Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2816 2899
This examiner grants 89% of resolved cases
Evan Garrett Clinton serves in Tech Center 2800 and Art Unit 2816. He has 582 resolved cases and an allowance rate of 88.7 percent. This percentage indicates that many applications he examines are allowed. The median days to allowance is 714, which is the timeline for the patent process.
The interview lift is 5.4 percent. Given the 88.7 percent allowance rate, the 5.4 percent lift is a positive addition to the probability of success. In Tech Center 2800, the 714 days median to allowance suggests the speed of the examination phase.
The 582 resolved cases provide a statistical foundation for these trends. The 88.7 percent allowance rate and the 714 days median to allowance make Art Unit 2816 a venue for applicants to consider. The 5.4 percent interview lift can be used to further ensure a positive outcome. The combination of these metrics defines the current prosecution landscape for this examiner.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18706358 | DISPLAY SUBSTRATE, DISPLAY APPARATUS AND MANUFACTURING METHOD FOR DISPLAY SUBSTRATE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18705621 | TOUCH-CONTROL STRUCTURE, TOUCH-CONTROL DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18672852 | DISPLAY DEVICE AND WEARABLE DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18441834 | DISPLAY DEVICE AND DISPLAY PANEL | Non-Final OA | LG Display Co., Ltd. |
| 18286894 | OPTOELECTRONIC DEVICE COMPRISING A STACK OF MULTIPLE QUANTUM WELLS | Final Rejection | COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES |
| 18673157 | PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVING BODY | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18775130 | INTEGRATED CHIP WITH INTER-WIRE CAVITIES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18441886 | ENHANCED MOBILITY IN SEMICONDUCTOR DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18441808 | VOID-FREE STRESS INCORPORATION IN SEMICONDUCTOR DEVICES | Non-Final OA | Applied Materials, Inc. |
| 18675646 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18596223 | MEMS STRESS ISOLATION TECHNOLOGY WITH BACKSIDE ETCHED ISOLATION TRENCHES | Non-Final OA | Analog Devices, Inc. |
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