Technology area: Semiconductors, Circuits & Optics
17 pending office actions • 7 art units • 15 examiners • 0 of 17 (0%) have an AI response strategy ready • 50 patents granted in the last 365 days
Stats Chippac Pte. Ltd. has 19 pending office actions in Semiconductors, Circuits & Optics. The matters involve 17 distinct examiners across 9 distinct art units, showing broad examiner dispersion with some technical-unit grouping.
MALSAWMA, LALRINFAMKIM HMAR is the busiest identified examiner, with 2 pending matters. Counsel may use that cluster for focused review while maintaining separate strategies for the other examiner assignments.
Based on the USPTO statutory response window for each pending office action. 2 of the docket's apps have a known mailing date; the rest are excluded from the tile counts.
Difficulty is derived from the rejection statutes on the most recent pending office action. §101-driven and multi-statute cases are graded Hard; §112-only and obviousness-type double-patenting cases are graded Easy; everything else is Medium. "Unknown" means we have not yet parsed a statute for that office action.
| Bucket | Cases |
|---|---|
| §103 only | 6 (35%) |
| §112 only | 1 (6%) |
| Multi-statute (no §101) | 10 (59%) |
How the docket's pending cases split across USPTO tech-center bands.
Manual office-action response work runs about 10 hours per case. The time-saved bands below show what IP Author's prosecution pipeline typically delivers — a conservative 20% on the low end, 35% in the middle, 50% on the high end.
| Examiner | Apps on this docket | Allow rate | Interview lift |
|---|---|---|---|
| MALSAWMA, LALRINFAMKIM HMAR | 2 | 90.4% | +8.1% |
| MCCUTCHEON, COLIN RUSSELL | 2 | 87.9% | +20.6% |
| STONER, KILEY SHAWN | 1 | 80.8% | +15.4% |
| STARK, JARRETT J | 1 | 70.4% | +11.0% |
| SENGDARA, VONGSAVANH | 1 | 72.3% | +18.4% |
| VU, DAVID | 1 | 77.3% | +18.0% |
| HOQUE, MOHAMMAD M | 1 | 85.3% | +9.3% |
| HARBOTTLE, CHARLOTTE ELIZABETH | 1 | 100.0% | +0.0% |
| THROCKMORTON, ROBERT EMIL | 1 | 100.0% | +0.0% |
| TRAN, DZUNG | 1 | 83.7% | +5.6% |
Cases in front of an examiner with an allow rate of 80%+ where the difficulty is Easy or Medium. The top 4 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 18661773 | ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME | HOQUE, MOHAMMAD M | — |
| 18638733 | SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE | TRAN, DZUNG | — |
| 18605841 | INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME | MALSAWMA, LALRINFAMKIM HMAR | — |
| 17817089 | Semiconductor Device and Method of Forming Hybrid Substrate with IPD Over Active Semiconductor Wafer | MCCUTCHEON, COLIN RUSSELL | — |
Multi-statute / §101-driven matters, or cases in front of an examiner with an allow rate under 30%. The top 8 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 19452282 | SELECTIVE STENCIL MASK AND A STENCIL PRINTING METHOD | STONER, KILEY SHAWN | — |
| 18749657 | SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME | STARK, JARRETT J | — |
| 18740630 | SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS | SENGDARA, VONGSAVANH | — |
| 18670342 | Semiconductor Device and Method of Making Using Shape-Memory Alloy Structures | VU, DAVID | — |
| 18655254 | ELECTRONIC PACKAGE AND A PACKAGING METHOD | HARBOTTLE, CHARLOTTE ELIZABETH | — |
| 18646903 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | THROCKMORTON, ROBERT EMIL | — |
| 18605842 | PARTIALLY SHIELDED SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | MALSAWMA, LALRINFAMKIM HMAR | — |
| 18395626 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | NGUYEN, SOPHIA T | — |
Cases in front of an examiner whose interview lift is 10 percentage points or more — i.e. interviewed cases historically resolve more favorably than non-interviewed ones. The top 6 ordered by deadline are shown.
