DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Election/Restrictions
Applicant’s election without traverse of claims 1-15 in the reply filed on 1/6/2026 is acknowledged.
Claims 16-20 withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected method claims, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 1/6/2026.
Claim Rejections - 35 USC § 102
In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis (i.e., changing from AIA to pre-AIA ) for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status.
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
(a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention.
Claims 1-15 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Shin (20220238433)
Claims 1-15 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Shin (20220238433).
Regarding Claim 1, in Fig. 2, Shin et al. discloses an integrated circuit device comprising: a lower metal wire 220; an upper metal wire 240 on the lower metal wire; a metal via 230 between the lower metal wire and the upper metal wire, the metal via comprising a lower surface 231 and an upper surface 232U that respectively contact the lower metal wire and the upper metal wire; and a barrier layer 245 extending on a side surface of the metal via, wherein an upper portion of the barrier layer extends upwardly beyond a lower surface (for example the near the two tip portions immediately to the right and immediately to the left of 232U) of the upper metal wire 240.
Regarding Claim 2, a side surface of the upper portion of the barrier layer 245 contacts the upper metal wire 240.
Regarding Claim 3, the barrier layer 245 comprises nitrogen (see paragraph 0032).
Regarding Claim 4, an interface between the upper surface of the metal via 230 and the upper metal wire 240 is devoid of nitrogen (i.e graphene, see paragraph 0032).
Regarding Claim 5, an adhesion layer 260 contacting (where “contact” does not necessarily mean direct contact) the lower surface of the upper metal wire 240, wherein the adhesion layer comprises a material different from the barrier layer (i.e. oxide material) (please see paragraph 0029 and 0034)
Regarding Claim 6, a side surface of the upper portion of the barrier layer 245 contacts (where “contact” does not mean direct contact) the adhesion layer 260
Regarding Claim 7, the adhesion layer 260 comprises a portion that separates a side surface of the upper portion of the barrier layer 245 from the upper metal wire 240 (near the top left and top right portions of 232U in Fig. 2)
Regarding Claim 8, of the metal via 230 and the upper metal wire 240 comprises ruthenium (Ru) or molybdenum (Mo) (see paragraphs 0025 and 0029)
Regarding Claim 9, in Fig. 2, Shin et al. discloses an integrated circuit device comprising: an insulating layer 211/212/213; a metal via 230 in the insulating layer; an upper metal wire 240 on the insulating layer and the metal via, an upper surface of the metal via 230 contacting the upper metal wire 240; and a barrier layer 245 extending on a side surface of the metal via 230, wherein an upper portion of the barrier layer 245 is in the upper metal wire 240.
Regarding Claim 10, a side surface of the upper portion of the barrier layer 245 contacts (where “contact” does not necessarily mean direct contact) the upper metal wire 240.
Regarding Claim 11, an entirety of the upper surface of the metal via 230 contacts (where “contact” does not necessarily mean direct contact) the upper metal wire 240.
Regarding Claim 12, an interface between the upper surface of the metal via 230 and the upper metal wire 240 is devoid of nitrogen (i.e graphene, see paragraph 0032).
Regarding Claim 13, an adhesion layer 260 contacting (where “contact” does not necessarily mean direct contact) a lower surface of the upper metal wire 240, wherein the adhesion layer comprises a material different from the barrier layer (i.e. oxide material) (please see paragraph 0029 and 0034)
Regarding Claim 14, a side surface of the upper portion of the barrier layer 245 contacts (where “contact” does not necessarily mean direct contact) the adhesion layer 260.
Regarding Claim 15, the adhesion layer 260 comprises a portion that separates a side surface of the upper portion of the barrier layer 245 from the upper metal wire 240 (near the top left and top right portion of 232U in Fig. 2)
Cited Relevant Prior Arts That are NOT Relied Upon
Examiner is including following prior arts as relevant/pertinent arts that are NOT relied upon on this rejection, but that do disclose via/barrier structure protruding towards the upper wiring layer.
Hwang et al. (20200219808)
Kang et al. (20250006641)
Choi et al. (20230369111)
Lee et al. (20250316582)
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to FAZLI ERDEM whose telephone number is (571)272-1914. The examiner can normally be reached M-F, 8am-5pm.
Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice.
If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Davienne Monbleau can be reached at 571-272-1945. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000.
/FAZLI ERDEM/Primary Examiner, Art Unit 2812 2/25/2026