Tech Center 2800 • Art Units: 2811 2812 2826
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18383532 | SEMICONDUCTOR DEVICE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18486416 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18459894 | INTEGRATED CIRCUIT DEVICES INCLUDING A CONDUCTIVE VIA AND METHODS OF FORMING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18231547 | MANUFACTURING METHOD OF DIAMOND COMPOSITE WAFER | Final Rejection | ETRON TECHNOLOGY, INC. |
| 18386363 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | LG Display Co., Ltd. |
| 18523508 | PHOTOELECTRIC CONVERSION APPARATUS | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18383533 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF, DISPLAY DEVICE, ARRAY SUBSTRATE | Non-Final OA | Tianma Advanced Display Technology Institute (Xiamen) Co., Ltd. |
| 18742974 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18308445 | SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR MODULE | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18533285 | DISPLAY ELEMENT AND MANUFACTURING METHOD THEREOF | Non-Final OA | AUO Corporation |
| 17551998 | VIA ALIGNMENT IN SINGLE DAMASCENE STRUCTURE | Non-Final OA | INTERNATIONAL BUSINESS MACHINES CORPORATION |
| 18118257 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Silergy Semiconductor Technology (Hangzhou) LTD |
| 18754948 | SEMICONDUCTOR INTEGRATED CIRCUIT | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18472768 | SEMICONDUCTOR DEVICE INCLUDING HIGH CONDUCTIVITY GATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18538738 | INTEGRATED CIRCUIT DEVICE INCLUDING THERMAL INTERPOSER LAYER | Non-Final OA | QUALCOMM Incorporated |
| 18463237 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18463138 | SEMICONDUCTOR DEVICE | Non-Final OA | Toshiba Electronic Devices & Storage Corporation |
| 18395203 | APPARATUS, SYSTEM, AND METHOD FOR UNIQUELY IDENTIFYING INDIVIDUAL DIES ACROSS DIE STACKS | Non-Final OA | Advanced Micro Devices, Inc. |
| 18375617 | SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR DEVICE WITH AIR SPACERS, AND METHOD FOR FABRICATING THE SAME | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18079031 | METAL-OXIDE SEMICONDUCTOR FIELD-EFFECT TRANSISTOR HAVING ENHANCED HIGH-FREQUENCY PERFORMANCE | Non-Final OA | SHANGHAI BRIGHT POWER SEMICONDUCTOR CO., LTD. |
| 17889834 | METAL-OXIDE SEMICONDUCTOR FIELD-EFFECT TRANSISTOR HAVING ENHANCED HIGH-FREQUENCY PERFORMANCE AND METHODS FOR FABRICATING SAME | Non-Final OA | SHANGHAI BRIGHT POWER SEMICONDUCTOR CO., LTD. |
| 18373488 | VERTICALLY STACKED LIGHT-EMITTING DIODE STRUCTURE | Final Rejection | RAYLEIGH VISION LIMITED |
| 18421158 | SHIELDING STRUCTURE FOR ULTRA-HIGH VOLTAGE SEMICONDUCTOR DEVICES | Non-Final OA | Taiwan Semiconductor Manufacuturing Company, Ltd. |
| 18125610 | SEMICONDUCTOR DEVICES WITH INTEGRATED TEST STRUCTURES | Non-Final OA | Woflspeed, Inc. |
| 18547645 | CIRCUIT PANEL USING SIDE WALL WIRING AND METHOD OF FORMING SIDE WALL WIRING | Non-Final OA | APIOTECH CO., LTD. |
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