Prosecution Insights
Last updated: April 19, 2026
Application No. 18/454,566

Apparatus for producing silicon carbide crystal

Non-Final OA §102§103
Filed
Aug 23, 2023
Examiner
KUNEMUND, ROBERT M
Art Unit
1714
Tech Center
1700 — Chemical & Materials Engineering
Assignee
Hermes-Epitek Corp.
OA Round
1 (Non-Final)
82%
Grant Probability
Favorable
1-2
OA Rounds
3y 0m
To Grant
96%
With Interview

Examiner Intelligence

Grants 82% — above average
82%
Career Allow Rate
1065 granted / 1301 resolved
+16.9% vs TC avg
Moderate +14% lift
Without
With
+14.2%
Interview Lift
resolved cases with interview
Typical timeline
3y 0m
Avg Prosecution
37 currently pending
Career history
1338
Total Applications
across all art units

Statute-Specific Performance

§101
0.5%
-39.5% vs TC avg
§103
60.4%
+20.4% vs TC avg
§102
11.6%
-28.4% vs TC avg
§112
9.3%
-30.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1301 resolved cases

Office Action

§102 §103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1, 5 and 10 is/are rejected under 35 U.S.C. 102(a)(1) as being clearly anticipated by Jp 2013136494. The Jp 2013136494 reference teaches an apparatus for silicon carbide sublimation, note entire reference. The apparatus consists of a crucible with a top and bottom portion, translation page 2. The silicon carbide powder is placed in the bottom portion, translation page 3. There is an upper portion with a cover and defines the reaction space, note translation page 3. The seed is attached to the cover. There is a composite structure on the cover which consists of multiple graphite layers, note figures no 34d and 32g. The seed is attached to the graphite layers. With regards to claim 5, the Jp 2013136494 reference teaches a support means for the composite on the cover note figure 11 and 12. With regards to claim 10,the Jp 2013136494 reference teaches using a graphite crucible, note translation page 2. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention. Claim(s) 2 is/are rejected under 35 U.S.C. 103 as being unpatentable over Jp 2013136494. In view of Qiao (CN 106757321) The Jp 2013136494 reference is relied on for the same reasons as stated, supra, and differs from the instant claim in the adhesive. However, the Qiao reference teaches using resin adhesives to bond graphite to silicon carbide seeds for sublimation, note translation page 3. It would have been obvious to one of ordinary skill in the art before the filing date of the instant invention to modify the Jp 2013136494 apparatus by the teachings of the Qiao reference to use a resin adhesive in order to ensure that the seed is secure and stable during the process. It is noted, that the Qiao reference teaches resins as set forth in the specification meeting the carbon content. Claim(s) 6 is/are rejected under 35 U.S.C. 103 as being unpatentable over Jp 2013136494. In view of Qiao (CN 106757321) The Jp 2013136494 and Qiao references are relied on for the same reasons as stated, supra, and differs from the instant claim in the bonding areas. However, it would have been obvious to one of ordinary skill in the art before the filing date of the instant invention to modify the combined references to bond the graphite on the sides to the support means in order to uniformly bond the graphite and not ruin the smoothness of the layers. Claim(s) 8 is/are rejected under 35 U.S.C. 103 as being unpatentable over Jp 2013136494. In view of Qiao (CN 106757321) The Jp 2013136494 and Qiao references are relied on for the same reasons as stated, supra, and differs from the instant claim in the graphite area on the cover. However, it would have been obvious to one of ordinary skill in the art before the filing date of the instant invention to modify the combined references to have the graphite area large which contacts the cover in order to have a larger area of contact preventing movement. Claims 3, 4. 7 and 9 objected to as being dependent upon a rejected base claim, but would be allowable if rewritten in independent form including all of the limitations of the base claim and any intervening claims. The prior art does not teach nor render obvious the instantly claimed invention. The prior art does not teach the increase in carbon content in the adhesive as claimed and the thread structure of the graphite layers. Examiner’s Remarks The remaining references are merely cited of interest as showing the state of the art in silicon carbide sublimation apparatus. Any inquiry concerning this communication or earlier communications from the examiner should be directed to ROBERT M KUNEMUND whose telephone number is (571)272-1464. The examiner can normally be reached M-F 8:00 am to 4:30 pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Kaj Olsen can be reached at 571-272-1344. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. RMK /ROBERT M KUNEMUND/Primary Examiner, Art Unit 1714
Read full office action

Prosecution Timeline

Aug 23, 2023
Application Filed
Jan 08, 2026
Non-Final Rejection — §102, §103 (current)

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
82%
Grant Probability
96%
With Interview (+14.2%)
3y 0m
Median Time to Grant
Low
PTA Risk
Based on 1301 resolved cases by this examiner. Grant probability derived from career allow rate.

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