Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 73% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18605115 | INTEGRATED CIRCUIT DEVICE INCLUDING VERTICAL MEMORY DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18639800 | METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18591820 | SEMICONDUCTOR DIE HAVING A DIE LEVEL DISTRIBUTION (DLD) METALLIZATION STRUCTURE INCLUDING A METAL PAD AND A SHORTER VIA COUPLING THE METAL PAD TO A METAL INTERCONNECT IN THE DIE FOR IMPROVED SIGNAL PATH CONDUCTIVITY | Non-Final OA | QUALCOMM Incorporated |
| 18730464 | INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS | Non-Final OA | Intel Corporation |
| 18189808 | ARCHITECTURES AND METHODS FOR COMPUTATION IN MEMORY (CIM) WITH BACKSIDE MEMORY USING HIGH PERFORMANCE (HP) THIN FILM TRANSISTOR (TFT) MATERIAL | Non-Final OA | Intel Corporation |
| 17989845 | LIGHT SOURCE DEVICE AND PROJECTOR | Non-Final OA | SEIKO EPSON CORPORATION |
| 18090882 | THREE-DIMENSIONAL MEMORY, FABRICATING METHOD THEREOF AND MEMORY SYSTEM | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18637129 | SUPPORT STRUCTURES FOR TIER DEFLECTION IN A MEMORY SYSTEM | Non-Final OA | Micron Technology, Inc. |
| 18365394 | APPARATUS AND METHODS FOR INCREASING CROSS BIT LINE PITCH IN NON-VOLATILE MEMORY CONTROL CIRCUITS | Final Rejection | Sandisk Technologies, Inc. |
| 18442547 | THREE-DIMENSIONAL MEMORY DEVICE WITH BACKSIDE SUPPORT PILLAR STRUCTURES AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18495491 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY-UNDULATING LATERAL ISOLATION TRENCHES AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18425211 | COOLING SYSTEM FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | Wistron Corporation |
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