Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 1722 1795 2812 2896 2899
This examiner grants 89% of resolved cases
Caleen O. Sullivan works within Tech Center 2800 and Art Unit 1722. The examiner has managed 1142 resolved cases in this unit. An allowance rate of 88.6 percent indicates the share of cases that result in a patent. Practitioners can use the 11.4 percent interview lift to assess the impact of a meeting. This lift shows that the probability of allowance is higher when an interview occurs. The 11.4 percent figure is a comparison to the baseline allowance rate of 88.6 percent.
The median time to allowance is 762 days. This 762-day duration represents the time required to reach an allowance. Art Unit 1722 is the specific group where these 1142 resolved cases were examined. Tech Center 2800 is the administrative division for this examiner. Practitioners can use these metrics to plan for the duration of the prosecution process. The data indicates the frequency of grants and the impact of direct communication with the examiner during the application cycle.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18603775 | METHOD FOR INSPECTING TREATMENT LIQUID AND METHOD FOR PRODUCING TREATMENT LIQUID | Non-Final OA | FUJIFILM Corporation |
| 18418331 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18418023 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, RESIN, AND METHOD FOR MANUFACTURING RESIN | Non-Final OA | FUJIFILM Corporation |
| 18268340 | METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND EXPOSURE APPARATUS | Non-Final OA | NIKON CORPORATION |
| 18765710 | ADVANCED-PACKAGING HIGH-VOLUME-MODE DIGITAL-LITHOGRAPHY-TOOL | Non-Final OA | Applied Materials, Inc. |
| 18581290 | EUV SENSITIVE METAL OXIDE MATERIAL AS UNDERLAYER FOR THIN CAR TO IMPROVE PATTERN TRANSFER | Non-Final OA | Applied Materials, Inc. |
| 18617380 | MULTIPATTERNING WITH CROSSLINKABLE OVERCOAT | Non-Final OA | Tokyo Electron Limited |
| 18615346 | METHOD FOR PATTERNING MASK LAYER USING METAL-CONTAINING RESIST | Non-Final OA | Tokyo Electron Limited |
| 18498698 | ENDPOINT DETECTION IN DRY DEVELOPMENT OF PHOTORESIST | Non-Final OA | Tokyo Electron Limited |
| 18411376 | REFLECTIVE MASK BLANK, REFLECTIVE MASK, METHOD OF MANUFACTURING REFLECTIVE MASK BLANK, AND METHOD OF MANUFACTURING REFLECTIVE MASK | Non-Final OA | AGC Inc. |
| 18411594 | NANOTUBE-BASED PELLICLE FOR EXTREME ULTRAVIOLET LITHOGRAPHY AND RELATED MANUFACTURING METHOD | Non-Final OA | KOREA ELECTRONICS TECHNOLOGY INSTITUTE |
| 18562685 | METROLOGY SYSTEMS, TEMPORAL AND SPATIAL COHERENCE SCRAMBLER AND METHODS THEREOF | Non-Final OA | ASML Holding N.V. |
| 18598857 | ONIUM SALT MONOMER, POLYMER, CHEMICALLY AMPLIFIED RESIST COMPOSITION AND PATTERNING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18205125 | RESIST COMPOSITION AND PATTERN FORMING PROCESS | Non-Final OA | Shin-Etsu Chemical Co., Ltd. |
| 18291740 | RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME | Non-Final OA | MITSUBISHI GAS CHEMICAL COMPANY, INC. |
| 18383612 | MASSIVE MEASUREMENT SAMPLING USING MULTIPLE CHUCKS AND OPTICAL COLUMNS | Non-Final OA | KLA Corporation |
| 18575890 | HIGH REFRACTIVE INDEX PHOTORESIST COMPOSITION | Non-Final OA | Dow Silicones Corporation |
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