Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Applicant's amendment/arguments filed on 12/23/25 as being acknowledged and entered. By this amendment claims 1-20 are pending and claims 10 and 16 are withdrawn.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claim(s) 1-4 and 13-14 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Kamgaing et al. (US PGPub 2024/0405433).
The applied reference has a common assignee with the instant application. Based upon the earlier effectively filed date of the reference, it constitutes prior art under 35 U.S.C. 102(a)(2). This rejection under 35 U.S.C. 102(a)(2) might be overcome by: (1) a showing under 37 CFR 1.130(a) that the subject matter disclosed in the reference was obtained directly or indirectly from the inventor or a joint inventor of this application and is thus not prior art in accordance with 35 U.S.C. 102(b)(2)(A); (2) a showing under 37 CFR 1.130(b) of a prior public disclosure under 35 U.S.C. 102(b)(2)(B) if the same invention is not being claimed; or (3) a statement pursuant to 35 U.S.C. 102(b)(2)(C) establishing that, not later than the effective filing date of the claimed invention, the subject matter disclosed in the reference and the claimed invention were either owned by the same person or subject to an obligation of assignment to the same person or subject to a joint research agreement.
Claim 1: Kamgaing teaches (Fig. 1) an apparatus comprising: a semiconductor die (102); a package substrate(110) supporting the semiconductor die, the package substrate including a glass core (112) [0032], the glass core having a first surface and a second surface opposite the first surface; and an antenna (104-2), at least part of the antenna between the first and second surfaces of the glass core.
Claim 2: Kamgaing teaches (Fig. 1) the antenna is a first antenna, the apparatus including a second antenna (104-3) within the glass core, the second antenna spaced from the first antenna.
Claim 3: Kamgaing teaches [0024-0028] the first antenna is electrically coupled to the semiconductor die, and the second antenna is electrically coupled to a contact pad on the package substrate, the contact pad to enable the package substrate to be electrically coupled to a printed circuit board, the semiconductor die to transmit a signal to the contact pad corresponding to a radio frequency signal between the first and second antennas.
Claim 4: Kamgaing teaches [0076-0085] the semiconductor die is a first semiconductor die, the apparatus including a second semiconductor die supported by the package substrate, the first semiconductor die to communicate with the second semiconductor die based on radio frequency signals between the first and second antennas.
Claim 13: Kamgaing teaches [0032] the glass core includes a first glass layer and a second glass layer adjacent the first glass layer, a portion of the antenna between the first and second glass layers.
Claim 14: Kamgaing teaches (Fig. 2B-2C) an apparatus comprising: a glass core (112); a first build-up region (115) [0030] on a first side of the glass core; a second build-up region on a second side of the glass core; and an antenna (104-1) at least partially embedded within and in contact with the glass core.
Claim(s) 14-15 and 17 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Hsieh et al. (US PGPub 2015/0130681)
Claim 14: Hsieh teaches (Fig. 1A) an apparatus comprising: a glass core (111) [0018]; a first build-up region (113) on a first side of the glass core; a second build-up region (101) on a second side of the glass core; and an antenna (123) at least partially embedded within and in contact with the glass core.
Claim 15: Hsieh teaches (Fig. 1A) the antenna extends (105) beyond the class core into at least one of the first or second build-up regions
Claim 17: Hsieh teaches (Fig. 1A) the antenna includes a reflector, the reflector defined by metal in at least two layers (105, 107) in the first build-up region, the metal electrically coupled by a via extending through a dielectric layer in the first build-up region.
Claim(s) 1-5, and 13 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Tseng et al. (US PGPub 2020/0196440)
Claim 1: Tseng teaches (Fig. 2B-2C) an apparatus comprising: a semiconductor die (152/154); a package substrate supporting the semiconductor die, the package substrate including a glass core (170,171), the glass core having a first surface (left most surface) and a second surface (right most surface) opposite the first surface; and an antenna (180), at least part of the antenna between the first and second surfaces of the glass core.
Claim 2: Tseng teaches (Fig. 2B-2C) the antenna is a first antenna, the apparatus including a second antenna (184) within the glass core, the second antenna spaced from the first antenna.
Claim 3: Tseng teaches (Fig. 2B-2C) the first antenna is electrically coupled to the semiconductor die, and the second antenna is electrically coupled to a contact pad on the package substrate, the contact pad to enable the package substrate to be electrically coupled to a printed circuit board, the semiconductor die to transmit a signal to the contact pad corresponding to a radio frequency signal between the first and second antennas.
Claim 4: Tseng teaches (Fig. 2B-2C) [0037] the semiconductor die is a first semiconductor die, the apparatus including a second semiconductor die supported by the package substrate, the first semiconductor die to communicate with the second semiconductor die based on radio frequency signals between the first and second antennas.
Claim 5: Tseng teaches (Fig. 2B-2C) a third antenna within the glass core, the third antenna spaced from the first antenna and spaced from the second antenna, at least one of the first, second, and third antennas to broadcast signals to the others of the first, second, and third antennas.
Claim 13: Tseng teaches (Fig. 2B-2C) the glass core includes a first glass layer and a second glass layer adjacent the first glass layer, a portion of the antenna between the first and second glass layers.
Reasons for Allowance
Claims 6-9 and 11-12 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims.
Claims 18-20 are allowed
The following is an examiner’s statement of reasons for allowance: The prior art of record neither anticipates nor renders obvious all the limitations in independent claim 18, specifically the means for reflecting the signal to be within the means of radiating the signal.
Response to Arguments
Applicant’s arguments with respect to claim(s) 1-20 have been considered but are moot because the new ground of rejection does not rely on any reference applied in the prior rejection of record for any teaching or matter specifically challenged in the argument.
Conclusion
Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to SARAH KATE SALERNO whose telephone number is (571)270-1266. The examiner can normally be reached M-F 6:30am-2:30pm.
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/SARAH K SALERNO/Primary Examiner, Art Unit 2814