Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2814
This examiner grants 74% of resolved cases
Sarah Kate Salerno has managed 892 resolved cases in Tech Center 2800. The examiner has an allowance rate of 73.5 percent. This figure indicates a consistent pattern of granting patents within Art Unit 2814. The high volume of 892 resolved cases provides a robust data set for predicting future outcomes, with the 73.5 percent rate serving as a reliable benchmark.
The interview lift is 15.0 percent. While positive, this lift is more moderate than other examiners in different units. However, the data still supports using interviews as a tool to improve outcomes and resolve outstanding issues. Practitioners should consider the 15.0 percent lift as a meaningful incentive to engage with the examiner directly during prosecution.
Successful applications reach grant in a median of 1086 days. This pendency provides a benchmark for expected prosecution timelines. The examiner's efficiency in resolving cases while maintaining a high allowance rate suggests a predictable and steady examination process for applicants. Planning for a 1086 day cycle allows for better resource management.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18613540 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18605115 | INTEGRATED CIRCUIT DEVICE INCLUDING VERTICAL MEMORY DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18412812 | SEMICONDUCTOR DEVICE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18639800 | METHOD FOR MANUFACTURING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18613395 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18888980 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18583169 | DISPLAY DEVICE | Non-Final OA | LG DISPLAY CO., LTD. |
| 18837525 | Wafer Singulation Film | Non-Final OA | Robert Bosch GmbH |
| 18730464 | INTEGRATED CIRCUIT DEVICES WITH ANGLED TRANSISTORS | Non-Final OA | Intel Corporation |
| 18189808 | ARCHITECTURES AND METHODS FOR COMPUTATION IN MEMORY (CIM) WITH BACKSIDE MEMORY USING HIGH PERFORMANCE (HP) THIN FILM TRANSISTOR (TFT) MATERIAL | Final Rejection | Intel Corporation |
| 18090882 | THREE-DIMENSIONAL MEMORY, FABRICATING METHOD THEREOF AND MEMORY SYSTEM | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18752438 | MICROELECTRONIC DEVICES AND MEMORY DEVICES | Non-Final OA | Lodestar Licensing Group LLC |
| 18695337 | METHODS AND FORMULATIONS FOR SACRIFICIAL BRACING, SURFACE PROTECTION, AND QUEUE-TIME MANAGEMENT USING STIMULUS RESPONSIVE POLYMERS | Non-Final OA | Lam Research Corporation |
| 18637129 | SUPPORT STRUCTURES FOR TIER DEFLECTION IN A MEMORY SYSTEM | Non-Final OA | Micron Technology, Inc. |
| 18734190 | SEMICONDUCTOR STRUCTURE HAVING A BUTTED CONTACT AND METHOD OF FORMING | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18614756 | METHOD OF FORMING PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18769227 | STRUCTURES AND METHODS FOR TRENCH ISOLATION | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18425211 | COOLING SYSTEM FOR HETEROGENEOUS INTEGRATED SEMICONDUCTOR PACKAGE STRUCTURE | Non-Final OA | Wistron Corporation |
| 18365394 | APPARATUS AND METHODS FOR INCREASING CROSS BIT LINE PITCH IN NON-VOLATILE MEMORY CONTROL CIRCUITS | Final Rejection | Sandisk Technologies, Inc. |
| 18495491 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LATERALLY-UNDULATING LATERAL ISOLATION TRENCHES AND METHODS OF FORMING THE SAME | Non-Final OA | SANDISK TECHNOLOGIES LLC |
| 18583737 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
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