Prosecution Insights
Last updated: May 29, 2026
Application No. 18/489,028

SEMICONDUCTOR MODULE

Non-Final OA §103
Filed
Oct 18, 2023
Priority
Dec 28, 2022 — JP 2022-211748 +1 more
Examiner
RAHMAN, MOIN M
Art Unit
2898
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Fuji Electric Co. Ltd.
OA Round
1 (Non-Final)
87%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
99%
With Interview

Examiner Intelligence

Grants 87% — above average
87%
Career Allowance Rate
642 granted / 739 resolved
+18.9% vs TC avg
Moderate +14% lift
Without
With
+14.5%
Interview Lift
resolved cases with interview
Typical timeline
2y 4m
Avg Prosecution
40 currently pending
Career history
791
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
80.8%
+40.8% vs TC avg
§102
11.0%
-29.0% vs TC avg
§112
7.6%
-32.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 739 resolved cases

Office Action

§103
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. Status of the application This office Action is in response to Applicant's Application filled on 01/30/2026 Claims 1-20 are pending for this examination. Priority Acknowledgment is made of applicant's claim for foreign priority under 35 U.S.C. 119(a)-(d). The certified copy has been filed on 11/30/2023. Oath/Declaration The oath or declaration filed on10/18/2023 is acceptable. Information Disclosure Statement The information disclosure statement (IDS) submitted on 10/26/2023 are in compliance with the provisions of 37 CFR 1.97. Accordingly, the information disclosure statement has been considered by the examiner. Election/Restrictions Applicant’s election, without traverse Species I (Fig 3), directed to an embodiment as depicted in FIGS. 1-6, with claims 1-11 and 19-20, in the “Response to Election / Restriction Filed” filed on 01/30/2026 is acknowledged and entered. This office action considers claims 1-20 are thus pending for prosecution, of which, non-elected claims 12-18 are withdrawn, and elected claims 1-11 and 19-20 are examined on their merits. Claim Rejection- 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102 of this title, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claims 1 and 3 are rejected under 35 U.S.C. 103 as being unpatentable over Felsl et al (US 2012/0098097 A1; hereafter Felsl) in view of Sugawara (US 2013/0001703 A1; hereafter Sugawara). PNG media_image1.png 390 840 media_image1.png Greyscale Regarding claim 1. Felsl discloses a semiconductor module comprising: a plurality of SiC chips (Fig [1-2], IGBT 100 and 200, Para [ 0030-0031]) electrically connected in parallel (Para [ 0037]) and each having a MOSFET and a parasitic transistor that are formed therein (Para [ 0060] discloses “circuit diagrams of the IGBT 100 and 200. Both IGBTs include a MOSFET M.sub.1 and M.sub.2, respectively, a collector-side transistor T.sub.1 and T.sub.2, respectively, and a parasitic transistor T.sub.p1 and T.sub.p2, respectively.”); and a control unit (circuitry, e.g. for a given inductive load, Para [ 0042]) which controls switching of the MOSFET in each of the plurality of SiC chips (Para [ 0042]), wherein for all of the plurality of SiC chips, at least in a state where the parasitic transistor is turned on, the control unit controls (Para [ 0042]). But Felsl does not disclose explicitly controls to 0.9 μs or less, a turn-off time of the MOSFET corresponding. In a similar field of endeavor, Sugawara discloses controls to 0.9 μs or less, a turn-off time of the MOSFET corresponding (Para [ 0180-0181] discloses “The turn-on time and the turn-off time of the combined switching device according to the third embodiment are 205 ns and 350 ns). Since Felsl and Sugawara are both from the similar field of endeavor, and Sugawara discloses switching time when the MOSFET switch is changed from a turn-on state to a turn-off state. Therefore, the purpose disclosed by Sugawara would have been recognized in the pertinent art of Felsl. Therefore, it would have been obvious to one of the ordinary skilled in the art before the effective filing date of the invention to combine Felsl in light of Sugawara teaching “controls to 0.9 μs or less, a turn-off time of the MOSFET corresponding (Para [ 0180-0181] discloses “The turn-on time and the turn-off time of the combined switching device according to the third embodiment are 205 ns and 350 ns)” for further advantage