Prosecution Insights
Last updated: April 17, 2026
Application No. 18/384,052

Monatomic Single-Entity Baseplate Structure Employing a Thermoplastic Polyimide Bondline Between a Silicon Substrate and a Metallic Heat Sink Having Mismatched Coefficients of Thermal Expansio

Non-Final OA §102
Filed
Oct 26, 2023
Examiner
STEVENSON, ANDRE C
Art Unit
2899
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
unknown
OA Round
1 (Non-Final)
90%
Grant Probability
Favorable
1-2
OA Rounds
2y 5m
To Grant
96%
With Interview

Examiner Intelligence

Grants 90% — above average
90%
Career Allow Rate
764 granted / 852 resolved
+21.7% vs TC avg
Moderate +7% lift
Without
With
+6.8%
Interview Lift
resolved cases with interview
Typical timeline
2y 5m
Avg Prosecution
43 currently pending
Career history
895
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
57.8%
+17.8% vs TC avg
§102
26.8%
-13.2% vs TC avg
§112
8.7%
-31.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 852 resolved cases

Office Action

§102
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claim(s) #1-3 are rejected under 35 U.S.C. 102(a)(2) as being unpatentable by Fraivillig (U.S. Pub. No, 2017/0321096, hereinafter referred to as "Fraivillig". Fraivillig shows, with respect to claim #1, a silicon/metal monatomic baseplate heat sink structure for mounting semiconductors in electronic circuits comprising in combination (paragraph 0040): a top sheet having an upper surface (Fig. #Ex1, item TS1) and an under surface (Fig. #Ex1, item BS1), said top sheet comprising a silicon sheet of a size sufficient to attach to, mount, and support a plurality of electrical circuit semiconductors; and B. a bottom sheet having an upper surface (Fig. #Ex1, item TS2) and an under surface (Fig. #Ex1, item BS2) comprising a metallic sheet, said bottom sheet upper surface adhesively attached, by an ultra-thin robust bond line of thermoplastic polyimide (Fig. #Ex1, item AC1) (TPI) (paragraph 0024), to said top sheet under surface providing a heat sink for said top sheet and any semiconductors mounted thereon (paragraph 0003-0004). [AltContent: arrow][AltContent: textbox (Bottom Sheet, Bottom Side; BS1)][AltContent: arrow][AltContent: textbox (Bottom Sheet, Top Side; TS2)][AltContent: arrow][AltContent: arrow][AltContent: textbox (Adhesive Compound; AC1)][AltContent: arrow][AltContent: textbox (Ex1)][AltContent: textbox (Top Sheet, Bottom Side; BS2)][AltContent: textbox (Top Sheet, Top Side; TS1)][AltContent: arrow] PNG media_image1.png 708 795 media_image1.png Greyscale Fraivillig shows, with respect to claim #2, a structure wherein said bottom sheet is composed of aluminum (paragraph 0003-0004, 0022, 0030). Fraivillig shows, with respect to claim #3, a structure a plurality of semiconductors are mounted (paragraph 0004-0005) on said top sheet upper surface by a silicon/silicon attachment layer (paragraph 0022, 0060-0061). EXAMINATION NOTE The rejections above rely on the references for all the teachings expressed in the text of the references and/or one of ordinary skill in the art would have reasonably understood or implied from the texts of the references. To emphasize certain aspects of the prior art, only specific portions of the texts have been pointed out. Each reference as a whole should be reviewed in responding to the rejection, since other sections of the same reference and/or various combinations of the cited references may be relied on in future rejections in view of amendments. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to Andre’ Stevenson whose telephone number is (571) 272 1683 (Email Address, Andre.Stevenson@USPTO.GOV). The examiner can normally be reached on Monday through Friday from 7:30 am to 4:30 pm. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Zandra Smith can be reached on 571-272 2429. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative or access to the automated information system, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /Andre’ Stevenson Sr./ Art Unit 2899 12/24/2025 /Brent A. Fairbanks/ Supervisory Patent Examiner, Art Unit 2899
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Prosecution Timeline

Oct 26, 2023
Application Filed
Jan 06, 2026
Non-Final Rejection — §102 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
90%
Grant Probability
96%
With Interview (+6.8%)
2y 5m
Median Time to Grant
Low
PTA Risk
Based on 852 resolved cases by this examiner. Grant probability derived from career allow rate.

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