Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
DETAILED ACTION
This action is responsive to application No. 18416008 filed on 01/18/2024.
Information Disclosure Statement
Acknowledgment is made of Applicant’s Information Disclosure Statement (IDS) form PTO-1449. These IDS has been considered.
Priority
Receipt is acknowledged of papers submitted under 35 U.S.C. 119(a)-(d), which papers have been placed of record in the file.
Election/Restrictions
Applicant’s election without traverse of claims 1-11 in the reply filed on 6/24/2026 is acknowledged.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1-2, 4-6 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Kaneko et al. (US 2012/0222894).
Regarding independent claim 1, Kaneko et al. teach a semiconductor package comprising:
a substrate (Fig. 3, element 52, paragraph 0116); and
a pad (Fig. 3, element P1, paragraph 0120) on one surface of the substrate and includes a first metal layer (Figs. 2 & 3, element 12, paragraph 0116) and a second metal layer (Figs. 2 & 3, element 13, paragraph 0116) covering the first metal layer,
wherein a side surface of the second metal layer is nonplanar (Figs. 2 & 3).
Regarding claim 2, Kaneko et al. teach wherein the side surface of the second metal layer includes two or more protrusions (Figs. 2 & 3).
Regarding claim 4, Kaneko et al. teach wherein a surface roughness of a side surface of the pad is greater than that of an upper surface of the pad (Figs. 2 & 3).
Regarding claim 5, Kaneko et al. teach further comprising an insulating layer (Fig. 3, element 20, paragraph 0139) on the one surface of the substrate, wherein a surface of the insulating layer in contact with of a side surface of the pad is nonplanar.
Regarding claim 6, Kaneko et al. teach wherein a surface roughness of the surface of the insulating layer in contact with the side surface of the pad is greater than a surface roughness of a surface of the insulating layer in contact with an upper surface of the substrate (Figs. 2 & 3).
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102 of this title, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claim 3 is rejected under 35 U.S.C. 103 as being unpatentable over Kaneko et al. (US 2012/0222894) in view of Kao et al. (US 2024/0332158).
Regarding claim 3, Kaneko et al. teach wherein the first and second metal layer comprises metal (paragraph 1014).
Kaneko et al. do not explicitly disclose the first metal layer includes copper and the second metal layer includes nickel.
Before the effective filling date of the invention it would have been obvious to one having ordinary skill in the art to select known metal materials as shown by Kao et al. (paragraph 0040 discloses a pad comprising a first metal layer (Fig. 1I, element 200a-1) made of copper and paragraph 0037 discloses a second metal layer (Fig. 1I & 2, element 108p) comprising nickel, since it has been held to be within the general skill of a worker in the art to select a known material on the base of its suitability, for its intended use involves only ordinary skill in the art. In re Leshin, 125 USPQ 416.
Claims 7-8, 10-11 are rejected under 35 U.S.C. 103 as being unpatentable over Kaneko et al. (US 2012/0222894).
Regarding claim 7, Kaneko et al. teach further comprising a seed layer (Fig. 3, element 11, paragraph 0104 discloses metal layer, Before the effective filling date of the invention it would have been obvious to one having ordinary skill in the art to select a known metal such as Cu or Al, since it has been held to be within the general skill of a worker in the art to select a known material on the base of its suitability, for its intended use involves only ordinary skill in the art. In re Leshin, 125 USPQ 416)between the substrate and the pad.
Regarding independent claim 8, Kaneko et al. teach a semiconductor package comprising:
a substrate (Fig. 3, element 52, paragraph 0116);
a seed layer (Fig. 3, element 11, paragraph 0104 discloses metal layer, Before the effective filling date of the invention it would have been obvious to one having ordinary skill in the art to select a known metal such as Cu or Al, since it has been held to be within the general skill of a worker in the art to select a known material on the base of its suitability, for its intended use involves only ordinary skill in the art. In re Leshin, 125 USPQ 416) on a first surface of the substrate;
a pad (Fig. 3, element P1, paragraph 0120) on the seed layer and including a first metal layer (Figs. 2 & 3, element 12, paragraph 0116) and a second metal layer (Figs. 2 & 3, element 13, paragraph 0116) on the first metal layer;
an insulating layer (Fig. 3, element 20, paragraph 0139) on the first surface of the substrate and including a side surface in contact with the second metal layer; and
a semiconductor chip (Fig. 3, element 50, paragraph 0116) above a second surface of the substrate,
wherein an interface between the side surface of the insulating layer and the second metal layer is nonplanar (Figs. 2 & 3).
Regarding claim 10, Kaneko et al. teach wherein the substrate includes an interconnection layer (Fig. 3, elements 51 & 14, paragraph 0040, 0050) that electrically connects the semiconductor chip and the pad.
Regarding claim 11, Kaneko et al. teach wherein a side surface of the pad includes two or more protrusions (Figs. 2 & 3).
Claim 9 is rejected under 35 U.S.C. 103 as being unpatentable over Kaneko et al. (US 2012/0222894) in view of Kao et al. (US 2024/0332158).
Regarding claim 9, Kaneko et al. teach wherein the first and second metal layer comprises metal (paragraph 1014).
Kaneko et al. do not explicitly disclose wherein the first metal layer includes copper and the second metal layer includes nickel.
Before the effective filling date of the invention it would have been obvious to one having ordinary skill in the art to select known metal materials as shown by Kao et al. (paragraph 0040 discloses a pad comprising a first metal layer (Fig. 1I, element 200a-1) made of copper and paragraph 0037 discloses a second metal layer (Fig. 1I & 2, element 108p) comprising nickel, since it has been held to be within the general skill of a worker in the art to select a known material on the base of its suitability, for its intended use involves only ordinary skill in the art. In re Leshin, 125 USPQ 416.
Cited Prior Art
The Examiner has pointed out particular references contained in the prior art of record within the body of this action for the convenience of the Applicant.
Although the specified citations are representative of the teachings in the art and are applied to the specific limitations within the individual claim, other passages and figures may apply.
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to SHAHED AHMED whose telephone number is (571)272-3477. The examiner can normally be reached M-F 9-5.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Steven Gauthier can be reached on 571-270-0373. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/SHAHED AHMED/
Primary Examiner, Art Unit 2813
Prosecution Insights