Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2838 2892 2893
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18665082 | PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18726797 | DISPLAY SUBSTRATE AND DISPLAY APPARATUS | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18749794 | LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE | Non-Final OA | BOE Technology Group Co., Ltd. |
| 18523243 | System and Method for Aligning Bonding Pads with Bonding Locations using Moiré Patterns | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18611654 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18761453 | HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES | Non-Final OA | Intel Corporation |
| 18466351 | DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES | Non-Final OA | NXP USA, Inc. |
| 18617449 | INTEGRATED CIRCUIT DIE PAD CAVITY | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18591859 | INTEGRATED MODULE HAVING A THERMAL NETWORK | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18141265 | STRUCTURE AND METHOD FOR BONDED WAFER BARRIER | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18669461 | UNIT CELL FOR METAL FILL | Non-Final OA | Cisco Technology, Inc. |
| 18604787 | POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONENT AND METHOD FOR FABRICATING THE SAME | Non-Final OA | Infineon Technologies Austria AG |
| 18373853 | PACKAGE STRUCTURE | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 18617635 | Semiconductor structure and manufacturing method thereof | Non-Final OA | UNITED MICROELECTRONICS CORP. |
| 18775169 | DEVICE HAVING A COUPLED INTERSTAGE TRANSFORMER AND PROCESS IMPLEMENTING THE SAME | Non-Final OA | MACOM Technology Solutions Holdings, Inc. |
| 18727189 | METHOD FOR TREATING SUBSTRATES | Non-Final OA | Soitec |
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