Last updated: July 17, 2026

Application No. 18/430,457

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Non-Final OA

Filed

Feb 01, 2024

Priority

Jul 24, 2023 — RE 10-2023-0096219

Examiner

CLINTON, EVAN GARRETT

Art Unit

2899

Tech Center

2800 — Semiconductors & Electrical Systems

Assignee

Samsung Electronics Co., Ltd.

OA Round

1 (Non-Final)

Interview Optional

— +5.3% interview lift. Interview already conducted in this application's prosecution history. This examiner has a 88% grant rate with +5.3% interview lift. Since an interview has already been tried, recommend written response with narrowed claims based on precedent claim evolution patterns.

Based on 570 resolved cases, 2023–2026

Examiner Intelligence

CLINTON, EVAN GARRETT View full profile →

Grants 88% — above average

Career Allowance Rate

504 granted / 570 resolved

+20.4% vs TC avg

Moderate +5% lift

Without

With

+5.3%

Interview Lift

resolved cases with interview

Fast prosecutor

1y 11m

Avg Prosecution

25 currently pending

Career history

589

Total Applications

across all art units

Statute-Specific Performance

§101

0.2%

-39.8% vs TC avg

§103

90.4%

+50.4% vs TC avg

§102

5.4%

-34.6% vs TC avg

§112

3.9%

-36.1% vs TC avg

Black line = Tech Center average estimate • Based on career data from 570 resolved cases

Prosecution Timeline

Feb 01, 2024

Application Filed

May 18, 2026

Non-Final Rejection mailed

Jun 18, 2026

Applicant Interview (Telephonic)

Jun 26, 2026

Examiner Interview Summary

Precedent Cases

Applications granted by this same examiner with similar technology

18/537,121

Patent 12682944

METHOD FOR MANUFACTURING SEMICONDUCTOR-ELEMENT-CONTAINING MEMORY DEVICE

2y 7m to grant Granted Jul 14, 2026

18/676,343

Patent 12666964

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

2y 0m to grant Granted Jun 23, 2026

18/086,185

Patent 12660653

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

3y 5m to grant Granted Jun 16, 2026

18/166,450

Patent 12660654

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

3y 4m to grant Granted Jun 16, 2026

18/605,947

Patent 12653028

Packaged Semiconductor Device Including Liquid-Cooled Lid and Methods of Forming the Same

2y 2m to grant Granted Jun 09, 2026

Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.

Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2

Expected OA Rounds

88%

Grant Probability

94%

With Interview (+5.3%)

1y 11m (~0m remaining)

Median Time to Grant

Low

PTA Risk

Based on 570 resolved cases by this examiner. Grant probability derived from career allowance rate.