Prosecution Insights
Last updated: April 19, 2026

Examiner: ARROYO, TERESA M

Tech Center 2800 • Art Units: 2826 2829 2893 2899

This examiner grants 72% of resolved cases

Performance Statistics

72.0%
Allow Rate
+4.0% vs TC avg
526
Total Applications
+23.5%
Interview Lift
1192
Avg Prosecution Days
Based on 489 resolved cases, 2023–2026

Rejection Statute Breakdown

0.1%
§101 Eligibility
18.6%
§102 Novelty
57.6%
§103 Obviousness
19.0%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18374718 SEMICONDUCTOR DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18196276 SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18314585 ELECTRONIC DEVICE WITH IMPROVED LEADFRAME TRIMMING PROCESS Non-Final OA TEXAS INSTRUMENTS INCORPORATED
18070523 OPEN CAVITY INTEGRATED CIRCUIT Non-Final OA TEXAS INSTRUMENTS INCORPORATED
18050458 INSULATION FOR MAGNETIC-MOLDING COMPOUND (MMC) MODULE Non-Final OA TEXAS INSTRUMENTS INCORPORATED
17682351 SILVER- AND GOLD-PLATED CONDUCTIVE MEMBERS Non-Final OA TEXAS INSTRUMENTS INCORPORATED
17682194 LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION Final Rejection Texas Instruments Incorporated
17508009 IC PACKAGE WITH INTERFACE REGION Non-Final OA TEXAS INSTRUMENTS INCORPORATED
18359096 SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Non-Final OA Mitsubishi Electric Corporation
18487734 WINDOW AND DISPLAY DEVICE INCLUDING THE SAME Non-Final OA SAMSUNG DISPLAY CO., LTD.
17975422 SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD Final Rejection FUJI ELECTRIC CO., LTD.
18317632 SEMICONDUCTOR DEVICE Non-Final OA ROHM CO., LTD.
18132351 ELECTRONIC DEVICE Non-Final OA Advanced Semiconductor Engineering, Inc.
18193598 PACKAGING SUBSTRATE, GRID ARRAY PACKAGE, AND PREPARATION METHOD THEREFOR Non-Final OA Diodes Incorporated
18217800 ELECTRONIC DEVICE INCLUDING A DIE ARRANGED BETWEEN FIRST AND SECOND SUBSTRATES Non-Final OA Microchip Technology Caldicot Limited
18005177 APPARATUS AND METHODS FOR COOLING OF AN INTEGRATED CIRCUIT Non-Final OA SOCIÉTÉ DE COMMERCIALISATION DES PRODUITS DE LA RECHERCHE APPLIQUÉE SOCPRA SCIENCES ET GÉNIE S.E.C.

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