such as high-speed operation of the combined switching device can be realized. Regarding claim 3. Felsl and Sugawara discloses the semiconductor module according to claim 1, Felsl further disclose wherein even in a state where the parasitic transistor is turned off, the control unit (Para [ 0042]). But Felsl does not disclose explicitly controls to 0.9 μs or less, a turn-off time of the MOSFET corresponding. In a similar field of endeavor, Sugawara discloses controls to 0.9 μs or less, a turn-off time of the MOSFET corresponding (Para [ 0180-0181]). Since Felsl and Sugawara are both from the similar field of endeavor, and Sugawara discloses switching time when the MOSFET switch is changed from a turn-on state to a turn-off state. Therefore, the purpose disclosed by Sugawara would have been recognized in the pertinent art of Felsl. Therefore, it would have been obvious to one of the ordinary skilled in the art before the effective filing date of the invention to combine Felsl in light of Sugawara teaching “controls to 0.9 μs or less, a turn-off time of the MOSFET corresponding (Para [ 0180-0181])” for further advantage such as high-speed operation of the combined switching device can be realized. Claims 2 and 19 are rejected under 35 U.S.C. 103 as being unpatentable over Felsl et al (US 2012/0098097 A1; hereafter Felsl) in view of Sugawara (US 2013/0001703 A1; hereafter Sugawara) as applied claims above and further in view of FUJIMOTO et al (US 2019/0198620 A1; hereafter FUJIMOTO). Regarding claim 2. Felsl and Sugawara discloses the semiconductor module according to claim 1, Felsl further discloses wherein the parasitic transistor of each of the plurality of SiC chips is not turned on in a region (Para [ 0042]). But Felsl and Sugawara does not disclose explicitly where a current density of a main current flowing through the MOSFET corresponding is 6000 A/cm2 or less. In a similar field of endeavor, FUJIMOTO discloses where a current density of a main current flowing through the MOSFET corresponding is 6000 A/cm2 or less (Abstract). Therefore, it would have been obvious to one of the ordinary skilled in the art before the effective filing date of the invention to combine Felsl and Sugawara in light of FUJIMOTO teaching “where a current density of a main current flowing through the MOSFET corresponding is 6000 A/cm2 or less (Abstract)” for further advantage such as having low ON voltage, high-speed characteristics. Regarding claim 19. Felsl and Sugawara in light of FUJIMOTO discloses the semiconductor module according to claim 2, Felsl further disclose wherein even in a state where the parasitic transistor is turned off, the control unit (Para [ 0042]). But Felsl does not disclose explicitly controls, to 0.9 μs or less, the turn-off time of the MOSFET corresponding. In a similar field of endeavor, Sugawara discloses controls to 0.9 μs or less, a turn-off time of the MOSFET corresponding (Para [ 0180-0181]). Therefore, it would have been obvious to one of the ordinary skilled in the art before the effective filing date of the invention to combine Felsl and FUJIMOTO in light of Sugawara teaching “controls to 0.9 μs or less, a turn-off time of the MOSFET corresponding (Para [ 0180-0181])” for further advantage such as high-speed operation of the combined switching device can be realized. Claims 4-6 are rejected under 35 U.S.C. 103 as being unpatentable over Felsl et al (US 2012/0098097 A1; hereafter Felsl) in view of Sugawara (US 2013/0001703 A1; hereafter Sugawara) as applied claims above and further in view of CHOI et al (US 2014/0175901 A1; hereafter CHOI). Regarding claim 4. Felsl and Sugawara discloses the semiconductor module according to claim 1, Felsl further discloses wherein in a state where the parasitic transistor is turned off, the control unit controls (Para [ 0042]). But Felsl and Sugawara does not disclose explicitly control unit controls to a value larger than 0.9 μs, the turn-off time of the MOSFET corresponding. In a similar field of endeavor, CHOI discloses control unit controls to a value larger than 0.9 μs, the turn-off time of the MOSFET corresponding (Para [ 0046]). Therefore, it would have been obvious to one of the ordinary skilled in the art before the effective filing date of the invention to combine Felsl and Sugawara in light of CHOI teaching “control unit controls to