Prosecution Insights
Last updated: July 17, 2026
Application No. 18/333,356

ELECTRONIC COMPONENT, COIL COMPONENT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

Non-Final OA §102§103
Filed
Jun 12, 2023
Priority
Jun 17, 2022 — JP 2022-098412
Examiner
CHAN, TSZFUNG JACKIE
Art Unit
2837
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Murata Manufacturing Co., Ltd.
OA Round
1 (Non-Final)
75%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
94%
With Interview

Examiner Intelligence

Grants 75% — above average
75%
Career Allowance Rate
660 granted / 875 resolved
+7.4% vs TC avg
Strong +19% interview lift
Without
With
+18.8%
Interview Lift
resolved cases with interview
Typical timeline
3y 1m
Avg Prosecution
29 currently pending
Career history
917
Total Applications
across all art units

Statute-Specific Performance

§103
89.4%
+49.4% vs TC avg
§102
2.5%
-37.5% vs TC avg
§112
7.5%
-32.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 875 resolved cases

Office Action

§102 §103
CTNF 18/333,356 CTNF 86566 DETAILED ACTION Notice of Pre-AIA or AIA Status 07-03-aia AIA 15-10-aia The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA. Election/Restrictions 08-25-02 Applicant’s election of Group I, Species I in the reply filed on 05/18/2026 is acknowledged. Because applicant did not distinctly and specifically point out the supposed errors in the restriction requirement, the election has been treated as an election without traverse (MPEP § 818.01(a)). 08-06 AIA Claim s 3-5 and 8-12 withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected Group II and Group I, Species II-IV , there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 05/18/2026 . Claim Rejections - 35 USC § 102 07-06 AIA 15-10-15 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. 07-07-aia AIA 07-07 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – 07-08-aia AIA (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. 07-15-aia AIA Claim(s) 1-2 and 6-7 is/are rejected under 35 U.S.C. 102 (a)(1) as being anticipated by Watanabe et al. [U.S. Pub. No. 2014/0266547] . Regarding Claim 1, Watanabe et al. shows an electronic component (Fig. 12A and Drawing 1 below) comprising: an insulating layer (LI1); a circuit pattern (elements 31, 32 at element LI1) embedded in the insulating layer (see Fig. 12A); a wiring conductor (wiring conductor WC) outside the insulating layer (see Fig. 12A and see Drawing 1 below); and an interlayer connection portion (interlayer connection portion ICP) that connects a circuit connection portion (circuit connection portion CCP), which is a part of the circuit pattern (see Fig. 12A and see Drawing 1 below), and the wiring conductor (wiring conductor WC) via an opening of the insulating layer (see Fig. 12A and see Drawing 1 below, interlayer connection portion ICP connects circuit connection portion CCP and wiring conductor WC via an opening of element LI1), wherein a thickness (thickness T1) of a portion of the circuit connection portion of the circuit pattern (see Fig. 12A and see Drawing 1 below), the portion being located below the interlayer connection portion (see Fig. 12A and see Drawing 1 below), is larger than an average thickness (thickness T2) of a portion other than the circuit connection portion of the circuit pattern (see Fig. 12A and see Drawing 1 below, thickness T1 is larger than an average thickness T2, Paragraph [0006]). Regarding Claim 2, Watanabe et al. shows a width (width W1) of the circuit connection portion of the circuit pattern is larger than a width (width W2) of a portion other than the circuit connection portion (see Fig. 12A and see Drawing 1 below, width W1 is larger than W2, Paragraph [0006]). Regarding Claim 6, Watanabe et al. shows the circuit pattern is configured as a coil (see Fig. 12A, Paragraph [0006]). Regarding Claim 7, Watanabe et al. shows the circuit pattern is configured as a coil (see Fig. 12A, Paragraph [0006]) . 07-15-aia AIA Claim(s) 1-2 and 6-7 is/are rejected under 35 U.S.C. 102 (a)(1) as being anticipated by Yang et al. [U.S. Pub. No. 2022/0102065] . Regarding Claim 1, Yang et al. shows an electronic component (Fig. 12 upside down with general teachings from Figs. 1-11) comprising: an insulating layer (IF); a circuit pattern (elements 331, 311) embedded in the insulating layer (see Fig. 12); a wiring conductor (413) outside the insulating layer (see Fig. 12); and an interlayer connection portion (411) that connects a circuit connection portion (331), which is a part of the circuit pattern (see Fig. 12), and the wiring conductor (413) via an opening of the insulating layer (see Fig. 12, element 411 connects element 331 and element 413 via an opening of element