Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2838 2892 2893
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18141265 | STRUCTURE AND METHOD FOR BONDED WAFER BARRIER | Non-Final OA | TEXAS INSTRUMENTS INCORPORATED |
| 18323925 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME | Non-Final OA | FUJI ELECTRIC CO., LTD. |
| 18532603 | ASYMMETRIC VIA BAR UNDER POWER RAIL | Non-Final OA | International Business Machines Corporation |
| 17847257 | PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS | Non-Final OA | Intel Corporation |
| 18455928 | PACKAGE-ON-PACKAGE DEVICE INCLUDING REDISTRIBUTION DIE | Non-Final OA | QUALCOMM Incorporated |
| 18495246 | STEM AND METHOD OF MANUFACTURING STEM | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18388630 | LOW RESISTANCE SIGNAL TRANSDUCTION ENABLED BY HIGH EFFICIENCY COPPER FEEDTHROUGHS | Non-Final OA | Taiwan Semiconductor Manufacturing Company, LTD. |
| 18466351 | DEVICE PACKAGES WITH INTEGRATED MILLIMETER-WAVE REFLECTOR CAVITIES | Non-Final OA | NXP USA, Inc. |
| 18391031 | WIDE BAND GAP (WBG) DEVICES BASED THREE-LEVEL ACTIVE NEUTRAL POINT CLAMPED (ANPC) POWER MODULE DESIGNS | Non-Final OA | UNIVERSITY OF TENNESSEE RESEARCH FOUNDATION |
| 18373853 | PACKAGE STRUCTURE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18557843 | METHOD FOR TRIMMING THE LIGHT SENSITIVITY OF A PHOTOTRANSISTOR | Non-Final OA | VISHAY SEMICONDUCTOR GMBH |
| 18355966 | SEMICONDUCTOR PACKAGING WITH TRANSPARENCY AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | STMICROELECTRONICS (MALTA) LTD |
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