Prosecution Insights
Last updated: August 18, 2026
Application No. 18/398,969

LEADFRAME WITH RETAINING FEATURES

Non-Final OA §102§103
Filed
Dec 28, 2023
Examiner
TRAN, TAN N
Art Unit
2812
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Texas Instruments Incorporated
OA Round
1 (Non-Final)
87%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
97%
With Interview

Examiner Intelligence

Grants 87% — above average
87%
Career Allowance Rate
964 granted / 1111 resolved
+18.8% vs TC avg
Moderate +10% lift
Without
With
+10.0%
Interview Lift
resolved cases with interview
Fast prosecutor
2y 1m
Avg Prosecution
31 currently pending
Career history
1153
Total Applications
across all art units

Statute-Specific Performance

§101
1.8%
-38.2% vs TC avg
§103
50.4%
+10.4% vs TC avg
§102
33.7%
-6.3% vs TC avg
§112
7.7%
-32.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1111 resolved cases

Office Action

§102 §103
Election/Restriction Applicant's election without traverse of Group I, claims 1 - 10, 19 - 23 is acknowledged. Claims 11 - 18 withdrawn from further consideration by the examiner, 37 CFR. 1.142(b), as being drawn to non-elected invention. Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1 – 6, 10, 19 - 23 is/are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Sirinorakul et al (7205180). With regard to claim 1, Sirinorakul et al. disclose an integrated circuit package (for example, see fig. 10) comprising: a leadframe (32, and DAP) of a conductive material including a die attach pad (DAP) and a lead finger (32) separated from an edge of the die attach pad (DAP), wherein the leadframe has a first surface (a top surface) and a second surface (referred to as “32A1” by examiner’s annotation shown in fig. 10 below) opposite the first surface (the top surface); retaining features (metallic coating features 38, as shown in fig. 10 below, functions as retaining features) on the lead finger (32) at the second surface (32A1); a die (Die as shown in fig. 10) on the first surface (the top surface) at the die attach pad (DAP); and a molding compound (referred to as “M1” by examiner’s annotation shown in fig. 10 below) that encapsulates the leadframe (32, and DAP) and the die (Die as shown in fig. 10) and extends into the retaining features (metallic coating features 38, as shown in fig. 10 below, functions as retaining features). PNG media_image1.png 484 925 media_image1.png Greyscale PNG media_image2.png 169 530 media_image2.png Greyscale With regard to claim 2, Sirinorakul et al. disclose the leadframe includes fabrication features (referred to as “38A” by examiner’s annotation shown in fig. 10 above) on the second surface (32A1) and the retaining features (38) are arranged amongst the fabrication features (38A). With regard to claim 3, Sirinorakul et al. disclose the retaining features (38) include an arrangement of retaining features (38) in the second surface (32A1). With regard to claim 4, Sirinorakul et al. disclose the fabrication features (38A) extend in a first direction (for example, X-direction), and the retaining features (38) include spaced apart grooves (referred to as “G1” by examiner’s annotation shown in fig. 10 above) that extend longitudinally along the lead finger (32) at the second surface (32A1) a second direction (for example, Y-direction) approximately perpendicular to the first direction (for example, X-direction). PNG media_image3.png 533 913 media_image3.png Greyscale With regard to claim 5, Sirinorakul et al. disclose the lead finger (for example, finger 30, fig. 4L) has a T-shape. With regard to claim 6, Sirinorakul et al. disclose the retaining features (38) are a first set of retaining features (a first set of retaining features at the lead fingers 32), and a second set of retaining features (a second set of retaining features at the die pad DAP) are formed on the second surface (32A1) at the die attach pad (DAP). With regard to claim 10, Sirinorakul et al. disclose the lead finger includes a plurality of lead fingers (32, fig. 10 or 30 fig. 4L) arranged around, coplanar with and spaced apart from a periphery of the die attach pad (DAP), each of the lead fingers (32) has respective retaining features (38) formed along the second surface thereof, and the molding compound (M1) extends into the respective retaining features (38). With regard to claim 19, Sirinorakul et al. disclose a device (for example, see fig. 10) comprising: a sheet (layers 32, DAP functions as a sheet) of a conductive material having a first surface (a top surface) and a second surface (referred to as “32A1” by examiner’s annotation shown in fig. 10 below) opposite the first surface (the top surface), wherein fabrication features (referred to as “38A” by examiner’s annotation shown in fig. 10 below) extend in a first direction (for