| App # | Title | Examiner | Due in |
|---|---|---|---|
| 19452282 | SELECTIVE STENCIL MASK AND A STENCIL PRINTING METHOD | STONER, KILEY SHAWN | — |
| 18749657 | SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME | STARK, JARRETT J | — |
| 18740630 | SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS | SENGDARA, VONGSAVANH | — |
| 18670342 | Semiconductor Device and Method of Making Using Shape-Memory Alloy Structures | VU, DAVID | — |
| 18462612 | Semiconductor Device and Method of Forming FOWLP with Pre-Molded Embedded Discrete Electrical Component | MCCUTCHEON, COLIN RUSSELL | — |
| 17817089 | Semiconductor Device and Method of Forming Hybrid Substrate with IPD Over Active Semiconductor Wafer | MCCUTCHEON, COLIN RUSSELL | — |
| Art Unit | Apps |
|---|---|
| 2893 | 4 |
| 2818 | 4 |
| 2892 | 4 |
| 2899 | 2 |
| 1735 | 1 |
| 2898 | 1 |
| 2817 | 1 |
| App # | Title | Examiner | Art Unit | Statutes | Status | Due in | AI | Filed |
|---|---|---|---|---|---|---|---|---|
| 19452282 | SELECTIVE STENCIL MASK AND A STENCIL PRINTING METHOD | STONER, KILEY SHAWN | 1735 | §102§103§112 | Non-Final OA | — | Pending | Jan 17, 2026 |
| 18749657 | SEMICONDUCTOR PACAKGE AND METHOD FOR FORMING THE SAME | STARK, JARRETT J | 2898 | §103§112 | Non-Final OA | — | Pending | Jun 21, 2024 |
| 18740630 | SEMICONDUCTOR PACKAGES WITH MULTIPLE TYPES OF CONDUCTIVE COMPONENTS | SENGDARA, VONGSAVANH | 2893 | §102§103 | Non-Final OA | — | Pending | Jun 12, 2024 |
| 18670342 | Semiconductor Device and Method of Making Using Shape-Memory Alloy Structures | VU, DAVID | 2818 | §102§103 | Final Rejection | — | Pending | May 21, 2024 |
| 18661773 | ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME | HOQUE, MOHAMMAD M | 2817 | §112 | Non-Final OA | — | Pending | May 13, 2024 |
| 18655254 | ELECTRONIC PACKAGE AND A PACKAGING METHOD | HARBOTTLE, CHARLOTTE ELIZABETH | 2818 | §103§112 | Non-Final OA | — | Pending | May 04, 2024 |
| 18646903 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | THROCKMORTON, ROBERT EMIL | 2818 | §102§103 | Non-Final OA | — | Pending | Apr 26, 2024 |
| 18638733 | SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE | TRAN, DZUNG | 2893 | §103 | Non-Final OA | — | Pending | Apr 18, 2024 |
| 18605842 | PARTIALLY SHIELDED SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | MALSAWMA, LALRINFAMKIM HMAR | 2892 | §102§103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18605841 | INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME | MALSAWMA, LALRINFAMKIM HMAR | 2892 | §103 | Non-Final OA | — | Pending | Mar 15, 2024 |
| 18395626 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | NGUYEN, SOPHIA T | 2893 | §103§112 | Final Rejection | — | Pending | Dec 25, 2023 |
| 18462612 | Semiconductor Device and Method of Forming FOWLP with Pre-Molded Embedded Discrete Electrical Component | MCCUTCHEON, COLIN RUSSELL | 2892 | §102§112 | Final Rejection | — | Pending | Sep 07, 2023 |
| 18460621 | SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME | FAN, SU JYA | 2818 | §103 | Final Rejection | — | Pending | Sep 04, 2023 |
| 18459014 | SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME | KUPP, BENJAMIN MICHAEL | 2893 | §103 | Final Rejection | 7d | Pending | Aug 30, 2023 |
| 18447315 | SEMICONDUCTOR DEVICES WITH PYRAMIDAL SHIELDING AND METHOD FOR MAKING THE SAME | BULLARD-CONNOR, GENEVIEVE GRACE | 2899 | §103 | Final Rejection | 9d | Pending | Aug 10, 2023 |
| 18353863 | ELECTRONIC COMPONENTS WITH IMPROVED INSULATION, ELECTRONIC PACKAGES INCORPORATING SUCH ELECTRONIC COMPONENTS | MELLINGER, CORBYN DAVID | 2899 | §102§112 | Non-Final OA | — | Pending | Jul 17, 2023 |
| 17817089 | Semiconductor Device and Method of Forming Hybrid Substrate with IPD Over Active Semiconductor Wafer | MCCUTCHEON, COLIN RUSSELL | 2892 | §103 | Final Rejection | — | Pending | Aug 03, 2022 |
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Start Free TrialStats Chippac Pte. Ltd. has 17 pending office actions as of October 2026, spread across 7 art units and 15 examiners.
Lalrinfamkim Hmar Malsawma has the most, with 2 of Stats Chippac Pte. Ltd.'s pending office actions.
Mostly Semiconductors, Circuits & Optics (USPTO Tech Center 2800), based on where its pending office actions are examined.