Prosecution Insights
Last updated: April 19, 2026
Application No. 18/374,481

CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS

Non-Final OA §102
Filed
Sep 28, 2023
Examiner
EGOAVIL, GUILLERMO J
Art Unit
2847
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Seiko Epson Corporation
OA Round
1 (Non-Final)
90%
Grant Probability
Favorable
1-2
OA Rounds
2y 3m
To Grant
98%
With Interview

Examiner Intelligence

Grants 90% — above average
90%
Career Allow Rate
574 granted / 640 resolved
+21.7% vs TC avg
Moderate +8% lift
Without
With
+8.5%
Interview Lift
resolved cases with interview
Typical timeline
2y 3m
Avg Prosecution
24 currently pending
Career history
664
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
44.0%
+4.0% vs TC avg
§102
27.5%
-12.5% vs TC avg
§112
19.8%
-20.2% vs TC avg
Black line = Tech Center average estimate • Based on career data from 640 resolved cases

Office Action

§102
DETAILED ACTION This Office Action is in response to Restriction/Elected, filed on 12/04/2025, on the application filed on 09/28/2023. Claims 1-4, 7-8, 11-12, and 15 are presented for examination consideration. Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Claims 5-6, 9-10, and 13-14 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to nonelected Species 2-4. There being no allowable generic or linking claims. Election was made without traverse in the reply filed on 12/04/2025. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention. Claims 1, 2, 3, 7, 8, and 15 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Ishigami et al. (JP2022127586A and Ishigami hereinafter, cited in the 10/11/2024 IDS and the 09/10/2024 Japanese Office Action). Regarding claim 1, Ishigami discloses a circuit board unit (Fig. 11C and ¶[0079-0080] from Espacenet Translation shows and indicates circuit board unit of Fig. 11C {fourth embodiment structure of Fig. 11C}) comprising: a first circuit board having a first ground layer (items 101C, 120C of Fig. 11C and ¶[0079-0082_0085-0086 & 0088-0089] from Espacenet Translation shows and indicates first circuit board 101C {rigid wiring board 101C, indicated in ¶[0079-0082_0086 & 0089]} having first ground layer 120C {ground line 120C, indicated in ¶[0082_0085-0086 & 0088]}); a second circuit board having a second ground layer and arranged so as to be opposed to the first circuit board (items 200C, 210C of Fig. 11C and ¶[0079-0080_0083-0084_0086 & 0089] from Espacenet Translation shows and indicates second circuit board 200C {flexible wiring board 200C, indicated in ¶[0079-0080_0083-0084_0086 & 0089]} having second ground layer 210C {shielding member 210C, indicated in ¶[0083-0084 & 0086]} and arranged so as to be opposed to first circuit board 101C); a connector unit having a first connector attached to the first circuit board, and a second connector attached to the second circuit board and coupled to the first connector (item 901C, 111C, 212C of Fig. 11C and ¶[0079-0088] from Espacenet Translation shows and indicates where connector unit 901C {signal terminals 901C, indicated in ¶[0085 & 0088]} has first connector 111C_901C {connector formed by signal terminals 901C connected to signal lines 111C, indicated in ¶[0081-0082_0085 & 0088]} attached to first circuit board 101C; and where connector unit 901C has second connector 212C_901C {connector formed by signal terminals 901C connected to signal lines 212C, indicated in ¶[0083-0087]} attached to second circuit board 200C and coupled to first connector 111C_901C); and a metal member arranged between the first circuit board and the second circuit board, and configured to electrically couple the first ground layer and the second ground layer to each other, wherein the metal member is arranged so as to be adjacent to the connector unit (item 902C of Fig. 11C and ¶[0086-0087 & 0089] from Espacenet Translation shows and indicates metal member 902C {metal connection members 902C} arranged between first circuit board 101C and second circuit board 200C; where metal member 902C is configured to electrically couple first ground layer 120C and second ground layer 210C to each other; and where metal member 902C is arranged so as to be adjacent to connector unit 901C). Regarding claim 2, Ishigami discloses a circuit board unit, wherein a first distance between the metal member and the connector unit adjacent to each other is shorter than a second distance between the first circuit board and the second circuit board opposed to each other (Fig. 11C and ¶[0079-0089] from Espacenet Translation shows where the first distance between metal member 902C and connector unit 901C adjacent to each other is shorter than a second distance between first circuit board 101C and second circuit board 200C opposed to each other). Regarding claim 3, Ishigami discloses a circuit board unit, wherein the connector unit has a shape elongated in a predetermined direction when viewed in a coupling direction in which the first connector and the second connector are coupled to each other, and the metal member is arranged so as to be adjacent in the predetermined direction to the connector unit (Fig. 11C and ¶[0079-0089] from Espacenet Translation shows where connector unit 901C has a shape elongated in a predetermined direction when viewed in a coupling direction in which first connector 111C_901C and second connector 212C_901C are coupled