Tech Center 2800 • Art Units: 2822 2823 2898
This examiner grants 70% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18374437 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18370207 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18236673 | SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18489704 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18576344 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18028335 | QUANTUM DOT LIGHT-EMITTING DEVICE, DISPLAY APPARATUS AND MANUFACTURING METHOD | Final Rejection | BOE Technology Group Co., Ltd. |
| 18234603 | POWER OVERLAY STRUCTURE FOR A MULTI-CHIP SEMICONDUCTOR PACKAGE | Final Rejection | General Electric Company |
| 18458794 | INTEGRATED CIRCUIT HAVING IMPROVED BALL BONDING ADHESION | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18455163 | CAVITY INTEGRATED CIRCUIT | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18451810 | DEFECT REMOVAL DEVICE, DEFECT REMOVAL METHOD, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18549299 | MAGNETIC SENSOR AND METHOD OF MANUFACTURING MAGNETIC SENSOR | Non-Final OA | PANASONIC HOLDINGS CORPORATION |
| 18304473 | APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18114536 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18280461 | METHOD FOR PATTERNING NANOPARTICLE FILM, METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE, AND LIGHT-EMITTING DEVICE | Non-Final OA | SHARP KABUSHIKI KAISHA |
| 17941377 | INPUT/OUTPUT PORT CIRCUIT AND CHIP THEREOF | Non-Final OA | REALTEK SEMICONDUCTOR CORP. |
| 17980617 | METAL VIA MULTI-LEVELS | Final Rejection | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18243197 | ARRAY SUBSTRATE AND DISPLAY DEVICE | Final Rejection | Sharp Display Technology Corporation |
| 18244689 | PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES | Final Rejection | Intel Corporation |
| 18565113 | DISPLAY PANELS | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18455439 | DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDDED THEREIN | Non-Final OA | QUALCOMM Incorporated |
| 18023610 | PRESSURE-SENSITIVE ADHESIVE SHEET, DISPLAY DEVICE AND LAMINATE | Final Rejection | NITTO DENKO CORPORATION |
| 18301823 | QUANTUM DOT COMPOSITION, LIGHT-EMITTING DEVICE USING THE QUANTUM DOT COMPOSITION, AND ELECTRONIC APPARATUS INCLUDING THE LIGHT-EMITTING DEVICE | Non-Final OA | Seoul National University R&DB Foundation |
| 18463807 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | Kioxia Corporation |
| 18295144 | Apparatus and Methods for Plasma Processing | Non-Final OA | Tokyo Electron Limited |
| 18371606 | PHOTODETECTION ELEMENT AND METHOD FOR MANUFACTURING PHOTODETECTION ELEMENT | Non-Final OA | HAMAMATSU PHOTONICS K.K. |
| 18460601 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | Final Rejection | SK hynix Inc. |
| 18460599 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18389717 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 17740618 | Semiconductor Devices and Methods of Manufacture | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18226854 | SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS | Final Rejection | KOKUSAI ELECTRIC CORPORATION |
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