Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2826
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18226328 | INTERCONNECTS AT BACK SIDE OF SEMICONDUCTOR DEVICE FOR SIGNAL ROUTING | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18529525 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18528672 | DISPLAY APPARATUS | Non-Final OA | LG Display Co., Ltd. |
| 18134305 | DISPLAY DEVICE HAVING IMPROVED SELF-ASSEMBLING RATE OF LIGHT EMITTING ELEMENTS AND METHOD OF MANUFACTURING THE SAME | Final Rejection | LG Display Co., Ltd. |
| 17899657 | THIN FILM TRANSISTOR, FABRICATION METHOD THEREOF, AND DISPLAY APPARATUS COMPRISING THE SAME | Non-Final OA | LG DISPLAY CO., LTD. |
| 17751975 | THIN FILM TRANSISTOR SUBSTRATE AND DISPLAY DEVICE COMPRISING THE SAME | Final Rejection | LG DISPLAY CO., LTD. |
| 18534056 | INTEGRATED DEVICES WITH CONDUCTIVE BARRIER STRUCTURE | Non-Final OA | Texas Instruments Incorporated |
| 18524609 | BACKGRIND TAPE ETCHING FOR IMPROVED LASER DICING | Non-Final OA | Texas Instruments Incorporated |
| 18326698 | INTEGRATED DEVICES WITH CONDUCTIVE BARRIER STRUCTURE | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18263214 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18128363 | DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18113310 | DISPLAY APPARATUS | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18090705 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 17896693 | DISPLAY DEVICE AND TILED DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18524514 | Semiconductor Structures and Methods of Forming Same | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18512570 | INNER SPACERS FOR MULTI-GATE TRANSISTORS AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18407527 | METHODS FOR PROTECTING A PERIPHERAL EDGE AND BACKSIDE OF A SEMICONDUCTOR SUBSTRATE | Non-Final OA | Tokyo Electron Limited |
| 18678463 | Using A Self-Assembly Layer To Facilitate Selective Formation of An Etching Stop Layer | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18410329 | VIA-FIRST SELF-ALIGNED INTERCONNECT FORMATION PROCESS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 17879556 | ISOLATION STRUCTURES IN IMAGE SENSORS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18661326 | METHODS AND SYSTEMS FOR MEASURING SEMICONDUCTOR DEVICES | Non-Final OA | Lodestar Licensing Group LLC |
| 18395799 | BRACING STRUCTURE, SEMICONDUCTOR DEVICE WITH THE SAME, AND METHOD FOR FABRICATING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 17893277 | ELECTRONIC DEVICES WITH REDUCED OHMIC TO OHMIC DIMENSIONS | Final Rejection | Wolfspeed, Inc. |
| 18455156 | PACKAGE WITH EMBEDDED TRACES | Final Rejection | PANJIT INTERNATIONAL INC. |
| 18565785 | SYSTEM IN A PACKAGE (SIP) THERMAL MANAGEMENT | Non-Final OA | OCTAVO SYSTEMS LLC |
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