Prosecution Insights
Last updated: May 29, 2026
Application No. 18/354,325

THREE-DIMENSIONAL MEMORY DEVICES WITH LATERAL BLOCK ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME

Non-Final OA §102
Filed
Jul 18, 2023
Priority
Dec 09, 2022 — provisional 63/386,824
Examiner
DIAZ, JOSE R
Art Unit
2815
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Sandisk Technologies LLC
OA Round
1 (Non-Final)
87%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
94%
With Interview

Examiner Intelligence

Grants 87% — above average
87%
Career Allowance Rate
806 granted / 929 resolved
+18.8% vs TC avg
Moderate +8% lift
Without
With
+7.5%
Interview Lift
resolved cases with interview
Typical timeline
2y 4m
Avg Prosecution
22 currently pending
Career history
955
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
55.6%
+15.6% vs TC avg
§102
19.0%
-21.0% vs TC avg
§112
3.3%
-36.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 929 resolved cases

Office Action

§102
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Group I, claims 1-14, in the reply filed on December 12, 2025 is acknowledged. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-2 and 14 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Cui et al. (US 2020/0335518). Regarding claim 1, Cui discloses a three-dimensional memory device, comprising: an alternating stack of insulating layers (32) and composite layers (44/46) that alternate along a vertical direction [Figs. 13A-14, and 17A-18], wherein each of the composite layers comprises a combination of a dielectric connection plate (44) and a plurality of electrically conductive strips (46) that laterally extend along a first horizontal direction [Figs. 13A-14, and 17a-18], are laterally spaced apart along a second horizontal direction by backside trenches (79) that laterally extend along the first horizontal direction [Fig. 12 and 17A-18], and have a respective sidewall adjoined to a respective sidewall surface segment of the dielectric connection plate (44) [Figs. 12-13D and 17A-18], wherein end portions of the backside trenches (79) are laterally bounded by the dielectric connection plates (44) of the composite layers [Figs. 15 and 17A-18]; arrays of memory openings (49) vertically extending through the alternating stack [Figs. 4A-4B and 8A-9A], and ; memory opening fill structures (55) located in the memory openings, wherein each of the memory opening fill structures (55) comprises a vertical semiconductor channel (60) and a respective vertical stack of memory elements (50) located at levels of the electrically conductive strips [Figs. 9A-10A, 12 and 17A-18]; backside trench fill structures (76) located in the backside trenches and vertically extending at least from a first horizontal plane including bottommost surfaces of the alternating stacks and at least to a second horizontal plane including topmost surfaces of the alternating stacks [Figs. 16A-16B and 17A-18]; and dielectric etch stop structures (171) located within or outside a respective one of the backside trenches (79), wherein each of the dielectric etch stop structures comprises a respective pair of dielectric sidewalls that are located within a pair of lengthwise sidewalls of the respective one of the backside trenches (79), wherein the dielectric sidewalls of the dielectric etch stop structures (171) laterally extend along the first horizontal direction and vertically extend at least from the first horizontal plane and at least to the second horizontal plane [Figs. 17B and 18]. Regarding claim 2, Cui discloses wherein each of the electrically conductive strips (46) has a respective lateral extent along the second horizontal direction that is not greater than a lateral spacing between a pair of most proximal pair of the backside trenches (79) [Figs. 17B and 18]. Regarding claim 14, Cui discloses wherein the alternating stacks (32/44/46) are located in different memory blocks (100) which are electrically isolated from each other by the backside trenches (79) and the dielectric etch stop structures (171) 9Fig. 17B and 18]. Allowable Subject Matter Claims 3-13 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to JOSE R DIAZ whose telephone number is (571)272-1727. The examiner can normally be reached Monday-Friday. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Joshua Benitez can be reached at 571-270-1435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /Jose R Diaz/Primary Examiner, Art Unit 2815
Read full office action

Prosecution Timeline

Jul 18, 2023
Application Filed
Mar 11, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
87%
Grant Probability
94%
With Interview (+7.5%)
2y 4m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 929 resolved cases by this examiner. Grant probability derived from career allowance rate.

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