Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2822 2823 2898
This examiner grants 70% of resolved cases
Jarrett J. Stark is an examiner in Tech Center 2800 and Art Unit 2822. He has a high volume of 1295 resolved cases. The examiner demonstrates an allowance rate of 70.5 percent, which indicates that a majority of applications result in a patent grant. This rate provides a predictable baseline for practitioners to assess the likelihood of success when assigned to this examiner.
The median time to allowance is 995 days. This figure represents the typical duration for applications to move from filing to a successful issuance. Practitioners can use this 995 day median to estimate the timeline for their cases in Tech Center 2800. The efficiency shown across 1295 resolved cases is a key feature of the examiner's historical performance.
Direct engagement with the examiner yields an interview lift of 11.5 percent. This positive lift suggests that interviews are an effective tool for further increasing the chances of an allowance. Even with an allowance rate of 70.5 percent, the 11.5 percent lift indicates that verbal communication is a beneficial strategy. These combined metrics offer a comprehensive view of the examination environment in Art Unit 2822.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18658436 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18418765 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18236673 | SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18699682 | STAMP, METHOD FOR MANUFACTURING THE SAME, TRANSFER DEVICE, AND MASS TRANSFER METHOD | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18754990 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18676722 | DISPLAY DEVICE MANUFACTURING APPARATUS AND DISPLAY DEVICE MANUFACTURING METHOD | Non-Final OA | Samsung Display Co., LTD. |
| 18666575 | WINDOW AND DISPLAY DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18623873 | DISPLAY APPARATUS | Final Rejection | Samsung Display Co., LTD. |
| 18126689 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18114536 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18451810 | DEFECT REMOVAL DEVICE, DEFECT REMOVAL METHOD, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18701941 | ARRAY SUBSTRATE AND DISPLAY PANEL | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18582682 | DISPLAY DEVICE | Final Rejection | Innolux Corporation |
| 18399435 | SUBSTRATE HAVING ASYMMETRIC METALLIZATION STRUCTURES DISPOSED ON OPPOSITE SIDES OF A CENTRAL CORE | Final Rejection | QUALCOMM Incorporated |
| 18244689 | PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES | Non-Final OA | Intel Corporation |
| 18129737 | METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRUCTURES FORMED THEREBY | Final Rejection | Intel Corporation |
| 18553602 | SUPERLATTICE, FERROIC ORDER THIN FILMS FOR USE AS HIGH/NEGATIVE-K DIELECTRIC | Final Rejection | The Regents of the University of California |
| 17726286 | INTEGRATED INTERPOSER FOR RF APPLICATION | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 18389717 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18834411 | SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18292492 | IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18611641 | SUBSTRATE WITH SUPPORT AND SEMICONDUCTOR DEVICE | Final Rejection | TOPPAN HOLDINGS INC. |
| 18412826 | INTEGRATED CIRCUIT WITH A PROTECTIVE LAYER | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18458794 | INTEGRATED CIRCUIT HAVING IMPROVED BALL BONDING ADHESION | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18455163 | CAVITY INTEGRATED CIRCUIT | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18277075 | METAL THIN-FILM PRECURSOR COMPOSITION, METHOD OF FORMING THIN FILM USING METAL THIN-FILM PRECURSOR COMPOSITION, AND SEMICONDUCTOR SUBSTRATE FABRICATED USING METHOD | Final Rejection | SOULBRAIN CO., LTD. |
| 18444183 | SEMICONDUCTOR PACKAGE INCLUDING ENCAPSULATION LAYERS | Final Rejection | SK hynix Inc. |
| 18436289 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18391546 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18591976 | DIETHYL ZINC AND METAL HALIDE PRECURSORS FOR DEPOSITION OF METAL FILMS ON SEMICONDUCTOR SUBSTRATES | Final Rejection | Applied Materials, Inc. |
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