Prosecution Insights
Last updated: April 19, 2026

Examiner: ULLAH, ELIAS

Tech Center 2800 • Art Units: 2838 2892 2893

This examiner grants 84% of resolved cases

Performance Statistics

84.4%
Allow Rate
+16.4% vs TC avg
851
Total Applications
+8.1%
Interview Lift
876
Avg Prosecution Days
Based on 829 resolved cases, 2023–2026

Rejection Statute Breakdown

0.1%
§101 Eligibility
55.7%
§102 Novelty
32.8%
§103 Obviousness
7.8%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18491161 THREE-DIMENSIONAL FERROELECTRIC MEMORY DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18484867 DISPLAY DEVICE Non-Final OA LG Display Co., Ltd.
18233264 DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME Non-Final OA Samsung Display Co., LTD.
18323925 SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME Non-Final OA FUJI ELECTRIC CO., LTD.
18484550 LOGIC AND MEMORY DEVICE WITH COMMON VERTICAL CHANNEL Non-Final OA INTERNATIONAL BUSINESS MACHINES CORPORATION
18557754 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR ELECTRONIC DEVICE Non-Final OA KYOCERA Corporation
17847257 PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS Non-Final OA Intel Corporation
18455928 PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE Non-Final OA QUALCOMM Incorporated
18549443 DOUBLE-SIDE COOLED POWER MODULES WITH SINTERED-SILVER INTERPOSERS Non-Final OA VIRGINIA TECH INTELLECTUAL PROPERTIES, INC.
18461316 CHIP PACKAGE DEVICES AND MEMORY SYSTEMS Non-Final OA Yangtze Memory Technologies Co., Ltd.
18484579 SEMICONDUCTOR PACKAGE STRUCTURE Non-Final OA MediaTek Singapore Pte. Ltd.
18373853 PACKAGE STRUCTURE Non-Final OA Advanced Semiconductor Engineering, Inc.
18391031 WIDE BAND GAP (WBG) DEVICES BASED THREE-LEVEL ACTIVE NEUTRAL POINT CLAMPED (ANPC) POWER MODULE DESIGNS Non-Final OA UNIVERSITY OF TENNESSEE RESEARCH FOUNDATION
18495246 STEM AND METHOD OF MANUFACTURING STEM Non-Final OA SHINKO ELECTRIC INDUSTRIES CO., LTD.
18374140 PACKAGING STRUCTURE AND PACKAGING METHOD Non-Final OA Semiconductor Manufacturing International (Shanghai) Corporation
18355966 SEMICONDUCTOR PACKAGING WITH TRANSPARENCY AND METHOD OF MANUFACTURING THE SAME Non-Final OA STMICROELECTRONICS (MALTA) LTD

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