Prosecution Insights
Last updated: July 17, 2026
Application No. 18/463,259

HIGH SENSITIVITY MAGNETIC SENSING MATRIX CHIP WITH TWO-DIMENSIONAL ELECTRONIC GAS CHANNEL STRUCTURE AND THE MANUFACTURING PROCESS

Non-Final OA §103§112
Filed
Sep 07, 2023
Priority
Jul 25, 2023 — CN 202310917836.7
Examiner
CRAWFORD EASON, LATANYA N
Art Unit
2813
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Dalian University of Technology
OA Round
1 (Non-Final)
78%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
79%
With Interview

Examiner Intelligence

Grants 78% — above average
78%
Career Allowance Rate
726 granted / 927 resolved
+10.3% vs TC avg
Minimal +0% lift
Without
With
+0.3%
Interview Lift
resolved cases with interview
Typical timeline
2y 8m
Avg Prosecution
27 currently pending
Career history
966
Total Applications
across all art units

Statute-Specific Performance

§101
0.3%
-39.7% vs TC avg
§103
83.4%
+43.4% vs TC avg
§102
10.6%
-29.4% vs TC avg
§112
3.7%
-36.3% vs TC avg
Black line = Tech Center average estimate • Based on career data from 927 resolved cases

Office Action

§103 §112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election of claims 1-7 in the reply filed on 2/24/2026 is acknowledged. Because applicant did not distinctly and specifically point out the supposed errors in the restriction requirement, the election has been treated as an election without traverse (MPEP § 818.01(a)). Claim Rejections - 35 USC § 112 The following is a quotation of the first paragraph of 35 U.S.C. 112(a): (a) IN GENERAL.—The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor or joint inventor of carrying out the invention. The following is a quotation of the first paragraph of pre-AIA 35 U.S.C. 112: The specification shall contain a written description of the invention, and of the manner and process of making and using it, in such full, clear, concise, and exact terms as to enable any person skilled in the art to which it pertains, or with which it is most nearly connected, to make and use the same, and shall set forth the best mode contemplated by the inventor of carrying out his invention. Claims 6-7 are rejected under 35 U.S.C. 112(a) or 35 U.S.C. 112 (pre-AIA ), first paragraph, as failing to comply with the enablement requirement. The claim(s) contains subject matter which was not described in the specification in such a way as to enable one skilled in the art to which it pertains, or with which it is most nearly connected, to make and/or use the invention. The applicant relies on functional blocks and triangles to represent the power supply module, an excitation power supply circuit, a reference voltage source circuit, an adjustable gain amplifier circuit, a voltage regulation circuit, an AD conversion circuit, a microprocessor, a shift register without disclosing the necessary structural components. The specification fails to satisfy the enablement requirement because a skilled artisan would be unable to construct the invention without undue experimentation. The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claims 6-7 are rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention. With regards to claim 6, The applicant relies on functional blocks and triangles to represent the a power supply module, an excitation power supply circuit, a reference voltage source circuit, an adjustable gain amplifier circuit, a voltage regulation circuit, an AD conversion circuit, a microprocessor, a shift register without disclosing the necessary structural components. The claim is indefinite as they rely on functional labels rather than structural definition. Appropriate correction is required. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 1-5 are is/are rejected under 35 U.S.C. 103 as being unpatentable over Hirler (US Pub no. 2013/0075724 A1) in view of Vervaeke (US Pub no 2007/0046287 A1) . Regarding claim 1, Hirler et al discloses A high sensitivity magnetic sensing matrix chip with a two-dimensional electronic gas channel structure(2DEG transistor) [0020-0021]comprising a magnetic sensing matrix(60/60’)[0022]; the magnetic sensing matrix comprises several matrix units, and the several matrix units comprises a substrate(41), a buffer layer(42), a channel layer(20), and a barrier layer(30); a two-dimensional electron gas channel material heterojunction structure(2DEG transistor) composed of the buffer layer(42), the channel layer(20), and the barrier layer(30) is sequentially on the substrate(41) [0021], and a horizontal Hall element(60) and a switching device(10)[0028] are arranged above the channel layer(20); a main body of the horizontal Hall element(60) is composed of a cross-shaped barrier layer(30), and four ends of the cross- shaped barrier layer (30) fig. 1c)are respectively provided with electrode C1(611), electrode C2(612), electrode S1(621), and electrode S2(622)[0023]; the switching device comprises a gate electrode G(53), a source electrode S(51), and a drain electrode D(52); the source electrode S (51)and the drain electrode D(52) are arranged on the channel layer(20)[0020]. The limitation “grown” asserts the process by which the heterojunction is formed and is being treated as a product by process limitation. As set forth in MPEP 2113, product by process claims are NOT limited to the manipulations of the recited steps, only to the structure implied by the steps. Hirler et al fails to teach a shift register, and a back- end interface circuit, wherein the shift register is sequentially connected to the magnetic sensor matrix and the back-end interface circuit; and the channel layer is provided with a dielectric layer extending to the barrier layer, and the gate electrode G is arranged above the dielectric layer; the electrode C2 is connected to the source electrode S through a metal interconnection line. However, Vervaeke et al discloses a Hall sensor and switching hybrid device comprising shift register(4-phase measurement cycle infers a shift register is present)[0132-0133], and a back- end interface circuit[0138-0140], wherein the shift register is sequentially connected to the magnetic sensor matrix and the back-end interface circuit[0138-0140]; a channel layer provided with a dielectric layer [0103]extending to the barrier layer, and the gate electrode G is arranged above the dielectric layer[0160-0161]; the electrode C2 (TiJ and Bij) of the hall sensor is connected to the source electrode S(source contact) through a metal interconnection line(Lij and Rij)[0093][0102]. It would have been obvious to one of ordinary skill in the art before the effective filing date of the invention to modify Hirler et al with the teachings of Vervaeke et al since providing back end interface and shift register results in circuitry to control the readout of the hall sensor array and provide offset reduction; providing a gate dielectric prevents leakage currents from flowing to the gate and enhances the gate breakdown voltage; Furthermore, since applying a metal interconnection line is one of finite solutions to send current through the hall sensor to generate a voltage to detect magnetic fields the claim would have been obvious that a person of ordinary skill has good reason to pursue the known options within his or her technical grasp. If this leads to the anticipated success, it is likely that product [was] not of innovation but of ordinary skill and common sense. In that instance the fact that a combination was obvious to try might show that it was obvious under KSR, 550 U.S. at 421, 82 USPQ2d at 1397. Regarding claim 2, Hirler et al discloses wherein the substrate(40) is one of Si, SiC, and sapphire[0021]; the buffer(42) layer is one of AIN[0021]. Regarding claim 3, Hirler et al discloses, wherein the channel layer (20) is one of GaN,; the barrier layer(30) is the heterojunction material forming a two-dimensional electron gas channel with the channel layer(20) [0019]. Regarding claim 4, Vervaeke et al discloses wherein the dielectric layer is one of Al2O₃, SiO₂[0103][0161]; the metal interconnection line adopts one of copper, tungsten, aluminum [0150]. Regarding claim 5, Hirler et al discloses wherein the thickness of the buffer layer(42) is; the thickness of the channel layer(20); the thickness of the barrier layer(30) but fails to teach the thickness 10-100nm; 0.1-10micron, 10-100 nm and the thickness of the dielectric layer is 20~50nm. It would have been obvious to one of ordinary skill in the art before the effective filing date of the invention to optimize the thickness to achieve 10-100nm; 0.1-10micron, 10-100 nm through routine experimentation "[W]here the general conditions of a claim are disclosed in the prior art, it is not inventive to discover the optimum or workable ranges by routine experimentation."In re Aller, 220 F.2d 454, 456, 105 USPQ 233, 235 (CCPA 1955). Furthermore, Vervaeke et al teaches the thickness of the dielectric layer [0161]but fails to teach is 20~50nm. It would have been obvious to one of ordinary skill in the art before the effective filing date of the invention to achieve a thickness of 20-50 nm through routine experimentation to optimize leakage. "[W]here the general conditions of a claim are disclosed in the prior art, it is not inventive to discover the optimum or workable ranges by routine experimentation. “In re Aller, 220 F.2d 454, 456, 105 USPQ 233, 235 (CCPA 1955) Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to LATANYA N CRAWFORD EASON whose telephone number is (571)270-3208. The examiner can normally be reached Monday-Friday 8:30 AM-4:30 PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Steven B Gauthier can be reached at (571)270-0373. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /LATANYA N CRAWFORD EASON/Primary Examiner, Art Unit 2813
Read full office action

