DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of Group I (claims 1-12) and Species A (Fig. 5, claims 1-8 and 12) in the reply filed on 4/24/26 is acknowledged.
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph:
The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention.
Claims 1-8, 12 is/are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
In claim 1, the phrase “continuous with the thermal pad” is unclear as to: integral one-piece; metallurgically joined; or merely touching?
The other claims are rejected as being dependent on claim 1.
Claim Rejections - 35 USC § 103
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
The factual inquiries for establishing a background for determining obviousness under 35 U.S.C. 103 are summarized as follows:
1. Determining the scope and contents of the prior art.
2. Ascertaining the differences between the prior art and the claims at issue.
3. Resolving the level of ordinary skill in the pertinent art.
4. Considering objective evidence present in the application indicating obviousness or nonobviousness.
This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention.
Claim(s) 1-8, 12 is/are, to the extent taught and understood, rejected under 35 U.S.C. 103 as being unpatentable over U.S. Patent Application Publication No. 2003/0062541 (Warner) in view of 2008/0157401 (Kim).
Warner discloses (at least Fig. 4)
1. An integrated circuit (“IC”) package, comprising:
a thermal pad 271 having a top surface and a bottom surface opposite the top surface;
a flange 272 extending transversely of and continuous with the thermal pad 271, the flange 272 having a surface continuous with the bottom surface of the thermal pad 271; and
a mold compound 243 through which the bottom surface of the thermal pad 271 and the surface of the flange 272 are exposed,
wherein:
the surface of the flange 272 is flush with a side surface of the mold compound 243.
Warner fails to disclose
the bottom surface of the thermal pad is flush with a bottom surface of the mold compound.
Kim teaches (Figs. 5, 11, 13)
An IC package comprising:
a thermal pad 534;
a flange (unlabeled angle portion of thermal pad 534, e.g., Figs. 1, 7, 8);
a molding compound 530, wherein
the bottom surface of the thermal pad 534 is flush with a bottom surface of the mold compound 530.
It would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention to provide a thermal pad having a bottom surface flush with a bottom surface of a mold compound in Warner. The motivation would be to provide improved thermal performance / heat conduction, improved electrical performance / increased ground signal connections, and improved electromagnetic interference protection as taught by Kim ([0055]).
Warner discloses
2. The IC package of claim 1, wherein the surface of the flange 272 is substantially perpendicular to the bottom surface.
Kim teaches (an obvious engineering design, see MPEP 2144.04)
3. The IC package of claim 1, wherein the surface of the flange (Figs. 1, 7, 8) is connected to the bottom surface by an arcuate surface portion.
Kim teaches
4. The IC package of claim 1, further comprising:
a plurality of leads 512 extending laterally outwardly of first and second lateral side edges of the thermal pad 534.
Kim teaches
5. The IC package of claim 4, further comprising:
a die 516 attached to the top surface of the thermal pad 534, the die 516 having electrical contacts connected to the plurality of leads 512.
Warner discloses
6. The IC package of claim 1, wherein the flange 272 extends a portion of a full width of the thermal pad 271.
Kim teaches
7. The IC package of claim 6, further comprising:
a first tie bar 510 (left) projected past the surface of the flange (Figs. 1, 7, 8); and
a second tie bar 510 (right) projected past the surface of the flange, wherein the flange is positioned between the first tie bar and the second tie bar.
It would have been obvious to a person of ordinary skill in the art before the effective filing date of the claimed invention to provide tie bars in Warner. The motivation would be they are well-known in the package art as taught by Kim ([0051]-[0055]). See MPEP 2144.03.
Kim teaches
8. The IC package of claim 7, wherein the first and second tie bars 510 are integrally formed with and extended along lateral sides of the thermal pad 534.
Warner discloses
12. The IC package of claim 1, wherein the flange 272 is a first flange (left),
a second flange 272 (right) extending transversely of and continuous with the thermal pad 271, wherein the second flange 272 has a second surface continuous with the bottom surface of the thermal pad 271, the second surface being exposed through the mold compound 243 and flush with a second side surface of the mold compound 243 opposite the side surface.
Conclusion
The prior art made of record and not relied upon is considered pertinent to applicant's disclosure.
U.S. Patent Application Publication Nos. 2023/0005880 (Poddar), 2007/0273023 (Zhao), U.S. Patent Nos. 7,833,840 (Ahn), 7,642,638 (Kuah) teach a molded IC package including a thermal pad and a flange.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to TERESA M ARROYO whose telephone number is (703)756-1576. The examiner can normally be reached Monday - Friday (8:30 A.M. E.T. - 5:00 P.M. E.T.).
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Sue Purvis can be reached at 571.272.1236. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/TERESA M. ARROYO/Primary Examiner, Art Unit 2893
Prosecution Insights