Prosecution Insights
Last updated: October 01, 2026
Application No. 18/291,740

RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME

Non-Final OA §102§103
Filed
Jan 24, 2024
Priority
Jul 30, 2021 — JP 2021-125370 +2 more
Examiner
SULLIVAN, CALEEN O
Art Unit
Tech Center
Assignee
Mitsubishi Gas Chemical Company, Inc.
OA Round
1 (Non-Final)
89%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
99%
With Interview

Examiner Intelligence

Grants 89% — above average
89%
Career Allowance Rate
1012 granted / 1142 resolved
+28.6% vs TC avg
Moderate +11% lift
Without
With
+11.4%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 1m
Avg Prosecution
22 currently pending
Career history
1148
Total Applications
across all art units

Statute-Specific Performance

§101
0.5%
-39.5% vs TC avg
§103
60.4%
+20.4% vs TC avg
§102
19.5%
-20.5% vs TC avg
§112
5.5%
-34.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1142 resolved cases

Office Action

§102 §103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-3, 5, 7-11 and 13-18 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Houlihan (US2009/0104559; IDS, 04/22/2024). Houlihan discloses a photoresist composition that is used over a substrate and the antireflective coating that is also disclosed. Houlihan discloses in example 19: a solution of EAdMA (2-Ethyladamantyl methacrylate)/AdOMMA (2-adamantanyloxymethyl methacrylate)/HAdA (2-hydroxyadamantantyl acrylate)/.alpha.-GBLMA (alpha.-gamma-butyrolactonyl methacrylate )/AdMA (1-adamantanyl methacrylate) (7.36 g). (Para, 0128). These disclosures teach the limitation of claim 1, ‘A resist composition comprising: a resin…’ and the limitation of claims 13-17. Houlihan discloses the photoresist composition also includes bis(4-tert-butylphenyl)iodonium bis-perfluoroethane sulfonimide, (0.22 g), bis(triphenylsulfonium) perfluorobutane-1,4-disulfonate (0.2 g), (bis(4-tert-butylphenyl)iodonium)-1,4-perfluorobutanedisulfonate (0.16 g), 2,6-disopropylaniline (0.04 g), FC 4430 (0.02 g), methyl-2-hydroxyisobutyrate (153.58 g), PGME (1-methoxy-2-propanol) (36.36 g), gamma-valerolactone (0.78 g). (Para, 0128). These disclosures teach the limitation of claim 1, ‘A resist composition comprising: …a solvent (B1) a compound represented by the following general formula (b-1) wherein a content of an active component is 45% by mass or less based on total amount of the resist composition PNG media_image1.png 147 376 media_image1.png Greyscale wherein R1 is an alkyl group having 1-10 carbon atoms.’ Moreover, these disclosures also teach the limitation of claims 2, 5 and 7-11. Houlihan discloses this solution was rolled overnight, and then filtered through a 0.2 micron PTFE filter. (Para, 0128). Houlihan then discloses in example 20 a lithographic evaluation of the anti-reflective coating composition of example 18, using the photoresist composition of example 19. Houlihan discloses a silicon substrate coated with the bottom antireflective coating composition of Example 18 (DBARC) was prepared by spin coating the bottom antireflective coating solution onto the silicon substrate at a spin speed of 2350 rpm and soft baked at 120C. for 60 sec resulting in a DBARC with a film thickness of 40 nm. (Para, 0128). Houlihan discloses the photoresist composition from Example 19 was then coated onto the DBARC coated silicon substrate. (Para, 0129). Houlihan discloses the spin speed was 1500 rpm and the photoresist film thickness was 150 nm and PAB of 100C for 60 seconds. (Para, 0129). Houlihan discloses the coated wafer was then exposed using a Nikon S306D 193 nm exposure tool using a NA=0.75 and conventional Illumination with a sigma of 0.6 s with a binary reticle. (Para, 0129). Houlihan discloses after exposure, the coated wafer was baked at a PEB of 115C for 60 s and developed in 2.38% TMAH at 21C for 30 seconds. (Para, 0129). These disclosures teach the limitations of claim 18. Houlihan discloses a resolution down to 140 nm L/S feature (1:1 and 1:5 at same dose) was obtained with a dose of about 15-20 mJ/cm2. (Para, 0129). Therefore, claims 1-3, 5, 7-11 and 13-18 are anticipated by the disclosures of Houlihan as discussed above. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows: 1. Determining the scope and contents of the prior art. 2. Ascertaining the differences between the prior art and the claims at issue. 