Prosecution Insights
Prosecution Insights
Tech Center 3700 • Art Units: 2847 2896 2897 3729
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18117805 | Loading Pads for Impedance Management in Printed Circuit Board | Non-Final OA | Google LLC |
| 18358723 | CONDUCTIVE CABLE CONFIGURATION FOR USE IN A WELLBORE | Non-Final OA | Halliburton Energy Services, Inc. |
| 18566818 | Pouch-Shaped Battery Cell Including Flexible Printed Circuit Board | Non-Final OA | LG Energy Solution, Ltd. |
| 18741388 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE | Non-Final OA | TOPPAN Holdings Inc |
| 18029023 | WIRING BASE AND ELECTRONIC DEVICE | Final Rejection | KYOCERA Corporation |
| 18928575 | ENDOSCOPE, GROUNDING METHOD AND METHOD FOR GROUNDING DISTAL END PORTION OF ENDOSCOPE | Non-Final OA | OLYMPUS CORPORATION |
| 18960290 | MULTILAYER SUBSTRATE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18800548 | LAYERED CERAMIC ELECTRONIC COMPONENT MOUNTING STRUCTURE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18522110 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18903469 | ELECTRONIC PACKAGE AND CARRIER STRUCTURE THEREOF | Non-Final OA | SILICONWARE PRECISION INDUSTRIES CO., LTD. |
| 18323856 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | Non-Final OA | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
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