Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2818
This examiner grants 77% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18355450 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME | Final Rejection | Samsung Electronics Co., Ltd. |
| 18654143 | PACKAGING STRUCTURE OF OPTICAL COMMUNICATION MODULE AND PRODUCTION METHOD | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18120862 | LIGHT EMITTING STRUCTURE, DISPLAY APPARATUS, AND METHOD OF MANUFACTURING THE DISPLAY APPARATUS | Final Rejection | SAMSUNG DISPLAY CO., LTD. |
| 17865501 | DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., Ltd. |
| 18779475 | HIGH EFFICENT MICRO DEVICES | Non-Final OA | VueReal Inc. |
| 17958288 | PLUG IN A METAL LAYER | Non-Final OA | Intel Corporation |
| 18638429 | SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS | Non-Final OA | NXP B.V. |
| 18779252 | STILTED PAD STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
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