KYOCERA AVX Components Corporation |
| 18704680 | DOUBLE-SIDED COPPER CLAD LAMINATE, CAPACITOR ELEMENT AND PRINTED WIRING BOARD WITH BUILT-IN CAPACITOR, AND METHOD FOR MANUFACTURING DOUBLE-SIDED COPPER CLAD LAMINATE | Final Rejection | MITSUI MINING & SMELTING CO., LTD. |
| 18284643 | MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE | Non-Final OA | MITSUI MINING & SMELTING CO., LTD. |
| 18459419 | POWER CONVERSION MODULE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18775762 | COMPLIANT PIN | Non-Final OA | HONEYWELL INTERNATIONAL INC. |
| 18797085 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18178588 | MODULE AND ELECTRONIC COMPONENT | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18708255 | MODULE, IMAGE DISPLAY DEVICE LAMINATE, IMAGE DISPLAY DEVICE, MANUFACTURING METHOD OF MODULE, AND WIRING BOARD | Non-Final OA | DAI NIPPON PRINTING CO., LTD. |
| 18923638 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18450482 | Exerting-Pressure Device and Electronic Apparatus Comprising the Same | Non-Final OA | Tyco Electronics (Shanghai) Co., Ltd. |
| 17848526 | METHODS AND SYSTEMS FOR IMPLEMENTING A MODULAR PLATFORM IMPLEMENTING ACTIVE DEVICES | Final Rejection | WOLFSPEED, INC. |
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