Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2826 2829 2893 2899
This examiner grants 72% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18374718 | SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18366111 | EXPOSED PAD INTEGRATED CIRCUIT PACKAGE | Non-Final OA | Texas Instruments Incorporated |
| 18314585 | ELECTRONIC DEVICE WITH IMPROVED LEADFRAME TRIMMING PROCESS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18050458 | INSULATION FOR MAGNETIC-MOLDING COMPOUND (MMC) MODULE | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 17682194 | LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION | Final Rejection | Texas Instruments Incorporated |
| 17508009 | IC PACKAGE WITH INTERFACE REGION | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18359096 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18487734 | WINDOW AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18455123 | Chip Package Structure and Electronic Device | Non-Final OA | Huawei Technologies Co., Ltd. |
| 18141497 | Semiconductor Package Comprising a Combined Power and Logic Substrate | Non-Final OA | Infineon Technologies AG |
| 18204758 | WIRING SUBSTRATE AND DISPLAY DEVICE | Final Rejection | Sharp Display Technology Corporation |
| 18363367 | SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | Non-Final OA | ROHM CO., LTD. |
| 18358815 | SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18254310 | SEMICONDUCTOR DEVICE | Final Rejection | ROHM CO., LTD. |
| 18317632 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 17979279 | SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING | Final Rejection | NEXPERIA B.V. |
| 18193598 | PACKAGING SUBSTRATE, GRID ARRAY PACKAGE, AND PREPARATION METHOD THEREFOR | Non-Final OA | Diodes Incorporated |
| 18132351 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 17811804 | LEADLESS SEMICONDUCTOR PACKAGE WITH DE-METALLIZED POROUS STRUCTURES AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | STMICROELECTRONICS, INC. |
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