DETAILED ACTION
Response to Amendments
The Amendment filed September 04/14/2026 has been entered. Claims 1, 3, 8, 10, 11, 14, 15, 16, 18, 21, and 23 are amended. Claims 1-30 are pending in the application. Examiner acknowledges the explanation regarding the objection to claim 30 and the objection has been overcome. Examiner acknowledges that applicant amendment to claim 10 overcomes the 112b rejection of Claim 10.
Response to Arguments
Applicant's arguments filed 04/14/2026 have been fully considered but they are not found to be persuasive. Applicant, in remarks (pg. 9) argues cited references do not describe each and every element of the claims regarding the 102 rejections, but does not cite what it is not claimed regarding the non-final rejection dated 01/16/2026. Therefore, no arguments regarding the 102 are considered. Applicant, in remarks (pgs. 9-10) argues no prima facie case of obviousness is made. As no 103 rejections were relied upon in the non-final action dated 01/16/2026, no arguments regarding a 103 rejection are considered.
Applicant’s arguments with respect to claim(s) 1, 11, 16, and 21 have been considered but are moot because the new ground of rejection.
Claim Rejections - 35 USC § 103
The following is a quotation of AIA 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102 of this title, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
Claims 1-30 are rejected under AIA 35 U.S.C. 103 as being unpatentable over Rho (US
12456653 B2) in view of Min (US 20210014964 A1).
Re: Independent Claim 1, Rho discloses:
A package (Rho, semiconductor device; Fig. 1, element 100) comprising:
an integrated device (Rho, semiconductor element unit; Fig. 1, element 32); and
a substrate (Rho, packaging substrate; Fig. 1, element 20) coupled to the integrated device through at least a plurality of solder interconnects (Rho, element connection unit such as solder ball; Fig. 1, element 51, Col 10, lines 54-57), the substrate comprising:
at least one dielectric layer (Rho, upper insulating layer; Fig. 3b, element 253, which can be disposed on first surface, element 213);
a frame (Rho, cavity frame; Fig. 10, element 286) at least partially located in the at least one dielectric layer (Rho, Col. 9, lines 9-16), wherein the frame is distinct from the at least one dielectric layer (Rho, Fig. 10, element 286, Col. 2, line 28 discloses that the cavity frame divides the space into plural districts, and can therefore be considered distinct. As this is a device claim, the formation of the cavity frame does not impart structural limitations and limit how to consider the cavity frame ‘distinct from the at least one dielectric layer’, i.e. the cavity can be considered ‘distinct’ broadly and a person of ordinary skill in the art would consider the frame distinct from the at least one dielectric layer),
and a plurality of interconnects (Rho, element connection unit; Fig. 1, Col 10, lines 54-57) located at least partially in the at least one dielectric layer.
Rho does not explicitly disclose:
wherein the first frame comprises a metal frame
Min discloses:
wherein the frame (Min, frame member; Fig. 11, element 30) comprises a metal frame (Min, ¶ [0027]).
Rho discloses a frame and discloses that the frame may be substantially made of the same material as the glass substrate, but does not explicitly disclose the frame to be a metal frame. Min discloses the use of a metal frame within an electronic device. Both Rho and Min disclose the use of frames within packages and are therefore analogous art. It would be obvious to a person of ordinary skill in the art (POSITA) before the effective filing date to make the frame disclosed by Rho a metal frame, as disclosed by Min, arriving at the invention as claimed, for the purpose of increasing package strength and preventing thermal deformation (Min, ¶ [0027]).
Re: Dependent Claim 2, Rho and Min disclose(s) all the limitations of claim 1 on which this claim depends. Rho further discloses:
wherein the substrate (Rho, packaging substrate; Fig. 1, element 20) includes a core layer (Rho, core layer; Fig. 3b, element 22), wherein the frame (Rho, cavity frame; Fig. 9, element 286) is surrounded at least partially by the core layer.