IF), wherein a thickness (thickness of element 331) of a portion of the circuit connection portion of the circuit pattern (see Fig. 12, Paragraph [0072]), the portion being located below the interlayer connection portion (see Fig. 12 upside down), is larger than an average thickness (average thickness of element 311) of a portion other than the circuit connection portion of the circuit pattern (see Fig. 12, thickness of element 331 is larger than average thickness of element 311, Paragraph [0072]). Regarding Claim 2, Yang et al. shows a width (width of element 331) of the circuit connection portion of the circuit pattern is larger than a width (width of element 311) of a portion other than the circuit connection portion (see Fig. 12, width of element 331 is larger than of element 311 is clearly shown in Fig. 12). Regarding Claim 6, Yang et al. shows the circuit pattern is configured as a coil (see Fig. 12, Paragraph [0072]). Regarding Claim 7, Yang et al. shows the circuit pattern is configured as a coil (see Fig. 12, Paragraph [0072]) . Claim Rejections - 35 USC § 103 07-06 AIA 15-10-15 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. 07-20-aia AIA The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. 07-21-aia AIA Claim (s) 2 and 7 is/are rejected under 35 U.S.C. 103 as being unpatentable over Yang et al. in view of Jeong et al. [KR 20160057785] . Regarding Claim 2, Yang et al. shows the claimed invention as applied above. In addition, Jeong et al. shows (Figs. 2) a width (width W2 of element 47 or 46) of the circuit connection portion of the circuit pattern is larger than a width (width W1 of element 42 or 41) of a portion other than the circuit connection portion (see Fig. 2, Paragraph [0040]). Before the effective filing date of the claimed invention, it would have been obvious to a person of ordinary skill in the art to have a width of the circuit connection portion of the circuit pattern is larger than a width of a portion other than the circuit connection portion as taught by Jeong et al. for the electronic component as disclosed by Yang et al. to facilitate mechanical stability and reliability to improve electrical connection with reduced contact resistance and without short (Paragraph [0007]). Regarding Claim 7, Yang et al. shows the circuit pattern is configured as a coil (see Fig. 12, Paragraph [0072]) . 07-21-aia AIA Claim (s) 2 and 7 is/are rejected under 35 U.S.C. 103 as being unpatentable over Yang et al. in view of Park [U.S. Pub. No. 2021/0210276] . Regarding Claim 2, Yang et al. shows the claimed invention as applied above. In addition, Park shows (Figs. 1-8) a width (width of element 410 or 420) of the circuit connection portion of the circuit pattern is larger than a width (width of element 310 or 320) of a portion other than the circuit connection portion (see Figs. 1-8, Paragraph [0066]). Before the effective filing date of the claimed invention, it would have been obvious to a person of ordinary skill in the art to have a width of the circuit connection portion of the circuit pattern is larger than a width of a portion other than the circuit connection portion as taught by Park for the electronic component as disclosed by Yang et al. to facilitate mechanical stability and reliability to improve electrical connection and improved heat dissipation (Paragraph [0113]). Regarding Claim 7, Yang et al. shows the circuit pattern is configured as a coil (see Fig. 12, Paragraph [0072]). PNG media_image1.png 431 869 media_image1.png Greyscale Drawing 1 Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to TSZFUNG J CHAN whose telephone number is (571)270-7981. The examiner can normally be reached M-TH 8:00AM-6:00PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Shawki Ismail can be reached at (571)272-3985. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /TSZFUNG J CHAN/Primary Examiner, Art Unit 2837 Application/Control Number: 18/333,356 Page 2 Art Unit: 2837 Application/Control Number: 18/333,356 Page 3 Art Unit: 2837 Application/Control Number: 18/333,356 Page 4 Art Unit: 2837 Application/Control Number: 18/333,356 Page 5 Art Unit: 2837 Application/Control Number: 18/333,356 Page 6 Art Unit: 2837 Application/Control Number: 18/333,356 Page 7 Art Unit: 2837
Read full office action

Prosecution Timeline

Jun 12, 2023
Application Filed
Jun 16, 2026
Non-Final Rejection mailed — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
75%
Grant Probability
94%
With Interview (+18.8%)
3y 1m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 875 resolved cases by this examiner. Grant probability derived from career allowance rate.

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