Prosecution Insights
Last updated: August 06, 2026
Application No. 18/455,609

IMAGE SENSOR AND MANUFACTURING METHOD THEREOF

Final Rejection §102§103
Filed
Aug 24, 2023
Priority
Nov 11, 2022 — provisional 63/424,485 +1 more
Examiner
VU, DAVID
Art Unit
2818
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Powertech Technology Inc.
OA Round
2 (Final)
77%
Grant Probability
Favorable
3-4
OA Rounds
0m
Est. Remaining
95%
With Interview

Examiner Intelligence

Grants 77% — above average
77%
Career Allowance Rate
576 granted / 747 resolved
+9.1% vs TC avg
Strong +18% interview lift
Without
With
+18.1%
Interview Lift
resolved cases with interview
Typical timeline
2y 9m
Avg Prosecution
18 currently pending
Career history
759
Total Applications
across all art units

Statute-Specific Performance

§101
0.8%
-39.2% vs TC avg
§103
55.1%
+15.1% vs TC avg
§102
32.8%
-7.2% vs TC avg
§112
8.7%
-31.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 747 resolved cases

Office Action

§102 §103
Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . DETAILED ACTION Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. 1. Claims 1, 3 and 11 are rejected under 35 U.S.C. 102(a2) as being anticipated by Hsu et al. (US 2024/0055453; hereinafter Hsu). Regarding claim 1, Hsu, in fig. 2, discloses an image sensor, comprising: a chip 2 having a sensing area 211, wherein the chip 2 comprises a circuit structure 213/3 surrounding the sensing area 211 (figs. 1-2); a cover 5 covering the chip 2; a first dam layer 6; and a second dam layer 4, wherein the first dam layer 6 and the second dam layer 4 are located between the chip 2 and the cover 5 and surround the sensing area 211, the second dam layer 4 is located between the first dam layer 6 and the chip 2, a width of the first dam layer 6 is greater than a width of the second dam layer 4, and the first dam layer 6 is extended to the sensing area 211 by a distances wherein there is a gap between the first dam layer 6 and a top surface of the circuit structure 213/3, a portion of a bottom surface of the first dam layer 6 is exposed by the gap. Regarding claim 3, Hsu discloses wherein a material of the first dam layer 6 is different from a material of the second dam layer 4 (fig. 2). Regarding claim 11, Hsu discloses wherein the chip comprises a landing pad 213, and the landing pad 213, the first dam layer 6, and the second dam layer 4 are overlapped in an orthographic projection direction (fig. 2). Claim Rejections - 35 USC § 103 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102 of this title, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. 2. Claims 2, 4-6, 8-10 and 12 are rejected under 35 U.S.C. 103 as being unpatentable over by Hsu (US 2024/0055453) in view of Hsu (US 9,419,033). Regarding claim 4, Hsu’453 discloses an image sensor as above but fails to discloses the material of the first and second dam. However, Hsu’033 discloses wherein the first dam layer 122 comprises a photosensitive material, and the second dam layer 121 does not comprise the photosensitive material (col. 3, lines 20-23). It would have been obvious to one of ordinary skill in the art to have the first and second dam materials as taught by Hsu’033, since it has been held to be within the general skill of a worker in the art to select a known material on the basis of its suitability for the intended use as a matter of obvious design choice. In re Leshin, 125 USPQ 416. Regarding claim 2, Hsu’033 discloses wherein a light transmittance of at least one of the first dam layer 122 and the second dam layer 121 is less than or equal to 30% (col. 3, lines 20-23). Regarding claim 5, Hsu’033 discloses wherein a water absorption of at least one of the first dam layer 122 and the second dam layer 121 is less than or equal to 1% (col. 3, lines 20-23). Regarding claim 6, Hsu’033 discloses wherein an outer sidewall of the cover 130, an outer sidewall of the first dam layer 122, an outer sidewall of the second dam layer 121 are aligned with an outer sidewall of the chip 110 (fig. 1). Regarding claim 8, Hsu’033 discloses wherein the second dam layer 121 is extended from the top surface of the circuit structure 114/115 to cover an outer sidewall of the circuit structure 114/115 (fig. 1). Regarding claim 9, Hsu’033 discloses wherein a bottom surface of the second dam layer is lower than a bottom surface of the circuit structure (fig. 1). Regarding claim 10, Hsu’033 discloses wherein the second dam layer 121 has a gradually changing size at an extending portion of the outer sidewall of the circuit structure (col. 3, lines 46-59). Regarding claim 12, Hsu’033 discloses wherein a thickness of the first dam layer 122 is greater than a thickness of the second dam layer 121 (col. 3, lines 56-58). Response to Arguments 3. Applicant's arguments with respect to the pending claims have been considered but are moot in view of the new ground(s) of rejection. Conclusion 4. Applicant's amendment necessitated the new ground(s) of rejection presented in this Office action. Accordingly, THIS ACTION IS MADE FINAL. See MPEP § 706.07(a). Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a). A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any extension fee pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the date of this final action. 5. Any inquiry concerning this communication or earlier communications from the examiner should be directed to David Vu whose telephone number is (571) 272-1798. The examiner can normally be reached on Monday-Friday from 8:00am to 5:00pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempt to reach the examiner by telephone are unsuccessful, the examiner's supervisor, Steven Loke H can be reached on (571) 272-1657. The fax phone number for the organization where this application or proceeding is assigned is (571) 273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /DAVID VU/ Primary Examiner, Art Unit 2818
Read full office action

Prosecution Timeline

Aug 24, 2023
Application Filed
Jan 05, 2026
Non-Final Rejection (signed) — §102, §103
Feb 24, 2026
Non-Final Rejection mailed — §102, §103
May 25, 2026
Response Filed
Jul 30, 2026
Final Rejection mailed — §102, §103 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12701904
DISPLAY DEVICE
2y 7m to grant Granted Aug 04, 2026
Patent 12696562
IMAGE SENSOR
2y 8m to grant Granted Jul 28, 2026
Patent 12696583
MICRO LIGHT EMITTING ELEMENT AND ITS PREPARATION METHOD
2y 7m to grant Granted Jul 28, 2026
Patent 12690485
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LEAD FRAME
2y 5m to grant Granted Jul 21, 2026
Patent 12684986
DISPLAY DEVICE
2y 9m to grant Granted Jul 14, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.
Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

3-4
Expected OA Rounds
77%
Grant Probability
95%
With Interview (+18.1%)
2y 9m (~0m remaining)
Median Time to Grant
Moderate
PTA Risk
Based on 747 resolved cases by this examiner. Grant probability derived from career allowance rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month