to each other; and where and metal member 902C is arranged so as to be adjacent in the predetermined direction to connector unit 901C). Regarding claim 7, Ishigami discloses a circuit board unit, wherein the metal member includes a first coupling surface extending along the first ground layer, and electrically coupled to the first ground layer, and a second coupling surface extending along the second ground layer, and electrically coupled to the second ground layer (Fig. 11C and ¶[0082-0089] from Espacenet Translation shows where metal member 902C includes first coupling surface 902C-surface-120C {surface between metal connection members 902C and ground line 120C} extending along the first ground layer, and electrically coupled to first ground layer 120C; and where second coupling surface 902C-surface-210C {surface between metal connection members 902C and shielding member 210C} extending along second ground layer 210C, and electrically coupled to second ground layer 210C). Regarding claim 8, Ishigami discloses a circuit board unit, wherein the metal member includes a main body part extending in a coupling direction in which the first connector and the second connector are coupled to each other, a first coupling part having the first coupling surface, and protruding from one end of the main body part in the coupling direction, and a second coupling part having the second coupling surface, and protruding from another end of the main body part in the coupling direction along a direction different from a direction in which the first coupling part protrudes, and the main body part is shaped like a plate, and has a side surface arranged so as to be opposed to the connector unit (Fig. 11C and ¶[0082-0089] from Espacenet Translation shows where metal member 902C includes main body part 902C-body {body of metal connection members 902C} extending in the coupling direction in which first connector 111C_901C and second connector 212C_901C are coupled to each other; and where first coupling part 902C_120C {coupling established between metal connection members 902C to ground line 120C} having first coupling surface 902C-surface-120C, and protruding from one end of main body part 902C-body in the coupling direction; and where second coupling part 902C_210C {coupling established between metal connection members 902C to shielding member 210C} having second coupling surface 902C-surface-210C, and protruding from another end of main body part 902C-body in the coupling direction along the direction different from a direction in which first coupling part 902C_120C protrudes; and where main body part 902C-body is shaped like a cylindrical plate, and has the side surface arranged so as to be opposed to connector unit 901C). Regarding claim 15, Ishigami discloses an electronic apparatus comprising: the circuit board unit according to claim 1 (Fig. 11C and Title & claims 1 & 19 from Espacenet Translation indicates where an electronic apparatus is comprised of circuit board unit of Fig. 11C, according to claim 1). Allowable Subject Matter Claims 4 and 11-12 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: Regarding claim 4, the primary reason for allowance is due to a circuit board unit, wherein the first circuit board is provided with a plurality of signal lines arranged side by side in the predetermined direction, the plurality of signal lines being each electrically coupled to the first connector, the plurality of signal lines includes a first signal line and a second signal line through which a signal higher in frequency than a signal flowing through the first signal line, and the second signal line is arranged at a position closer to the metal member than the first signal line in the predetermined direction. Regarding claim 11, the primary reason for allowance is due to a circuit board unit, wherein the first circuit board has a pair of the first ground layers disposed as respective layers different from each other, and the pair of first ground layers are electrically coupled to each other. Regarding claim 12, the primary reason for allowance is due to dependency on claim 11. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to GUILLERMO J EGOAVIL whose telephone number is (571)270-1325. The examiner can normally be reached Mon-Fri 8:00-5:00. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Thompson can be reached at (571) 272-2342. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /GUILLERMO J EGOAVIL/Examiner, Art Unit 2847
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Prosecution Timeline

Sep 28, 2023
Application Filed
Jan 29, 2026
Non-Final Rejection — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12592327
WIRING MEMBER
2y 5m to grant Granted Mar 31, 2026
Patent 12588149
GDDR MEMORY EXPANDER USING CMT CONNECTOR
2y 5m to grant Granted Mar 24, 2026
Patent 12580374
HEAT DISSIPATION BOLT
2y 5m to grant Granted Mar 17, 2026
Patent 12575423
WIRING BOARD AND SEMICONDUCTOR PACKAGE
2y 5m to grant Granted Mar 10, 2026
Patent 12575028
WIRING CIRCUIT BOARD
2y 5m to grant Granted Mar 10, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
90%
Grant Probability
98%
With Interview (+8.5%)
2y 3m
Median Time to Grant
Low
PTA Risk
Based on 640 resolved cases by this examiner. Grant probability derived from career allow rate.

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