Tech Center 2800 • Art Units: 2814
This examiner grants 73% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18456571 | INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS AND METHODS OF FORMING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18227467 | SEMICONDUCTOR MANUFACTURING APPARATUS, GAS SUPPLYING METHOD USING THE SAME, AND SEMICONDUCTOR MANUFACTURING METHOD USING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18096257 | SEMICONDUCTOR DEVICE INCLUDING BIT LINE PAD, METHOD FOR MANUFACTURING THE SAME AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 19349986 | 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH LOGIC AND MEMORY, AND A SEMICONDUCTOR DIE | Non-Final OA | Monolithic 3D Inc. |
| 17831275 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 17664860 | DISPLAY PANEL INCLUDING A FILLING LAYER | Final Rejection | SAMSUNG DISPLAY CO., LTD. |
| 18734190 | SEMICONDUCTOR STRUCTURE HAVING A BUTTED CONTACT AND METHOD OF FORMING | Final Rejection | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18212487 | METHODS FOR FORMING A BACK SIDE FILM STACK AND PACKAGE STRUCTURES THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 17833820 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18183955 | ELECTRONIC DEVICE | Final Rejection | Innolux Corporation |
| 18361594 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF USING ION IMPLANTED ETCH STOP LAYER ON A SACRIFICIAL FILL MATERIAL | Non-Final OA | WESTERN DIGITAL TECHNOLOGIES, INC., |
| 18334201 | WIRELESS INTERCONNECTS IN INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES | Final Rejection | Intel Corporation |
| 17682804 | POWER GATE WITH METAL ON BOTH SIDES | Non-Final OA | Intel Corporation |
| 18581667 | MICROELECTRONIC DEVICES WITH SOURCE REGION VERTICALLY BETWEEN TIERED DECKS, AND RELATED METHODS | Non-Final OA | Micron Technology, Inc. |
| 18428836 | METHODS OF FORMING MICROELECTRONIC DEVICES | Non-Final OA | Micron Technology, Inc. |
| 18459697 | MEMORY DEVICE | Non-Final OA | Kioxia Corporation |
| 17726467 | HYBRID FENCED SUBSTRATE FOR TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR FRONTSIDE MEMBRANE RELEASE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18267940 | ION SENSOR AND ION SENSOR MANUFACTURING METHOD | Final Rejection | HAMAMATSU PHOTONICS K.K. |
| 18472678 | CAPACITOR OF SEMICONDUCTOR DEVICE AND DISTRIBUTED MODEL CIRCUIT FOR THE SAME | Non-Final OA | SK hynix Inc. |
| 18233923 | THREE-DIMENSIONAL MEMORY DEVICE UTILIZING DUMMY MEMORY BLOCKS TO MITIGATE DEFECTS | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18090882 | THREE-DIMENSIONAL MEMORY, FABRICATING METHOD THEREOF AND MEMORY SYSTEM | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 18096355 | OPTICAL DEVICE PACKAGE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18365394 | APPARATUS AND METHODS FOR INCREASING CROSS BIT LINE PITCH IN NON-VOLATILE MEMORY CONTROL CIRCUITS | Non-Final OA | Sandisk Technologies, Inc. |
| 18360541 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITE DIELECTRIC ISOLATION STRUCTURE IN A STAIRCASE REGION AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18344411 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING REPLACEMENT INSULATING LAYERS AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18154286 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING DISCRETE CHARGE STORAGE ELEMENTS AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18278221 | SENSOR DEVICE | Non-Final OA | ams-OSRAM International GmbH |
| 18440658 | High Color Rendering White Light Emitting Devices and High Color Rendering Photoluminescence Compositions | Non-Final OA | Bridgelux, Inc. |
| 17702001 | THREE-DIMENSIONAL MEMORY WITH SUPER-PILLAR | Final Rejection | Intel NDTM US LLC |
| 17601835 | OPTICAL SENSOR INCLUDING INTEGRATED DIFFUSER | Final Rejection | ams AG |
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