3. Resolving the level of ordinary skill in the pertinent art. 4. Considering objective evidence present in the application indicating obviousness or nonobviousness. Claim(s) 4 and 6 is/are rejected under 35 U.S.C. 103 as being unpatentable over Houlihan. The disclosures of Houlihan as discussed in paragraph 3 above fail to explicitly teach the limitation of claim 4, ‘The resist composition according claim 1,wherein R1 in the general formula (b-1) is an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, an i-butyl group, an s-butyl group, or a t-butyl group.’ However, the recitations of claim 4 are obvious in view of the disclosures of Houlihan. As discussed in paragraph 3 above Houlihan explicitly discloses the resist composition includes solvent components such as methyl-2-hydroxyisobutyrate (153.58 g), PGME (1-methoxy-2-propanol) (36.36 g). One of ordinary skill in the art would appreciate that ethyl-2-hydroxyisobutyrate would be a reasonable substitute for methyl-2-hydroxyisobutyrate. Moreover, one of ordinary skill in the art would also appreciate that ethyl-2-hydroxyisobutryrate would function similar to methyl-2-hydroxisobutyrate in the resist composition disclosed in Houlihan. Therefore, while the disclosures of Houlihan do not explicitly teach the limitation of claim 4 the disclosures of Houlihan as discussed above contemplate the limitation of claim 4 as well as the limitation of claim 6. Claim(s) 12 is/are rejected under 35 U.S.C. 103 as being unpatentable over Houlihan as applied to claims 1-3, 5, 7-11 and 13-18 in paragraph 3 above, and further in view of Bogan (EP 397460). The disclosures of Houlihan as discussed in paragraph 3above fail to explicitly teach the limitation of claim 12, ‘ The resist composition according to claim 1,wherein the resin (A) comprises a novolac resin (A1).’ However, the disclosures of Houlihan further in view of the disclosures of Bogan provide such teachings. Bogan discloses the use of highly branched novolaks in photoresists. Bogan discloses the novolak resins are used a film-forming binder in a photoresist composition which increases photo speed, and lithographic contrast of the photoresist. (Abstract). The disclosures of Houlihan further disclose that the inclusion of such novolaks in the photoresist optimizes side-wall profile of the image to be as close as perpendicular to the substrate as possible. (Pg, 2, 45-53). It would have been obvious to one of ordinary skill in the art at the time of filing of the present application by Applicant to modify the disclosures of Houlihan further in view of the disclosures of Bogan because both disclose photoresist composition and Bogan discloses a resin component which when added will improve the resulting lithographic patterning process of the resist composition disclosed in Houlihan. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to CALEEN O SULLIVAN whose telephone number is (571)272-6569. The examiner can normally be reached Mon-Fri: 7:30 am-4:00 pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Dale Page can be reached at 571-270-7877. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /CALEEN O SULLIVAN/Primary Examiner, Art Unit 2899
Read full office action

Prosecution Timeline

Jan 24, 2024
Application Filed
Sep 16, 2026
Non-Final Rejection mailed — §102, §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12748348
SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION
3y 8m to grant Granted Sep 29, 2026
Patent 12743020
APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE
3y 2m to grant Granted Sep 22, 2026
Patent 12736880
Method for coating top anti-reflective coating
3y 0m to grant Granted Sep 15, 2026
Patent 12724346
UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTILAYERED STRUCTURE FORMED USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME
3y 4m to grant Granted Sep 01, 2026
Patent 12717239
METHODS OF PATTERNING A PHOTORESIST, AND RELATED PATTERNING SYSTEMS
3y 9m to grant Granted Aug 25, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.
Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2
Expected OA Rounds
89%
Grant Probability
99%
With Interview (+11.4%)
2y 1m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1142 resolved cases by this examiner. Grant probability derived from career allowance rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month