Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2816 2817 2899
This examiner grants 90% of resolved cases
Andre C. Stevenson is a patent examiner in Tech Center 2800 and Art Unit 2812. He has a record of 877 resolved cases. The examiner maintains an allowance rate of 89.5 percent, which indicates that a majority of applications reach issuance. This percentage suggests that the examination process in this unit frequently results in a grant for the applicant.
The median time to allowance is 832 days. This timeframe provides a clear expectation for the duration of the prosecution cycle, showing that successful applications reach issuance within this median period. This efficiency is a key characteristic of the examiner's historical data and is an important consideration for practitioners managing patent portfolios in Tech Center 2800.
The data also shows an interview lift of 7.2 percent. This metric indicates that the probability of allowance increases when an interview is conducted, even with a base allowance rate of 89.5 percent. With 877 resolved cases, these figures represent a stable set of outcomes for practitioners. The combination of the allowance rate and the median days to allowance defines the typical experience for applicants in Art Unit 2812.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18734002 | SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18622131 | WIRE BONDING APPARATUS AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18770001 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18734866 | CONDUCTIVE STRUCTURE AND INTERCONNECTS FOR ELECTRICALLY CONNECTING A SUBSTRATE AND AN INTERPOSER | Non-Final OA | QUALCOMM Incorporated |
| 17890005 | INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY FOR MULTI-HEIGHT STANDARD CELL CIRCUITS | Non-Final OA | Intel Corporation |
| 18228122 | SUBSTRATE PROCESSING METHOD | Final Rejection | ASM IP Holding B.V. |
| 18199018 | SUBSTRATE PROCESSING METHOD | Final Rejection | ASM IP Holding B.V. |
| 17152592 | METHOD FOR DEPOSITION OF SILICON NITRIDE LAYER USING PRETREATMENT, STRUCTURE FORMED USING THE METHOD, AND SYSTEM FOR PERFORMING THE METHOD | Final Rejection | ASM IP Holding B.V. |
| 18177058 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS | Final Rejection | Mitsubishi Electric Corporation |
| 18728625 | SILICON CARBIDE SEMICONDUCTOR DEVICE | Non-Final OA | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
| 18344583 | METHOD FOR FABRICATING ELECTRODE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | SK hynix Inc. |
| 17905321 | CONTROL OF WAFER BOW DURING INTEGRATED CIRCUIT PROCESSING | Final Rejection | Lam Research Corporation |
| 18596580 | METHODS OF FORMING MICROELECTRONIC DEVICES WITH NITROGEN-RICH INSULATIVE STRUCTURES, AND RELATED MEMORY DEVICES AND ELECTRONIC SYSTEMS | Non-Final OA | Micron Technology, Inc. |
| 18606335 | INTEGRATED CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18775706 | VOID ELIMINATION FOR GAP-FILLING IN HIGH-ASPECT RATIO TRENCHES | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18774512 | DUMMY FIN PROFILE CONTROL TO ENLARGE GATE PROCESS WINDOW | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17648431 | Atomic Layer Etching to Reduce Pattern Loading in High-K Dielectric Layer | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17142641 | DOPED SILICON NITRIDE FOR 3D NAND | Non-Final OA | Applied Materials, Inc. |
| 18271898 | METHOD FOR FORMING SILICON-CONTAINING FILM AND FILM FORMING APPARATUS | Non-Final OA | Tokyo Electron Limited |
| 18728751 | PEROVSKITE SOLAR CELL AND METHOD FOR PRODUCING SAME | Non-Final OA | HANWHA SOLUTIONS CORPORATION |
| 17941278 | METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING SYSTEM, AND RECORDING MEDIUM | Final Rejection | KOKUSAI ELECTRIC CORPORATION |
| 17881772 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | Non-Final OA | KOKUSAI ELECTRIC CORPORATION |
| 18615918 | CHIP PACKAGE WITH ACTIVE SILICON BRIDGE | Non-Final OA | Advanced Micro Devices, Inc. |
| 18664634 | INTERFEROMETRIC FILTERS FOR PCAMBER CONVERTERS | Non-Final OA | Lumileds LLC |
| 18615912 | PIXEL PACKAGE | Final Rejection | EPISTAR CORPORATION |
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