Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2826 2829 2893 2899
This examiner grants 72% of resolved cases
Teresa M. Arroyo is an examiner in Tech Center 2800 and Art Unit 2826, with 501 resolved cases. She maintains an allowance rate of 72.1 percent. This 72.1 percent rate indicates a generally positive outlook for applicants in this technology area. With 501 resolved cases, the data provides a stable and reliable expectation for practitioners navigating the prosecution process.
The interview lift is 22.9 percent, suggesting that interviews are an effective tool for securing an allowance. This 22.9 percent lift highlights the value of direct communication in resolving outstanding issues. The median days to allowance is 1113, which is a standard timeframe for this volume of cases. Practitioners should use this 1113-day median to manage client expectations regarding the total duration of prosecution. The combination of a high allowance rate and a significant interview lift makes Art Unit 2826 a relatively favorable environment for patent acquisition.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18755040 | IMAGE SENSOR | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18419907 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18196276 | SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18417997 | CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18487734 | WINDOW AND DISPLAY DEVICE INCLUDING THE SAME | Final Rejection | SAMSUNG DISPLAY CO., LTD. |
| 17296234 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18316379 | RADIATION DETECTION ELEMENT, RADIATION DETECTION APPARATUS, X-RAY CT APPARATUS, AND MANUFACTURING METHOD OF RADIATION DETECTION ELEMENT | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18130582 | AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTERPOSER | Non-Final OA | Intel Corporation |
| 18617086 | INTERPOSER FOR BACKSIDE POWER DELIVERY NETWORK | Non-Final OA | Adeia Semiconductor Bonding Technologies, Inc. |
| 18359096 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18262932 | SEMICONDUCTOR DEVICE AND IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18696886 | DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 17902275 | BACKSIDE POWER DELIVER NETWORK CONNECTION THROUGH DUMMY GATES | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18176445 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 18910671 | ELECTRONIC DEVICE WITH GALLIUM NITRIDE TRANSISTORS AND METHOD OF MAKING SAME | Non-Final OA | Texas Instruments Incorporated |
| 18314585 | ELECTRONIC DEVICE WITH IMPROVED LEADFRAME TRIMMING PROCESS | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18070523 | OPEN CAVITY INTEGRATED CIRCUIT | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17988115 | INTEGRATED CIRCUIT PACKAGE WITH WIRE BOND | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18050458 | INSULATION FOR MAGNETIC-MOLDING COMPOUND (MMC) MODULE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 17508009 | IC PACKAGE WITH INTERFACE REGION | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18420538 | STAIRCASE LANDING PADS VIA RIVETS | Non-Final OA | Micron Technology, Inc. |
| 17738521 | FINFET ISOLATION DEVICE AND METHOD | Non-Final OA | Micron Technology, Inc. |
| 18421312 | SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18440331 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18034591 | OPTICAL SENSOR USING FERROELECTRICS AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
| 18254310 | SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18317632 | SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 17680409 | Method for Fabricating a Substrate with a Solder Stop Structure, Substrate with a Solder Stop Structure and Electronic Device | Non-Final OA | Infineon Technologies AG |
| 18132351 | ELECTRONIC DEVICE | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 18283713 | POWER MODULE AND METHOD FOR PRODUCING SAME | Non-Final OA | AMOSENSE CO., LTD. |
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