Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2811 2812 2826
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18667258 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18682940 | DISPLAY PANEL, METHOD FOR PREPARING SAME, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18734056 | PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE | Non-Final OA | HUAWEI TECHNOLOGIES CO., LTD. |
| 18346087 | HIGH CONDUCTIVITY TRANSISTOR CONTACTS COMPRISING GALLIUM ENRICHED LAYER | Non-Final OA | Intel Corporation |
| 18216830 | PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH | Non-Final OA | Intel Corporation |
| 18194303 | VARACTOR COMPRISING HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL | Non-Final OA | Intel Corporation |
| 18428472 | PARTIALLY PULSE-PLATED BOND PADS | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18679331 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18660264 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
| 18433120 | DUAL FACING BSI IMAGE SENSORS WITH WAFER LEVEL STACKING | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18533285 | DISPLAY ELEMENT AND MANUFACTURING METHOD THEREOF | Final Rejection | AUO Corporation |
| 18545760 | Stacked SRAM Cell with a Dual-Side Interconnect Structure | Non-Final OA | Katholieke Universiteit Leuven |
| 18614965 | MODULE | Non-Final OA | Murata Manufacturing Co., Ltd. |
| 18395203 | APPARATUS, SYSTEM, AND METHOD FOR UNIQUELY IDENTIFYING INDIVIDUAL DIES ACROSS DIE STACKS | Final Rejection | Advanced Micro Devices, Inc. |
| 18654117 | FLATTENING AND SMOOTHING METALLIC WAFERS AND PLATES FOR FLEXIBLE ELECTRONICS | Non-Final OA | The Research Foundation for the State University of New York |
| 18779114 | TRANSISTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | Non-Final OA | Powerchip Semiconductor Manufacturing Corporation |
| 18687298 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, TEMPORARY-FIXING MATERIAL, AND APPLICATION FOR MANUFACTURING SEMICONDUCTOR DEVICE OF TEMPORARY-FIXING MATERIAL | Non-Final OA | Resonac Corporation |
| 18725965 | METHOD FOR MANUFACTURING GATE-ALL-AROUND NANOSHEET STRUCTURE | Non-Final OA | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
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