Re: Dependent Claim 3, Rho and Min disclose(s) all the limitations of claim 2 on which this claim depends. Rho further discloses:
wherein the frame (Rho, cavity frame; Fig. 9, element 286) touches the at least one dielectric layer (Rho, upper insulating layer; Fig. 3b, element 253, which can be disposed on first surface, element 213),
wherein the frame includes a ring pattern (Rho, frame through hole; Fig. 10, element 287, can be considered a ring pattern) along a horizontal plane of the at least one dielectric layer (Rho, the ring pattern extends both horizontally and vertically, and therefore runs along a horizontal plane of the at least one dielectric layer), and
wherein the at least one dielectric layer comprises a polymer, prepreg, and/or Ajinomoto Build-up Film (ABF) (Rho, Col. 9, lines 24-29 discloses that the layer 253 can be made of any material, such as epoxy-based resin, which is a polymer).
Re: Dependent Claim 4, Rho and Min disclose(s) all the limitations of claim 2 on which this claim depends. Rho further discloses:
wherein the core layer (Rho, core layer; Fig. 3b, element 22) includes a cavity (Rho, cavity unit; Fig. 3b, element 28), and wherein the frame (Rho, cavity frame; Fig. 10, element 286, is located at least partially in the cavity of the core layer (Rho, core layer; Fig. 3b, element 22). Fig. 10 in Rho shows the frame (element 286) in the cavity (element 28), within the glass substrate (element 21) which is within the core layer (element 22), as shown in Fig. 8.
Re: Dependent Claim 5, Rho and Min disclose(s) all the limitations of claim 4 on which this claim depends. Rho further discloses:
wherein at least part of the cavity (Rho, cavity unit; Fig. 3b, element 28) of the core layer (Rho, core layer; Fig. 3b, element 22) is occupied by the at least one dielectric layer (Rho, Cavity insulating layer; Fig.4, element 284, Col. 12, lines 29-48).
Re: Dependent Claim 6, Rho and Min disclose(s) all the limitations of claim 1 on which this claim depends. Rho further discloses:
wherein at least part of the frame (Rho, cavity frame; Fig. 9, element 286) is located along a periphery of the substrate (Rho, packaging substrate; Fig. 1, element 20). Fig. 4a of Rho shows the boundary or edges (periphery) of the substrate (element 20), and Fig. 9 shows at least part of the frame (element 286) located along the boundary/edge of the substrate.
Re: Dependent Claim 7, Rho and Min disclose(s) all the limitations of claim 1 on which this claim depends. Rho further discloses:
wherein the frame (Rho, cavity frame; Fig. 10, element 286) includes a different material (Rho, cavity frame may be made of substantially the same material as the glass substrate, Col. 6, lines 36-37, the substrate materials are listed on Col.7, lines 14-16) from the plurality of interconnects (Rho, element conversion unit; Fig. 1, element 51).
Re: Dependent Claim 8, Rho and Min disclose(s) all the limitations of claim 1 on which this claim depends. Rho further discloses:
wherein the frame (Rho, cavity frame; Fig. 10, element 286) is an embedded frame (Rho, Col. 5 and 6, lines 67-5), and wherein the package further comprises a second frame (Rho, supporting unit; Fig. 7, element 285) coupled to a first surface (Rho, side wall pattern; Fig. 4, element 283a, can be considered a first surface) of the substrate (Rho, packaging substrate; Fig. 1, element 20).
Re: Dependent Claim 9, Rho and Min disclose(s) all the limitations of claim 8 on which this claim depends. Rho further discloses:
wherein the surface (Rho, side wall pattern; Fig. 4, element 283a) of the substrate is a landside surface of the substrate (Rho, electrically conductive pattern, Col. 12, lines 29-38).
Re: Dependent Claim 10, Rho and Min disclose(s) all the limitations of claim 8 on which this claim depends. Rho further discloses:
further comprising a third frame (Rho, cavity distribution layer; Fig. 7, element 282) coupled to another surface of the substrate (Rho, element 282 is on another surface of the substrate, element 20).
