Prosecution Insights
Last updated: July 17, 2026
Application No. 18/386,383

Power Semiconductor Module Arrangement

Non-Final OA §102
Filed
Nov 02, 2023
Priority
Nov 03, 2022 — EU 22205283.9
Examiner
LEE, EUGENE
Art Unit
2815
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Infineon Technologies AG
OA Round
1 (Non-Final)
82%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
87%
With Interview

Examiner Intelligence

Grants 82% — above average
82%
Career Allowance Rate
742 granted / 907 resolved
+13.8% vs TC avg
Moderate +5% lift
Without
With
+5.4%
Interview Lift
resolved cases with interview
Typical timeline
2y 8m
Avg Prosecution
43 currently pending
Career history
944
Total Applications
across all art units

Statute-Specific Performance

§101
0.7%
-39.3% vs TC avg
§103
73.6%
+33.6% vs TC avg
§102
10.7%
-29.3% vs TC avg
§112
2.6%
-37.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 907 resolved cases

Office Action

§102
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election without traverse of Invention I, Species I (claims 1, 3, and 5-11) in the reply filed on 4/24/26 is acknowledged. Claims 2, 4, and 12-14 are withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected invention, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 4/24/26. Also, claim 10 is further withdrawn as the claim is directed to Species IV (i.e. hollow holding pin accommodating a terminal element); however, the applicant is reminded that any claim dependent on an allowed claim is subject to rejoinder. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1, 3, 5, 6, and 11 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Bayerer US 2014/0035118 A1. Bayerer discloses (see, for example, FIG. 3) a power semiconductor module arrangement comprising a housing 7/10, substrate 2, holding pins 4, first end 42, holding elements 71, and sleeve 72. The holding pins 4 extends from the substrate 2 in a vertical direction perpendicular to a top surface of the substrate 2 towards a different one of the one of more holding elements 71 such that the free end 42 of each of the one or more holding pins 4 is arranged inside the respective holding element 71. In paragraph [0044], Bayerer discloses the holding pin 4 being connected by the free end 42 by a press-fit contact (i.e. force-fitting). Regarding claim 3, see, for example, FIG. 3 wherein Bayerer discloses two holding elements 71 arranged on opposing sides of the housing 7/10. Regarding claim 5, see, for example, FIG. 3 wherein Bayerer discloses additional holding elements 83 as well as holding elements 71, which are more than the holding pins 4. Regarding claim 6, see, for example, FIG. 3 wherein Bayerer discloses the holding elements 71 having a sleeve 72, which are contact holes that receive the free end 42 of one of the holding pins 4. Regarding claim 11, see, for example, paragraph [0043] wherein Bayerer discloses sheet metal (i.e. connection layer) on the upper metallization layer 21 and/or the semiconductor component 1. Allowable Subject Matter Claims 7 thru 9 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is a statement of reasons for the indication of allowable subject matter: The references of record, either singularly or in combination, do not teach or suggest at least a power semiconductor module arrangement comprising: further comprising a plurality of ribs extending from inner diameter of the sleeve towards a center of an opening defined by the sleeve, the ribs defining a reduced diameter in defined sections of the sleeve, wherein the reduced diameter is smaller than the inner diameter. Regarding claim 8, the following is a statement of reasons for the indication of allowable subject matter: The references of record, either singularly or in combination, do not teach or suggest at least a power semiconductor module arrangement comprising: wherein at least one of the one or more holding pins comprises a collar arranged at the free end of the respective holding pin, an outer diameter of the holding pin is smaller than a smallest diameter of the holding element, and the collar is bent in a direction towards the substrate and smoothly adapts to an inner contour of the holding element. INFORMATION ON HOW TO CONTACT THE USPTO Any inquiry concerning this communication or earlier communications from the examiner should be directed to EUGENE LEE whose telephone number is (571)272-1733. The examiner can normally be reached M-F 730-330 PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, JOSHUA BENITEZ can be reached at 571-270-1435. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. Eugene Lee May 5, 2026 /EUGENE LEE/Primary Examiner, Art Unit 2815
Read full office action

Prosecution Timeline

Nov 02, 2023
Application Filed
May 14, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
82%
Grant Probability
87%
With Interview (+5.4%)
2y 8m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 907 resolved cases by this examiner. Grant probability derived from career allowance rate.

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