Prosecution Insights
Last updated: October 26, 2026
Application No. 18/353,863

ELECTRONIC COMPONENTS WITH IMPROVED INSULATION, ELECTRONIC PACKAGES INCORPORATING SUCH ELECTRONIC COMPONENTS

Non-Final OA §102§112
Filed
Jul 17, 2023
Priority
Jul 18, 2022 — CN 202210843838.1
Examiner
MELLINGER, CORBYN DAVID
Art Unit
2899
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Stats Chippac Pte. Ltd.
OA Round
1 (Non-Final)
78%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
99%
With Interview

Examiner Intelligence

Grants 78% — above average
78%
Career Allowance Rate
29 granted / 37 resolved
+10.4% vs TC avg
Strong +40% interview lift
Without
With
+40.0%
Interview Lift
resolved cases with interview
Typical timeline
3y 3m
Avg Prosecution
13 currently pending
Career history
67
Total Applications
across all art units

Statute-Specific Performance

§103
45.5%
+5.5% vs TC avg
§102
26.4%
-13.6% vs TC avg
§112
27.6%
-12.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 37 resolved cases

Office Action

§102 §112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Claims 1-10, 15, and 17 are withdrawn from further consideration pursuant to 37 CFR 1.142(b), as being drawn to a nonelected product (claims 1-10) and species (claims 15, 17), there being no allowable generic or linking claim. Applicant timely traversed the restriction (election) requirement in the reply filed on 10 November 2025. Because applicant did not distinctly and specifically point out the supposed errors in the restriction requirement, the election has been treated as an election without traverse (MPEP § 818.01(a)). Drawings Figure 1 should be designated by a legend such as --Prior Art-- because only that which is old is illustrated. See MPEP § 608.02(g). Corrected drawings in compliance with 37 CFR 1.121(d) are required in reply to the Office action to avoid abandonment of the application. The replacement sheet(s) should be labeled “Replacement Sheet” in the page header (as per 37 CFR 1.84(c)) so as not to obstruct any portion of the drawing figures. If the changes are not accepted by the examiner, the applicant will be notified and informed of any required corrective action in the next Office action. The objection to the drawings will not be held in abeyance. Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claims 11, 13, and 16 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. Claim 11 recites a raw electronic component having “five non-bottom sides” in line 3, and later recites “the five non-mounting faces of the electronic component” in line 6. There is insufficient antecedent basis for the limitation recited in line 6. Examiner is interpreting the five non-bottom sides and five non-mounting faces to be referring to the same feature in the claims. Claims 13 and 16 each contain “wherein forming an insulating layer comprises…”. It is unclear whether this is the same as the insulating layer recited in claim 11. Examiner is interpreting the insulating layer recited in claims 13 and 16 to be the same as that recited in claim 11. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claim(s) 11-14 and 16 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by DE 102011083419 (Schindler et al). For convenience examiner makes reference to a translation of Schindler provided by Espacenet and included in this office action. As to Claim 11, Schindler teaches a method for making an electronic component, comprising: providing a raw electronic component (Schindler Fig 6, 60), wherein the raw electronic component is substantially cuboid-shaped with a bottom side and five non-bottom sides (60 shown in cross-section and is reasonably being interpreted as being cuboid shaped); attaching the raw electronic component onto a support surface (60 attached to 14), wherein the bottom side of the raw electronic component is in contact with the support surface (bottom of 60 in view of Fig 6 in contact with 14); and forming an insulating layer on the five non-mounting faces of the electronic component (insulating layer 16 formed, for example, by a dipping process ¶0112). As to Claim 12, Schindler teaches the method of claim 11, wherein the raw electronic component is a passive component (60 may be a resistor ¶0088) As to Claim 13, Schindler teaches the method of claim 11, wherein forming an insulating layer comprises: dipping the raw electronic component into a dipping tank containing an insulating material (16 formed by a dipping process ¶0112) As to Claim 14, Schindler teaches the method of claim 12, wherein the support surface covers all conductive structures on the bottom side of the raw electronic component (14 covers bottom side of 60, which necessarily includes all conductive structures on the bottom side of 60). As to Claim 16, Schindler teaches the method of claim 12, wherein forming an insulating layer comprises: dipping the raw electronic component into a dipping tank containing an insulating material (16 formed by a dipping process ¶0112) Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. US 20220173005 (Li) discloses a device having similar structure to that claimed by applicant, but does not explicitly teach the molding compound being formed by a dipping process. US 20190348325 (Obata) discloses a device similar to that of applicant and the components being dipped in a solution to form an insulating layer thereon. Any inquiry concerning this communication or earlier communications from the examiner should be directed to Corbyn D Mellinger whose telephone number is (703)756-5683. The examiner can normally be reached M-F 8-5 Eastern. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Zandra Smith can be reached at 571-272-2429. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /Corbyn D Mellinger/Examiner, Art Unit 2899 /EVAN G CLINTON/Primary Examiner, Art Unit 2899
Read full office action

Prosecution Timeline

Jul 17, 2023
Application Filed
Dec 10, 2025
Non-Final Rejection mailed — §102, §112
Mar 09, 2026
Response Filed

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
78%
Grant Probability
99%
With Interview (+40.0%)
3y 3m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 37 resolved cases by this examiner. Grant probability derived from career allowance rate.

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