Re: Independent Claim 11, Rho discloses:
A package comprising (Rho, semiconductor device; Fig. 1, element 100):
an integrated device (Rho, semiconductor element unit; Fig. 1, element 32);
a substrate (Rho, packaging substrate; Fig. 1, element 20) coupled to the integrated device through at least a plurality of solder interconnects (Rho, element connection unit such as solder ball; Fig. 1, element 51, Col 10, lines 54-57), wherein the integrated device is coupled to a first surface of the substrate (Rho, packaging substrate; Fig. 1, element 20, Rho shows this on the top surface of the packaging substrate, element 20), the substrate comprising:
at least one dielectric layer (Rho, upper insulating layer; Fig. 3b, element 253, which can be disposed on first surface, element 213); and
a plurality of interconnects (Rho, element connection unit; Fig. 1, Col 10, lines 54-57) located at least partially in the at least one dielectric layer;
a second plurality of solder interconnects (Rho, board connection unit, Fig. 1, element 52) coupled to a second surface of the substrate (Rho, Fig. 1 shows this on the bottom surface of the packaging substrate, element 20); and
and a first frame (Rho, cavity frame; Fig.9, element 286) coupled to the second surface of the substrate, wherein the first frame is distinct from the at least one dielectric layer (Rho, Fig. 10, element 286, Col. 2, line 28 discloses that the cavity frame divides the space into plural districts, and can therefore be considered distinct. As this is a device claim, the formation of the cavity frame does not impart structural limitations and limit how to consider the cavity frame ‘distinct from the at least one dielectric layer’, i.e. the cavity can be considered ‘distinct’ broadly and a person of ordinary skill in the art would consider the frame distinct from the at least one dielectric layer).
Rho does not explicitly disclose:
wherein the first frame comprises a metal frame
Min discloses:
wherein the frame (Min, frame member; Fig. 11, element 30) comprises a metal frame (Min, ¶ [0027]).
Rho discloses a frame and discloses that the frame may be substantially made of the same material as the glass substrate, but does not explicitly disclose the frame to be a metal frame. Min discloses the use of a metal frame within an electronic device. Both Rho and Min disclose the use of frames within packages and are therefore analogous art. It would be obvious to a person of ordinary skill in the art (POSITA) before the effective filing date to make the frame disclosed by Rho a metal frame, as disclosed by Min, arriving at the invention as claimed, for the purpose of increasing package strength and preventing thermal deformation (Min, ¶ [0027]).
Re: Dependent Claim 12, Rho and Min disclose(s) all the limitations of claim 11 on which this claim depends. Rho further discloses:
further comprising a second frame (Rho, supporting unit; Fig. 7b, element 285) coupled to the first surface of the substrate (Rho, Fig. 8 shows that the second frame is coupled to the top surface of the packaging substrate, element 20).
Re: Dependent Claim 13, Rho and Min disclose(s) all the limitations of claim 11 on which this claim depends. Rho further discloses:
wherein the substrate (Rho, packaging substrate; Fig. 1, element 20) includes a core layer (Rho, core layer; Fig. 3b, element 22).
Re: Dependent Claim 14, Rho and Min disclose(s) all the limitations of claim 11 on which this claim depends. Rho further discloses:
wherein the substrate (Rho, packaging substrate; Fig. 1, element 20) includes an embedded frame (Rho, cavity frame; supporting unit, Figs 7 and 10, element 286, and 285, respectively, can make up an embedded frame Col. 5 and 6, lines 67-5) located in the substrate, and wherein the embedded frame includes a contiguous ring pattern (Rho, frame through hole; Fig. 10, element 287, can be considered a contiguous ring pattern located on a portion of the embedded frame) along a horizontal plane of the at least one dielectric layer (Rho, upper insulating layer; Fig. 3b, element 253, which can be disposed on first surface, element 213, the contiguous ring pattern extends both horizontally and vertically, and therefore runs along a horizontal plane of the at least one dielectric layer).
