Prosecution Insights
Last updated: May 29, 2026
Application No. 18/449,771

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

Non-Final OA §102
Filed
Aug 15, 2023
Priority
Sep 01, 2022 — CN 202211066753.3 +1 more
Examiner
STARK, JARRETT J
Art Unit
2898
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Changxin Memory Technologies Inc.
OA Round
1 (Non-Final)
70%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
82%
With Interview

Examiner Intelligence

Grants 70% — above average
70%
Career Allowance Rate
896 granted / 1274 resolved
+2.3% vs TC avg
Moderate +11% lift
Without
With
+11.2%
Interview Lift
resolved cases with interview
Typical timeline
2y 8m
Avg Prosecution
60 currently pending
Career history
1332
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
84.7%
+44.7% vs TC avg
§102
8.6%
-31.4% vs TC avg
§112
1.4%
-38.6% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1274 resolved cases

Office Action

§102
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant's election with traverse of Group I: Claims 1-9 in the reply filed on 4/8/2026 is acknowledged. Applicant’s traversal is unpersuasive. While Applicant argues that the groups "lack the same or corresponding special technical features," this Unity of Invention standard (MPEP 1800) does not apply to the present application. As indicated in the Application Data Sheet (ADS) filed 08/15/2023, this is a Continuation filed under 35 U.S.C. 111(a); therefore, the restriction is governed by the "independent and distinct" criteria of 35 U.S.C. 121. Furthermore, the Examiner appreciates Applicant’s technical explanation that the stack "can be formed separately and subsequently transferred or placed onto the substrate." This specific alternative method provided by Applicant successfully demonstrates that the claimed product can be made by a materially different process than the one currently claimed, establishing distinctness under MPEP 806.05(f). Accordingly, the restriction is maintained. Claims 10-20 are withdrawn from further consideration pursuant to 37 CFR 1.142(b), as being drawn to a nonelected, there being no allowable generic or linking claim. The requirement is still deemed proper and is therefore made FINAL. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claim(s) 1 is/are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Huang (US 20240040777 A1). PNG media_image1.png 840 570 media_image1.png Greyscale CLAIM 1. Huang teaches a semiconductor structure, comprising: a substrate (Huang - Abstract1 Note: substrate not shown in figures.); and a stack structure located on the substrate (Abstract & Figs 1-2), the stack structure comprising a plurality of memory units arranged at intervals in a first direction (Stacking direction D2), each of the plurality of memory units comprising a transistor structure TR, the transistor structure comprising an active structure 20 and a gate layer 11, at least part of the active structure being distributed around a periphery of part of the gate layer (Figs. 1-2), a projection of the active structure on a top surface of the substrate being in a shape of a U which opens toward a second direction, wherein both the first direction and the second direction are parallel to the top surface of the substrate, and the first direction intersects with the second direction (Figs. 1-2). Under the Broadest Reasonable Interpretation (BRI), the limitation of an active structure having a "projection... in a shape of a U which opens toward a second direction" is not restricted to a structure that is exclusively open-ended. A closed-loop or rectangular active structure (e.g., layer 20 of Huang) that surrounds a gate layer inherently comprises the claimed U-shaped geometry within its profile. Any three contiguous sides of such a structure necessarily form a U-shape that flanks the gate and defines an interior space opening toward the second direction. Because the claim uses the transition term "comprising," it does not exclude additional segments—such as a fourth side—that close the loop. Furthermore, this U-shaped geometry is oriented such that it opens toward the second direction, which encompasses an opening directed either toward the bit line (layer 17) or toward the capacitor structure, depending on the relative orientation of the concave portion of the channel to the associated electrical contacts. Therefore, the surrounding channel of the prior art meets the U-shape requirement as it encompasses the claimed geometry while oriented toward the specified functional components. Allowable Subject Matter Claim 2 and subsequent depending claims 3-9 are objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The following is an examiner’s statement of reasons for indicating allowable subject matter: The primary reason for the allowance of the claims is the inclusion of the limitation “a second gate layer, the second gate layer being distributed at least around a periphery of the part of the active structure, and the first gate layer being electrically connected to the second gate layer“, in all of the claims which is not found in the prior art references. Any comments considered necessary by applicant must be submitted no later than the payment of the issue fee and, to avoid processing delays, should preferably accompany the issue fee. Such submissions should be clearly labeled “Comments on Statement of Reasons for Allowance.” Prior Art of Record The applicant's attention is directed to additional pertinent prior art cited in the accompanying PTO-892 Notice of References Cited, which, however, may not be currently applied as a basis for the following rejections. While these references were considered during the examination of this application and are deemed relevant to the claimed subject matter, they are not presently being applied as a basis for rejection in this Office action. The pertinence of these documents, however, may be revisited, and they may be applied in subsequent Office actions, particularly in light of any amendments or further clarification of the claimed invention. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to JARRETT J STARK whose telephone number is (571)272-6005. The examiner can normally be reached 8-4 M-F. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Jessica Manno can be reached at 571-272-2339. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. JARRETT J. STARK Primary Examiner Art Unit 2822 4/20/2026 /JARRETT J STARK/Primary Examiner, Art Unit 2898 1 Abstract - A semiconductor structure and a method for forming a semiconductor structure are provided. The semiconductor structure includes: a substrate; and a stack structure arranged on the substrate. The stack structure includes storage areas spaced apart from each other in a first direction, and isolation walls, each isolation wall being arranged between any two adjacent storage areas of the storage areas. Each storage area includes memory cells spaced apart from each other in a second direction, each memory cell including a transistor structure, and a capacitor structure, an outline of a projection of the capacitor structure on a top surface of the substrate being in a shape of a rectangle or a rounded rectangle. A width of the transistor structure is equal to a width of the capacitor structure in the first direction, and the transistor structure is aligned with the capacitor structure in the third direction.
Read full office action

Prosecution Timeline

Aug 15, 2023
Application Filed
Apr 28, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12628464
SYSTEMS AND METHODS FOR STACKED SENSORS WITH ELECTRICAL INSULATION
3y 8m to grant Granted May 12, 2026
Patent 12628641
MEMORY DEVICE AND MANUFACTURING METHOD OF THE MEMORY DEVICE
3y 4m to grant Granted May 12, 2026
Patent 12621984
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREFOR
2y 12m to grant Granted May 05, 2026
Patent 12610702
DISPLAY DEVICE
3y 3m to grant Granted Apr 21, 2026
Patent 12604517
SEMICONDUCTOR DEVICE
2y 10m to grant Granted Apr 14, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
70%
Grant Probability
82%
With Interview (+11.2%)
2y 8m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 1274 resolved cases by this examiner. Grant probability derived from career allowance rate.

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