Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2813 2823
This examiner grants 91% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18646294 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18416008 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18598099 | METHODS OF FABRICATING A SI BJT, AND CORRESPONDING DEVICES | Non-Final OA | NXP B.V. |
| 18644418 | SEMICONDUCTOR OPTICAL ELEMENT, MEASUREMENT DEVICE AND LIGHT SOURCE DEVICE USING SEMICONDUCTOR OPTICAL ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR OPTICAL ELEMENT | Non-Final OA | NICHIA CORPORATION |
| 18645785 | SIC MOSFET, SIC MOSFET PREPARATION METHOD, AND INTEGRATED CIRCUIT | Non-Final OA | Huawei Digital Power Technologies Co., Ltd. |
| 17947071 | FERRORELECTRIC FIELD-EFFECT TRANSISTOR (FEFET) DEVICES WITH LOW OPERATING VOLTAGE CAPABILITIES | Final Rejection | Intel Corporation |
| 18637017 | SEMICONDUCTOR DEVICE | Non-Final OA | Mitsubishi Electric Corporation |
| 18410886 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | Mitsubishi Electric Corporation |
| 18836354 | DICING/DIE-BONDING FILM AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | Resonac Corporation |
| 18123402 | DIELECTRIC BRIDGE FOR HIGH BANDWIDTH INTER-DIE COMMUNICATION | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18593490 | THIN DIODES | Non-Final OA | STMicroelectronics (Tours) SAS |
| 18779425 | METHOD FOR ELIMINATING DIVOT FORMATION AND SEMICONDUCTOR DEVICE MANUFACTURED USING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18645747 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18597846 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18425333 | OXYGEN AFFINITY LAYER TO IMPROVE RRAM CELL PERFORMANCE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18420550 | TREATMENT FOR TUNING THRESHOLD VOLTAGES OF TRANSISTORS | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18405973 | INTERCONNECT LAYER WITH DIFFERENT DIELECTRIC REGIONS | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18622694 | DIE TO WAFER BONDING METHOD AND APPARATUS WITH THERMAL CONTACT DIE SHAPE CONTROL | Non-Final OA | Tokyo Electron Limited |
| 18641707 | DIODE AND METHOD OF MAKING THE SAME | Non-Final OA | The Curators of the University of Missouri |
| 18582591 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
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