Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2822 2823 2898
This examiner grants 70% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18658436 | SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18432459 | SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18374437 | SEMICONDUCTOR PACKAGE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18236673 | SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18834411 | SOLID STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18292492 | IMAGING DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18701941 | ARRAY SUBSTRATE AND DISPLAY PANEL | Non-Final OA | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18754990 | DISPLAY DEVICE | Non-Final OA | SAMSUNG DISPLAY CO., LTD. |
| 18623873 | DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., LTD. |
| 18304473 | APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS | Non-Final OA | Samsung Display Co., Ltd. |
| 18126689 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18114536 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | Final Rejection | Samsung Display Co., Ltd. |
| 18451810 | DEFECT REMOVAL DEVICE, DEFECT REMOVAL METHOD, PATTERN FORMING METHOD, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE | Non-Final OA | FUJIFILM Corporation |
| 18455439 | DEVICE INCLUDING SUBSTRATE WITH PASSIVE ELECTRONIC COMPONENT EMBEDDED THEREIN | Non-Final OA | QUALCOMM Incorporated |
| 18582682 | DISPLAY DEVICE | Final Rejection | Innolux Corporation |
| 18244689 | PACKAGED SEMICONDUCTOR DIE WITH BUMPLESS DIE-PACKAGE INTERFACE FOR BUMPLESS BUILD-UP LAYER (BBUL) PACKAGES | Non-Final OA | Intel Corporation |
| 18129737 | METHODS OF FORMING DIE STRUCTURES WITH SCALLOPED SIDEWALLS AND STRUCTURES FORMED THEREBY | Non-Final OA | Intel Corporation |
| 17726286 | INTEGRATED INTERPOSER FOR RF APPLICATION | Final Rejection | Avago Technologies International Sales Pte. Limited |
| 18553602 | SUPERLATTICE, FERROIC ORDER THIN FILMS FOR USE AS HIGH/NEGATIVE-K DIELECTRIC | Final Rejection | The Regents of the University of California |
| 18389717 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF, MEMORY SYSTEM | Final Rejection | Yangtze Memory Technologies Co., Ltd. |
| 18444183 | SEMICONDUCTOR PACKAGE INCLUDING ENCAPSULATION LAYERS | Final Rejection | SK hynix Inc. |
| 18436289 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR DEVICE | Final Rejection | SK hynix Inc. |
| 18460599 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Non-Final OA | SK hynix Inc. |
| 18412826 | INTEGRATED CIRCUIT WITH A PROTECTIVE LAYER | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18458794 | INTEGRATED CIRCUIT HAVING IMPROVED BALL BONDING ADHESION | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18455163 | CAVITY INTEGRATED CIRCUIT | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18591976 | DIETHYL ZINC AND METAL HALIDE PRECURSORS FOR DEPOSITION OF METAL FILMS ON SEMICONDUCTOR SUBSTRATES | Non-Final OA | Applied Materials, Inc. |
| 18432955 | TEMPORAL CONTROL OF PLASMA PROCESSING | Non-Final OA | Applied Materials, Inc. |
| 18383100 | SURFACE MODIFIERS FOR ENHANCED EPITAXIAL NUCLEATION AND WETTING | Final Rejection | Applied Materials, Inc. |
| 18301823 | QUANTUM DOT COMPOSITION, LIGHT-EMITTING DEVICE USING THE QUANTUM DOT COMPOSITION, AND ELECTRONIC APPARATUS INCLUDING THE LIGHT-EMITTING DEVICE | Non-Final OA | Seoul National University R&DB Foundation |
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