Re: Dependent Claim 15, Rho and Min disclose(s) all the limitations of claim 14 on which this claim depends. Rho further discloses:
wherein the embedded frame (Rho, cavity frame; supporting unit, Figs 7 and 10, element 286, and 285, respectively, can make up an embedded frame Col. 5 and 6, lines 67-5) touches the at least one dielectric layer (Rho, upper insulating layer; Fig. 3b, element 253, which can be disposed on first surface, element 213),
wherein the embedded frame includes a portion that extends diagonally along a horizontal plane of the at least one dielectric layer (Rho, supporting unit 285 has a portion that extends diagonally along a horizontal plane of the dielectric layer), and
wherein the at least one dielectric layer comprises a polymer, prepreg and/or Ajinomoto Build-up Film (ABF) (Rho, Col. 9, lines 24-29 discloses that the layer 253 can be made of any material, such as epoxy-based resin, which is a polymer).
Re: Independent Claim 16, Rho discloses:
A substrate (Rho, packaging substrate; Fig. 1, element 20) comprising:
at least one dielectric layer (Rho, upper insulating layer; Fig. 3b, element 253, which can be disposed on first surface, element 213);
a first frame (Rho, cavity frame; Fig. 10, element 286) at least partially located in the at least one dielectric layer, wherein the first frame is distinct from the at least one dielectric layer (Rho, Fig. 10, element 286, Col. 2, line 28 discloses that the cavity frame divides the space into plural districts, and can therefore be considered distinct. As this is a device claim, the formation of the cavity frame does not impart structural limitations and limit how to consider the cavity frame ‘distinct from the at least one dielectric layer’, i.e. the cavity can be considered ‘distinct’ broadly and a person of ordinary skill in the art would consider the frame distinct from the at least one dielectric layer);
and a plurality of interconnects (Rho, element connection unit; Fig. 1, Col 9, lines 9-16 and Col 10, lines 54-57) located at least partially in the at least one dielectric layer.
Rho does not explicitly disclose:
wherein the first frame comprises a metal frame
Min discloses:
wherein the frame (Min, frame member; Fig. 11, element 30) comprises a metal frame (Min, ¶ [0027]).
Rho discloses a frame and discloses that the frame may be substantially made of the same material as the glass substrate, but does not explicitly disclose the frame to be a metal frame. Min discloses the use of a metal frame within an electronic device. Both Rho and Min disclose the use of frames within packages and are therefore analogous art. It would be obvious to a person of ordinary skill in the art (POSITA) before the effective filing date to make the frame disclosed by Rho a metal frame, as disclosed by Min, arriving at the invention as claimed, for the purpose of increasing package strength and preventing thermal deformation (Min, ¶ [0027]).
Re: Dependent Claim 17, Rho and Min disclose(s) all the limitations of claim 16 on which this claim depends. Rho further discloses:
wherein the substrate (Rho, packaging substrate; Fig. 1, element 20) includes a core layer (Rho, core layer; Fig. 3b, element 22), wherein the first frame (Rho, cavity frame; Fig. 9, element 286) is surrounded at least partially by the core layer.
Re: Dependent Claim 18, Rho and Min disclose(s) all the limitations of claim 16 on which this claim depends. Rho further discloses:
wherein the first frame (Rho, cavity frame; Fig. 9, element 286) touches the at least one dielectric layer (Rho, upper insulating layer; Fig. 3b, element 253, which can be disposed on first surface, element 213),
wherein the first frame includes a contiguous ring pattern (Rho, frame through hole; Fig. 10, element 287, can be considered a contiguous ring pattern located on a portion of the embedded frame) along a horizontal plane of the at least one dielectric layer, and
wherein the at least one dielectric layer comprises a polymer, prepreg and/or Ajinomoto Build-up Film (ABF) (Rho, Col. 9, lines 24-29 discloses that the layer 253 can be made of any material, such as epoxy-based resin, which is a polymer).
Re: Dependent Claim 19, Rho and Min disclose(s) all the limitations of claim 17 on which this claim depends. Rho further discloses:
wherein the core layer (Rho, core layer; Fig. 3b, element 22), includes a cavity (Rho, cavity unit, Fig. 3b, element 28), and wherein the first frame (Rho, cavity frame; Fig. 9, element 286) is located at least partially in the cavity of the core layer. (Fig. 10 of Rho shows the frame (element 286) in the cavity (element 28), within the glass substrate (element 21) which is within the core layer (element 22), as shown in Fig. 8).
