Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Response to Amendment
The amendment filed August 25, 2026 has been entered. The amendment to the claims overcomes the rejections under 35 U.S.C. 112(b) previously set forth in the non-final rejection mailed March 27, 2026. Claims 14-23 remain pending in the application.
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
Claims 14-23 are rejected under 35 U.S.C. 103 as being unpatentable over US 2018/0158712 (Ekkels et al.) in view of US 2024/0034912 (Glass et al.).
Regarding claim 14, Ekkels discloses a method for manufacturing a thinned wafer separated from a carrier, the method comprising the steps of providing a temporary adhesive sheet (12) (see Figure 1f, paragraph 0029);
Providing a thinned wafer (1) supported on a carrier (10) (see Figure 1e, paragraph 0028);
Bonding the temporary adhesive sheet (12) to the thinned wafer (1) (see Figure 1g, paragraph 0029),
Peeling the carrier (10) from the thinned wafer (1) in a state where the thinned wafer (1) is bonded to the temporary adhesive sheet (12) (see Figure 1h, paragraph 0030); and
Peeling (removing) the temporary adhesive sheet (12) from the thinned wafer (1) from which the carrier (10) has been peeled (see Figures 1l-1m, paragraph 0030).
Ekkels does not disclose that the temporary adhesive sheet comprises a plurality of structures; however, in the analogous field of thinned wafer handling, Glass discloses a dry adhesive sheet (see claim 1), comprising a plurality of structures (stems 103), the structures being cylindrical (see paragraph 0010, Figure 3) with 140 microns in height (see paragraph 0011), which is within the claimed range of 50 to 500 microns in height, and 130 microns in diameter (see paragraph 0011), which is within the claimed range of 10 microns to 1 mm in diameter, wherein the sheet has a configuration in which the plurality of structures are arranged with a same interval (see Figure 1). Glass teaches that using the dry adhesive sheet during semiconductor manufacturing provides little to no adhesion with the surface of wafers, allowing for easy removal that is accurate and repeatable (see paragraphs 0006 and 0012). It would have been obvious to one having ordinary skill in the art before the effective filing date to use the dry adhesive sheet of Glass as the temporary adhesive sheet for the Ekkels manufacturing method, in order to allow for adhesion that is easily removable, accurate and repeatable as taught by Glass.
Regarding claim 15, Ekkels also discloses an embodiment where the thickness of the thinned wafer is between 10 and 100 micrometers (see paragraph 0017), which is within the claimed range of 300 microns or less.
Regarding claim 16, Ekkels also discloses an embodiment where the thickness of the thinned wafer is between 10 and 100 micrometers (see paragraph 0017), which is within the claimed range of 100 microns or less.
Regarding claims 17 and 18, Ekkels also discloses that the thinned wafer is a silicon wafer or a compound semiconductor wafer (see paragraphs 0006-0007).
Regarding claim 19, Ekkels also discloses that the method for manufacturing a thinned wafer further comprises a step of washing (cleaning) the thinned wafer from which the carrier has been peeled (see paragraph 0030).
Regarding claim 20, Ekkels in view of Glass also discloses that the sheet is molded with a thermosetting resin (see Glass paragraph 0023).
Regarding claim 21, Ekkels in view of Glass also discloses that the sheet may comprise a thermosetting elastomer (see Glass paragraph 0023-0031).
Regarding claim 22, Ekkels in view of Glass also discloses that the thermosetting elastomer may be a silicone-based thermosetting elastomer, or a urethane-based thermosetting elastomer (see Glass paragraphs 0023-0031).
Regarding claim 23, Ekkels also discloses that the sheet (12) is laminated to a base body (carrier substrate 11) (see Figures 1f-1g, paragraph 0029).
Response to Arguments
Applicant’s arguments with respect to the claims have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument.
Conclusion
Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to WENDY L BOSS whose telephone number is (571)272-7466. The examiner can normally be reached 8:30-6:30.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Katelyn Smith can be reached at 571-270-5545. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/WENDY L BOSS/Examiner, Art Unit 1749
/ALICIA J WEYDEMEYER/Primary Examiner, Art Unit 1781
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