example, X-direction) along at least one of the first and second surfaces, the sheet (layers 32, DAP functions as the sheet) including: a die attach pad (DAP); and a plurality of lead fingers (32, fig. 10) spaced apart from and surrounding (partially surrounding) the die attach pad (DAP), wherein an arrangement (a peak arrangement) of retaining features (metallic coating features 38, as shown in fig. 10 below, functions as retaining features) is formed in at least one lead finger (32) of the lead fingers (32) extending along a second direction (Y-direction) that is approximately perpendicular to the first direction (X-direction). PNG media_image4.png 520 837 media_image4.png Greyscale With regard to claim 20, Sirinorakul et al. disclose the sheet (layers 32, DAP) is a leadframe and the device further comprises: a die (Die as shown in fig. 10) affixed to the first surface at the die attach pad (DAP); and a molding compound (referred to as “M1” by examiner’s annotation shown in fig. 10 above) that encapsulates the leadframe (layers 32, DAP) and the die (Die as shown in fig. 10) and extends into the retaining features of the arrangement of retaining features (38). With regard to claim 21, Sirinorakul et al. disclose the lead finger (for example, finger 30, fig. 4L) has a T-shape and the retaining features (38) are grooves. With regard to claim 22, Sirinorakul et al. disclose the arrangement of retaining features (38) includes voids (grooves forming in the features 38) formed on the second surface (32A1) at the die attach pad (DAP). With regard to claim 23, Sirinorakul et al. disclose at least one void of the voids (grooves forming in the features 38) has spaced apart sidewalls that are tapered in a direction extending from the second surface (32A1). Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 7 - 9 are rejected under 35 U.S.C. 103 as being unpatentable over Sirinorakul et al (7205180). With regard to claim 7, Sirinorakul et al. disclose the retaining features (38) include spaced apart voids (grooves) that extend a depth from the second surface (32A1) towards the first surface (the top surface). Figure 10 of the Sirinorakul et al. reference (shown below) does appear to show the depth (grooves in the features 38) is less than or equal to approximately 40% of a thickness of the leadframe (layers 32, DAP), as claimed. However, since the patent drawings are not labeled as “to scale,” one cannot be certain that the depth is less than or equal to approximately 40% of a thickness of the leadframe as seemingly shown [see MPEP 2125]. PNG media_image3.png 533 913 media_image3.png Greyscale It would have been obvious to one having ordinary skill in the art at the time of the claimed invention to form the depth is less than or equal to approximately 40% of a thickness of the leadframe, because Fig. 10 suggests the depth (grooves in the features 38) is less than or equal to approximately 40% of a thickness of the leadframe (layers 32, DAP) and a prima facie case of obviousness exists where device dimensions of the prior art are such that one of ordinary skill in the art would have expected them to have the same performance {MPEP 2144.04(IV)(A)} PNG media_image3.png 533 913 media_image3.png Greyscale With regard to claim 8, Sirinorakul et al. disclose at least one void of the voids (grooves) has spaced apart sidewalls that are tapered in a direction extending from the second surface (32A1) towards the first surface (the top surface). With regard to claim 9, Sirinorakul et al. disclose at least one void of the voids (grooves in the retaining features 38) has cross-sectional V-shape. Conclusion 6. Any inquiry concerning this communication or earlier communications from the examiner should be directed to TAN N TRAN whose telephone number is (571) 272 - 1923. The examiner can normally be reached on 8:30-5:00PM. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Davienne Monbleau can be reached on (571) 272-1945. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative or access to the automated information system, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /TAN N TRAN/ Primary Examiner, Art Unit 2812
Read full office action

Prosecution Timeline

Dec 28, 2023
Application Filed
Jul 14, 2026
Non-Final Rejection mailed — §102, §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

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DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENT
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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
87%
Grant Probability
97%
With Interview (+10.0%)
2y 1m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1111 resolved cases by this examiner. Grant probability derived from career allowance rate.

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