Tech Center 4100 • Art Units: 2898 4100
This examiner grants 100% of resolved cases
Nimarta Kaur Chowdhary works in Art Unit 2898 of Tech Center 4100, where the examiner has 5 resolved cases. The allowance rate is 100.0 percent. This metric shows that every application in this small sample resulted in a grant. The median days to allowance is 1050, which describes the time required for the prosecution process to reach completion.
The interview lift is 0.0 percent. This figure indicates that interviews did not change the probability of success compared to the baseline. Practitioners can use this 0.0 percent lift to prioritize other strategies in Art Unit 2898. The 5 cases provide the initial data for these observations.
The 1050 median days to allowance serves as a timeline for applicants in Tech Center 4100. With an allowance rate of 100.0 percent, the data reflects a consistent outcome for the 5 resolved cases. These metrics offer a preliminary view of the examiner's practice. The record helps in understanding the specific procedural environment.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18508566 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18818587 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18596294 | LIGHT EMITTING DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18393149 | MICROELECTRONIC DEVICE COMPRISING LARGE CONTACT SURFACES BETWEEN THE CONDUCTION CHANNEL AND THE SOURCE AND DRAIN REGIONS | Final Rejection | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
| 18418385 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Magnolia White Corporation |
| 18450541 | PHOTOELECTRIC CONVERSION APPARATUS, DEVICE, AND METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION APPARATUS | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18456295 | PACKAGE COMPRISING A SUBSTRATE WITH AN EMBEDDED FRAME | Non-Final OA | QUALCOMM Incorporated |
| 18303932 | NANORIBBON-BASED TRANSISTOR WITH UNIFORM OXIDE | Non-Final OA | Intel corporation |
| 18889394 | THIN FILM TRANSISTOR AND ELECTRONIC DEVICE | Non-Final OA | IDEMITSU KOSAN CO., LTD. |
| 18806062 | EMBEDDED CHIP-PACKAGE, SEMICONDUCTOR PACKAGE, METHOD OF FORMING AN EMBEDDED CHIP-PACKAGE, METHOD OF FORMING A SEMICONDUCTOR PACKAGE, AND METHOD OF ANALYZING AN EMBEDDED CHIP-PACKAGE OR A SEMICONDUCTOR PACKAGE | Non-Final OA | Infineon Technologies AG |
| 18822607 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Non-Final OA | Kioxia Corporation |
| 18524383 | THERMAL ENHANCED ELECTRONIC DEVICE PACKAGE | Non-Final OA | Texas Instruments Incorporated |
| 18523480 | RECESSED CLIP PAD FOR PASSIVE SURFACE MOUNT COMPONENT | Non-Final OA | Texas Instruments Incorporated |
| 18410813 | MULTI-LAYER ALIGNMENT MARK STRUCTURE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18523402 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18525313 | BIAS TRIGGERED MODE-SWITCHABLE PHOTODETECTOR FROM BROADBAND TO NEAR INFRARED | Non-Final OA | Purdue Research Foundation |
| 18399242 | ARRAY SUBSTRATE AND DISPLAY PANEL | Final Rejection | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
| 18714708 | OPTICAL SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING OPTICAL SEMICONDUCTOR PACKAGE | Non-Final OA | HAMAMATSU PHOTONICS K.K. |
| 18542817 | SEMICONDUCTOR DEVICE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18453191 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | Final Rejection | Amkor Technology Singapore Holding Pte. Ltd. |
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