Prosecution Timeline

Sep 07, 2023
Application Filed
Jul 08, 2026
Non-Final Rejection mailed — §103, §112 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12672400
DISPLAY DEVICE
3y 8m to grant Granted Jun 30, 2026
Patent 12642008
MEMORY DEVICE AND SEMICONDUCTOR DIE
4y 0m to grant Granted May 26, 2026
Patent 12641932
Display Device
3y 6m to grant Granted May 26, 2026
Patent 12628485
LIGHT-EMITTING CHIP STRUCTURE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE
2y 9m to grant Granted May 12, 2026
Patent 12615883
NANOROD LIGHT EMITTING ELEMENT AND DISPLAY DEVICE INCLUDING THE SAME
3y 6m to grant Granted Apr 28, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

Strategy Recommendation AI-generated — please review before filing

Get a prosecution strategy drawn from examiner precedents, rejection analysis, and claim mapping.
Typically takes 5-10 seconds — AI-generated, attorney review required before filing

Prosecution Projections

1-2
Expected OA Rounds
78%
Grant Probability
79%
With Interview (+0.3%)
2y 8m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 927 resolved cases by this examiner. Grant probability derived from career allowance rate.

Sign in with your work email

Enter your email to receive a magic link. No password needed.

Personal email addresses (Gmail, Yahoo, etc.) are not accepted.

Free tier: 3 strategy analyses per month