DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Continued Examination Under 37 CFR 1.114
A request for continued examination under 37 CFR 1.114, including the fee set forth in 37 CFR 1.17(e), was filed in this application after final rejection. Since this application is eligible for continued examination under 37 CFR 1.114, and the fee set forth in 37 CFR 1.17(e) has been timely paid, the finality of the previous Office action has been withdrawn pursuant to 37 CFR 1.114. Applicant's submission filed on 1/23/26 has been entered.
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention.
Claim(s) 1, 6-8, 10, 14-16, 18-19 is/are rejected under 35 U.S.C. 103 as being unpatentable over US 2016/0329238 to Tang in view of US 2022/0093388 to Nakatani in view of US 2022/0119939 to Noh.
Tang teaches a method for using ALD to gapfill during STI [0030]. The variant ALD cycle includes a first step of supplying a nitrogen (ammonia) plasma [0033] followed by standard silica ALD (Id.) (i.e., a first silicon reactant, purge, a second oxygen reactant, purge [0042]). The cycle is repeated until the desired thickness is achieved [0042]. The nitrogen plasma does form a gradient within the trench (Fig. 4), which causes the silica film to grow at a greater rate within the portion of the trench that has the least nitrogen functionalization (Fig. 5A-5D).
Tang does not teach the inhibitor includes organic aminosilane molecules or thermal ALD.
However, Nakatani teaches a substantially identical process wherein the inhibitor includes organic aminosilane molecules [0144-0148]. Nakatani does go on to describe a thermal scheme for performing the process [0107], a plasma scheme [0108], and under these schemes supplying the aminosilane [0110-0114].
Noh teaches a gapfill process substantially similar to that of Tang. Noh also states the process is applicable to all vapor deposition, including thermal ALD [0046; 0134] where the modifications related to thermal vs. plasma are known [0140].
Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to practice the method of Tang and include organic aminiosilane molecules as an inhibitor because Nakatani teaches organic aminiosilane molecules are suitable for this purpose and substitute the plasma process for a thermal process which requires a higher temperature but does not require the added complication of plasma generation.
Claims 6-7, 14:
Noh explicitly states deposition may take varying lengths of time. Deposition continues as long as deemed necessary to produce a film with necessary properties [0145]. Therefore, time amount of time the substrate is exposed to inhibitor material is a result effective variable, inclusive of the values from 2-20 seconds, and would have been obvious through routine optimization. Additionally, the film thickness varies from several angstroms to several hundred microns (Id.).
Claim(s) 9, 17, 20 is/are rejected under 35 U.S.C. 103 as being unpatentable over US 2016/0329238 to Tang in view of US 2022/0093388 to Nakatani in view of US 2022/0119939 to Noh in view of US 2007/0275166 to Thridandam.
Previously cited prior art is discussed above but does not teach the claimed aminosilane precursors. However, Thridandam teaches a method for forming a silica layer on a substrate by CVD using an organoaminosilane precursor, such as diisopropylaminosilane (abstract). CVD is meant to encompass ALD [0023]. The oxygen source is ozone [0024]. Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to practice the method of Tang and use the silicon precursors of Thridandam in order to form a silica layer. Thridandam demonstrates that these silicon precursors are suitable for the formation of a silica layer in vapor deposition processes such as ALD.
Response to Arguments
Applicant's arguments filed 1/23/26 have been fully considered but they are not persuasive.
Applicant’s arguments regarding the specific surface chemistry are well taken, but ultimately not persuasive because the points argued are not found in the claims. For example, although thermal ALD has been amended into the independent claims, the thermal ALD process is recited in such a way that does not include any thermal ALD steps, such as specific temperatures etc. There are also no limitations directed to Applicant’s explanation of the ramifications of a thermal process such as physisorbed species and species removal. In the absence of any specific requirements placed on the generically and broadly claimed thermal ALD process, the examiner is relying on the prior art references broadly teaching it would have been obvious to substitute thermal schemes and plasma schemes, where the specific changes resulting from this modification would have been known and obvious to one of ordinary skill in the art.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to ALEX A ROLLAND whose telephone number is (571)270-5355. The examiner can normally be reached M-F 10-6:30.
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/ALEX A ROLLAND/Primary Examiner, Art Unit 1759