Tech Center 2800 • Art Units: 2816 2899
This examiner grants 88% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18396249 | DISPLAY APPARATUS | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18354777 | FLIP CHIP SEMICONDUCTOR PACKAGES | Final Rejection | Samsung Electronics Co., Ltd. |
| 18223757 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18533961 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18568357 | DISPLAY PANEL, DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY PANEL | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18503735 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18343757 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18180852 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18074253 | MICROELECTRONIC ASSEMBLY HAVING ANTIFERROMAGNETIC FILM STRUCTURE THEREIN | Non-Final OA | Intel Corporation |
| 17848624 | SILICON NITRIDE LAYER UNDER A COPPER PAD | Non-Final OA | Intel Corporation |
| 18395950 | DISPLAY PANEL AND DISPLAY PANEL MANUFACTURING METHOD | Non-Final OA | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18521175 | APPARATUS AND TEST ELEMENT GROUP | Non-Final OA | Micron Technology, Inc. |
| 18340556 | PACKAGE COMPRISING SIDEWALL INTERCONNECTS CONFIGURED FOR POWER ROUTING | Final Rejection | QUALCOMM Incorporated |
| 18491315 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18534744 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | SK hynix Inc. |
| 18088908 | APPARATUS, SYSTEM, AND METHOD FOR INTEGRATING PASSIVE ELEMENTS INTO ELECTRONIC BRIDGE COMPONENTS | Non-Final OA | Advanced Micro Devices, Inc. |
| 18344900 | PACKAGE STRUCTURE INCLUDING LOWER MOLDED STRUCTURE INCLUDING A SUBSTRATE PORTION, AND METHODS OF FORMING THE PACKAGE STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18286894 | OPTOELECTRONIC DEVICE COMPRISING A STACK OF MULTIPLE QUANTUM WELLS | Non-Final OA | COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIES ALTERNATIVES |
| 18348167 | ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES | Non-Final OA | Amkor Technology Singapore Holding Pte. Ltd. |
| 18517454 | CHIP PACKAGE STRUCTURE | Non-Final OA | TONG HSING ELECTRONIC INDUSTRIES, LTD. |
| 18566051 | TRANSISTOR DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | SUZHOU LOONGSPEED SEMICONDUCTOR TECHNOLOGY CO., LTD. |
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