Re: Dependent Claim 20, Rho and Min disclose(s) all the limitations of claim 19 on which this claim depends. Rho further discloses:
wherein at least part of the cavity (Rho, cavity unit, Fig. 3b, element 28) of the core layer (Rho, core layer; Fig. 3b, element 22), is occupied by the at least one dielectric layer (Rho, Cavity insulating layer; Fig.4, element 284, Col. 12, lines 29-48).
Re: Independent Claim 21, Rho discloses:
A method (Rho, Col. 14, line 1) for fabricating a package, comprising:
providing a substrate (Rho, packaging substrate; Fig. 1, element 20) comprising:
at least one dielectric layer (Rho, upper insulating layer; Fig. 3b, element 253, which can be disposed on first surface, element 213);
a frame (Rho, supporting unit, cavity frame; Fig. 9, elements 285 and 286, respectively, can make up a frame) at least partially located in the at least one dielectric layer (Rho, upper insulating layer; Fig. 3b, element 253, which can be disposed on first surface, element 213), wherein the frame is distinct from the at least one dielectric layer (Rho, Fig. 10, element 286, Col. 2, line 28 discloses that the cavity frame divides the space into plural districts, and can therefore be considered distinct. The method claim limitation as written does not require the frame to be formed any particular way. A person of ordinary skill in the art would consider the frame distinct from the at least one dielectric layer when the word ‘distinct’ is interpreted broadly); and
a plurality of interconnects (Rho, element connection unit; Fig. 1, Col 9, lines 9-16 and Col 10, lines 54-57) located at least partially in the at least one dielectric layer; and
coupling an integrated device (Rho, semiconductor element unit; Fig. 1, element 32) to the substrate through at least a plurality of solder interconnects.
Rho does not explicitly disclose:
wherein the first frame comprises a metal frame
Min discloses:
wherein the frame (Min, frame member; Fig. 11, element 30) comprises a metal frame (Min, ¶ [0027]).
Rho discloses a frame and discloses that the frame may be substantially made of the same material as the glass substrate, but does not explicitly disclose the frame to be a metal frame. Min discloses the use of a metal frame within an electronic device. Both Rho and Min disclose the use of frames within packages and are therefore analogous art. It would be obvious to a person of ordinary skill in the art (POSITA) before the effective filing date to make the frame disclosed by Rho a metal frame, as disclosed by Min, arriving at the invention as claimed, for the purpose of increasing package strength and preventing thermal deformation (Min, ¶ [0027]).
Re: Dependent Claim 22, Rho and Min disclose(s) all the limitations of claim 21 on which this claim depends. Rho further discloses:
wherein the substrate (Rho, packaging substrate; Fig. 1, element 20) includes a core layer (Rho, core layer; Fig. 3b, element 22), wherein the frame (Rho, cavity frame; Fig. 9, element 286) is surrounded at least partially by the core layer.
Re: Dependent Claim 23, Rho and Min disclose(s) all the limitations of claim 22 on which this claim depends. Rho further discloses:
wherein the frame (Rho, supporting unit, cavity frame; Fig. 9, elements 285 and 286, respectively, can make up a frame) touches the at least one dielectric layer (Rho, upper insulating layer; Fig. 3b, element 253, which can be disposed on first surface, element 213),
wherein the frame includes a portion that extends diagonally along a horizontal plane of the at least one dielectric layer (Rho, supporting unit 285 has a portion that extends diagonally along a horizontal plane of the dielectric layer), and
wherein the at least one dielectric layer comprises a polymer, prepreg and/or Ajinomoto Build-up Film (ABF) (Rho, Col. 9, lines 24-29 discloses that the layer 253 can be made of any material, such as epoxy-based resin, which is a polymer).
Re: Dependent Claim 24, Rho and Min disclose(s) all the limitations of claim 22 on which this claim depends. Rho further discloses:
wherein the core layer (Rho, core layer; Fig. 3b, element 22), includes a cavity (Rho, cavity unit, Fig. 3b, element 28), and wherein the frame is located at least partially in the cavity of the core layer. (Fig. 10 of Rho shows the frame (elements 285 286) at least partially in the cavity (element 28), within the glass substrate (element 21) which is within the core layer (element 22), as shown in Fig. 8).
