Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2816 2899
This examiner grants 89% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18589891 | SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18430457 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18442157 | IMAGING DEVICE | Non-Final OA | Panasonic Intellectual Property Management Co., Ltd. |
| 18706358 | DISPLAY SUBSTRATE, DISPLAY APPARATUS AND MANUFACTURING METHOD FOR DISPLAY SUBSTRATE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18705621 | TOUCH-CONTROL STRUCTURE, TOUCH-CONTROL DISPLAY PANEL AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18648792 | LIQUID COOLING OF AN INTEGRATED CIRCUIT | Non-Final OA | QUALCOMM Incorporated |
| 18513957 | Packages with Implantation | Non-Final OA | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18596223 | MEMS STRESS ISOLATION TECHNOLOGY WITH BACKSIDE ETCHED ISOLATION TRENCHES | Non-Final OA | Analog Devices, Inc. |
| 18664617 | METHOD FOR AUTOMATICALLY GENERATING CHIP IDENTIFIERS FOR SEMICONDUCTOR DIES IN STACKED STRUCTURE, SEMICONDUCTOR DEVICE, AND MEMORY DEVICE USING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18475041 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18354863 | TRANSFER MOLDED POWER MODULES AND METHODS OF MANUFACTURE | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
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