Prosecution Insights
Last updated: May 29, 2026
Application No. 18/466,351

DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES

Non-Final OA §102
Filed
Sep 13, 2023
Examiner
ULLAH, ELIAS
Art Unit
2893
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Nxp Usa Inc.
OA Round
1 (Non-Final)
85%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
93%
With Interview

Examiner Intelligence

Grants 85% — above average
85%
Career Allowance Rate
709 granted / 838 resolved
+16.6% vs TC avg
Moderate +8% lift
Without
With
+8.0%
Interview Lift
resolved cases with interview
Typical timeline
2y 4m
Avg Prosecution
14 currently pending
Career history
856
Total Applications
across all art units

Statute-Specific Performance

§101
0.2%
-39.8% vs TC avg
§103
49.2%
+9.2% vs TC avg
§102
46.9%
+6.9% vs TC avg
§112
1.3%
-38.7% vs TC avg
Black line = Tech Center average estimate • Based on career data from 838 resolved cases

Office Action

§102
DETAILED ACTION Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claims 1-9 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Vineent et al. (Vineent, US 2020/0403298). Regarding claim 1, Vineent shows an electronic device assembly (device 1000 in FIG. 10) comprising: a first electronic device (Die 1002) coupled to a carrier substrate (substrate 1006); a volume of molding compound (molding 802 as shown in FIG. 8) that encapsulates the first electronic device (die 1002); an enclosed cavity having a first portion ( element 1024 in FIG. 10) formed within the carrier substrate (substrate 1006) and a second portion (element 1012) formed within the volume of molding material; an antenna structure configured to be electrically coupled to a first electronic device and disposed adjacent to the enclosed cavity and oriented toward an interior of the enclosed cavity (see FIG. 8-10); and an electrically conductive reflector (element 1012) within the enclosed cavity that is configured to direct electromagnetic signals toward or away from the antenna structure ([0048]). Regarding claim 2, Vineent shows an electronic device assembly (device 1000 in FIG. 10) further comprising an aperture in the carrier substrate (substrate 1006) that forms an open path between the interior of the enclosed cavity and an external environment surrounding the device (see FIG. 8-10). Regarding claim 3, Vineent shows an electronic device assembly (device 1000 in FIG. 10) comprising, wherein electrically conductive reflector (element 1012) is formed by electrically conductive material lining the enclosed cavity and oriented opposite the antenna structure ( element 1024). Regarding claim 4, Vineent shows an electronic device assembly (device 1000 in FIG. 10) comprising, wherein the electrically conductive material is configured to reflect electromagnetic signals toward the antenna structure ([0048]). Regarding claim 5, Vineent shows an electronic device assembly (device 1000 in FIG. 10) comprising, wherein the electrically conductive material ( element 1012) lining the enclosed cavity includes a first section disposed within the first portion of the enclosed cavity and a second section disposed within the second portion of the enclosed cavity that is electrically contiguous with the first section (See FIG. 10). Regarding claim 6, Vineent shows an electronic device assembly (device 1000 in FIG. 10) further comprising: an additional substate (substrate 1004) bonded to a first surface of the carrier substrate (substrate 1006); wherein the second portion of the enclosed cavity is formed within a cavity within the additional substate; and wherein the additional substate is encapsulated within the volume of molding material (see FIG. 10). Regarding claim 7, Vineent shows an electronic device assembly (device 1000 in FIG. 10) comprising, wherein the antenna structure is formed by a conductive trace on or within the additional substrate; and wherein the antenna structure is separated from the electrically-conductive material in the second portion of the enclosed cavity by a layer of electrically-insulating material that forms part of the additional substrate (see FIG. 10). Regarding claim 8, Vineent shows an electronic device assembly (device 1000 in FIG. 10) comprising, wherein the antenna structure is disposed within the volume of molding material and is immediately adjacent to the second portion of the enclosed cavity (See FIG. 10). Regarding claim 9, Vineent shows an electronic device assembly (device 1000 in FIG. 10) comprising, wherein the antenna structure is disposed within the carrier substrate and is immediately adjacent to the first portion of the enclosed cavity (see FIG. 10). Allowable Subject Matter Claims 10-18 are allowed. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to ELIAS M ULLAH whose telephone number is (571)272-1415. The examiner can normally be reached M-F at 8AM-5PM EST. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Yara Green can be reached at 571-270-3035. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /ELIAS ULLAH/Primary Examiner, Art Unit 2893
Read full office action

Prosecution Timeline

Sep 13, 2023
Application Filed
Apr 10, 2026
Request for Continued Examination
Apr 20, 2026
Response after Non-Final Action
May 20, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12642152
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR MODULE ARRANGEMENT
3y 0m to grant Granted May 26, 2026
Patent 12642145
SEMICONDUCTOR PACKAGE
2y 8m to grant Granted May 26, 2026
Patent 12642124
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
2y 9m to grant Granted May 26, 2026
Patent 12635580
SEMICONDUCTOR PACKAGES
3y 1m to grant Granted May 19, 2026
Patent 12635551
CHIP PACKAGE STRUCTURE
2y 9m to grant Granted May 19, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
85%
Grant Probability
93%
With Interview (+8.0%)
2y 4m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 838 resolved cases by this examiner. Grant probability derived from career allowance rate.

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