Re: Dependent Claim 25, Rho and Min disclose(s) all the limitations of claim 24 on which this claim depends. Rho further discloses:
wherein at least part of the cavity (Rho, cavity unit, Fig. 3b, element 28) of the core layer (Rho, core layer; Fig. 3b, element 22), is occupied by the at least one dielectric layer (Rho, Cavity insulating layer; Fig.4, element 284, Col. 12, lines 29-48).
Re: Dependent Claim 26, Rho and Min disclose(s) all the limitations of claim 21 on which this claim depends. Rho further discloses:
wherein at least part of the frame (Rho, supporting unit, cavity frame; Fig. 9, elements 285 and 286, respectively, make up the frame) is located along a periphery of the substrate (Rho, packaging substrate; Fig. 1, element 20). Fig. 4a of Rho shows the boundary or edges (periphery) of the substrate (element 20), and Fig. 9 shows at least part of the frame (element 286) located along the boundary/edge of the substrate).
Re: Dependent Claim 27, Rho and Min disclose(s) all the limitations of claim 21 on which this claim depends. Rho further discloses:
wherein the frame (Rho, supporting unit, cavity frame; Fig. 9, elements 285 and 286, respectively, make up the frame) includes a different material (Rho, cavity frame may be made of substantially the same material as the glass substrate, Col. 6, lines 36-37, the substrate materials are listed on Col.7, lines 14-16) from the plurality of interconnects (Rho, element conversion unit; Fig. 1, Col 9, lines 9-16 and Col 10, lines 54-57).
Re: Dependent Claim 28, Rho and Min disclose(s) all the limitations of claim 21 on which this claim depends. Rho further discloses:
wherein the frame (Rho, cavity frame; Fig. 10, element 286) is an embedded frame (Rho, Col. 5 and 6, lines 67-5), and wherein the method further comprises coupling a second frame (Rho, supporting unit; Fig. 7b, element 285) to a surface of the substrate (Rho, Fig. 8, frame is coupled to the surface of the substrate).
Re: Dependent Claim 29, Rho and Min disclose(s) all the limitations of claim 28 on which this claim depends. Rho further discloses:
wherein the surface (Rho, side wall pattern; Fig. 4, element 283a) of the substrate (Rho, package substrate, Fig. 1, element 20) is a landside surface of the substrate (Rho, electrically conductive pattern, Col. 12, lines 29-38).
Re: Dependent Claim 30, Rho and Min disclose(s) all the limitations of claim 28 on which this claim depends. Rho further discloses:
further comprising coupling a third frame (Rho, cavity distribution layer; Fig. 7, element 282) to another surface of the substrate (Rho, package substrate; Fig.1, element 20).
Conclusion
THIS ACTION IS MADE FINAL. Applicant is reminded of the extension of time policy as set forth in 37 CFR 1.136(a).
A shortened statutory period for reply to this final action is set to expire THREE MONTHS from the mailing date of this action. In the event a first reply is filed within TWO MONTHS of the mailing date of this final action and the advisory action is not mailed until after the end of the THREE-MONTH shortened statutory period, then the shortened statutory period will expire on the date the advisory action is mailed, and any nonprovisional extension fee (37 CFR 1.17(a)) pursuant to 37 CFR 1.136(a) will be calculated from the mailing date of the advisory action. In no event, however, will the statutory period for reply expire later than SIX MONTHS from the mailing date of this final action.
Any inquiry concerning this communication or earlier communications from the examiner should be directed to NIMARTA KAUR CHOWDHARY whose telephone number is (571)272-7679. The examiner can normally be reached usually Monday - Thursday, 6:45 AM - 4:45 PM (EST).
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Leonard Chang can be reached at (571) 270-3691. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/NIMARTA KAUR CHOWDHARY/ Examiner, Art Unit 2898
/Leonard Chang/ Supervisory Patent Examiner, Art Unit 2898
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