Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2816 2817 2899
This examiner grants 90% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18660507 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18622131 | WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18700286 | Organic Light Emitting Device and Display Apparatus | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18658448 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18640300 | DISPLAY DEVICE AND MOBILE ELECTRONIC DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18228122 | SUBSTRATE PROCESSING METHOD | Final Rejection | ASM IP Holding B.V. |
| 18199018 | SUBSTRATE PROCESSING METHOD | Final Rejection | ASM IP Holding B.V. |
| 18344583 | METHOD FOR FABRICATING ELECTRODE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | SK hynix Inc. |
| 18596580 | METHODS OF FORMING MICROELECTRONIC DEVICES WITH NITROGEN-RICH INSULATIVE STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 18743574 | Air-Replaced Spacer for Self-Aligned Contact Scheme | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18606335 | INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18774512 | DUMMY FIN PROFILE CONTROL TO ENLARGE GATE PROCESS WINDOW | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18733107 | FAN-OUT INTERCONNECT STRUCTURE AND METHODS FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17648431 | Atomic Layer Etching to Reduce Pattern Loading in High-K Dielectric Layer | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17941347 | FLUORINE-DOPED SILICON-CONTAINING MATERIALS | Final Rejection | Applied Materials, Inc. |
| 17142641 | DOPED SILICON NITRIDE FOR 3D NAND | Non-Final OA | Applied Materials, Inc. |
| 18271898 | METHOD FOR FORMING SILICON-CONTAINING FILM AND FILM FORMING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 17941278 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING SYSTEM, AND RECORDING MEDIUM | Final Rejection | KOKUSAI ELECTRIC CORPORATION |
| 17881772 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18615918 | CHIP PACKAGE WITH ACTIVE SILICON BRIDGE | Non-Final OA | Advanced Micro Devices, Inc. |
| 18664634 | INTERFEROMETRIC FILTERS FOR PCAMBER CONVERTERS | Non-Final OA | Lumileds LLC |
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