Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2826 2829 2893 2899
This examiner grants 72% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18533262 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18374718 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18196276 | SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18262932 | SEMICONDUCTOR DEVICE AND IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18042304 | SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING METHOD | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 17296193 | ORGANIC LIGHT-EMITTING DISPLAY PANEL AND DISPLAY DEVICE | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 17296234 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18316379 | RADIATION DETECTION ELEMENT, RADIATION DETECTION APPARATUS, X-RAY CT APPARATUS, AND MANUFACTURING METHOD OF RADIATION DETECTION ELEMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18411104 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., Ltd. |
| 18487734 | WINDOW AND DISPLAY DEVICE INCLUDING THE SAME | Final Rejection | SAMSUNG DISPLAY CO., LTD. |
| 18696886 | DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 18130582 | AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER | Non-Final OA | Intel Corporation |
| 18092012 | GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION | Non-Final OA | Intel Corporation |
| 18138506 | POWER MODULE | Non-Final OA | Delta Electronics, Inc. |
| 18359096 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18366111 | EXPOSED PAD INTEGRATED CIRCUIT PACKAGE | Non-Final OA | Texas Instruments Incorporated |
| 18314585 | ELECTRONIC DEVICE WITH IMPROVED LEADFRAME TRIMMING PROCESS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18070523 | OPEN CAVITY INTEGRATED CIRCUIT | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17988115 | INTEGRATED CIRCUIT PACKAGE WITH WIRE BOND | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17738521 | FINFET ISOLATION DEVICE AND METHOD | Non-Final OA | Micron Technology, Inc. |
| 18034591 | OPTICAL SENSOR USING FERROELECTRICS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
| 18421312 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18176445 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 17680409 | Method for Fabricating a Substrate with a Solder Stop Structure, Substrate with a Solder Stop Structure and Electronic Device | Final Rejection | Infineon Technologies AG |
| 18193847 | SEMICONDUCTOR PACKAGE HAVING WETTABLE FLANKS AND RELATED METHODS | Final Rejection | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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