a value larger than 0.9 μs, the turn-off time of the MOSFET corresponding (Para [ 0046])” for further advantage such as improving insertion loss characteristics by varying a resistance value. Regarding claim 5. Felsl and Sugawara in light of CHOI discloses the semiconductor module according to claim 4, Felsl further discloses wherein the control unit collectively controls the turn-off times of the MOSFETs of all of the plurality of SiC chips (Para [0030-0032, 0042]). Regarding claim 6. Felsl and Sugawara in light of CHOI disclose the semiconductor module according to claim 4, Felsl further discloses wherein depending on a state of the parasitic transistor of each of the plurality of SiC chips, the control unit individually controls the turn-off time of the MOSFET corresponding (Para [0030-0032, 0042]). Claims 7-8 are rejected under 35 U.S.C. 103 as being unpatentable over Felsl et al (US 2012/0098097 A1; hereafter Felsl) in view of Sugawara (US 2013/0001703 A1; hereafter Sugawara) as applied claims above and further in view of Krug (US 2022/0416766 A1; hereafter Krug). Regarding claim 7. Felsl and Sugawara in light of CHOI disclose the semiconductor module according to claim 4, But Felsl and Sugawara in light of CHOI does not disclose explicitly further comprising: a current sensing unit which senses a main current flowing through the MOSFET of at least one of the plurality of SiC chips, wherein the control unit controls the turn-off time of the MOSFET of the at least one of the plurality of SiC chips based on a waveform of the main current sensed by the current sensing unit. In a similar field of endeavor, Krug discloses a current sensing unit which senses a main current flowing through the MOSFET of at least one of the plurality of SiC chips ( Fig [1,5], current sensing unit 202A ( Para [ 0022-0027]) , wherein the control unit (Controller 106, Para [ 0025-0027]) controls the turn-off time of the MOSFET of the at least one of the plurality of SiC chips based on a waveform of the main current sensed by the current sensing unit (Fig [1,5], Para [ 0022-0026]). Therefore, it would have been obvious to one of the ordinary skilled in the art before the effective filing date of the invention to combine Felsl, Sugawara and CHOI in light of Krug teaching “a current sensing unit which senses a main current flowing through the MOSFET of at least one of the plurality of SiC chips ( Fig [1,5], current sensing unit 202A ( Para [ 0022-0027]) , wherein the control unit (Controller 106, Para [ 0025-0027]) controls the turn-off time of the MOSFET of the at least one of the plurality of SiC chips based on a waveform of the main current sensed by the current sensing unit (Fig [1,5], Para [ 0022-0026])” for further advantage such as determine the voltage drop over the power switch based on a difference between the first signal and the second signal. Regarding claim 8. Felsl, Sugawara and CHOI in light of Krug discloses the semiconductor module according to claim 7, Krug discloses wherein the control unit controls the turn-off time of the MOSFET (Fig [1,5], Para [ 0022-0026]) of the at least one of the plurality of SiC chips based on a slope of a rising edge of the waveform of the main current sensed by the current sensing unit (Fig [1,5], Para [ 0022-0026]). Therefore, it would have been obvious to one of the ordinary skilled in the art before the effective filing date of the invention to combine Felsl, Sugawara and CHOI in light of Krug teaching “wherein the control unit controls the turn-off time of the MOSFET (Fig [1,5], Para [ 0022-0026]) of the at least one of the plurality of SiC chips based on a slope of a rising edge of the waveform of the main current sensed by the current sensing unit (Fig [1,5], Para [ 0022-0026])” for further advantage such as determine the voltage drop over the power switch based on a difference between the first signal and the second signal. Claims 9-10 are rejected under 35 U.S.C. 103 as being unpatentable over Felsl et al (US 2012/0098097 A1; hereafter Felsl) in view of Sugawara (US 2013/0001703 A1; hereafter Sugawara) as applied claims above and further in view of TANIOKA et al (US 2017/0250254 A1; hereafter TANIOKA). Regarding claim 9. Felsl and Sugawara discloses the semiconductor module according to claim 1, Felsl further discloses MOSFET of each of the plurality of SiC chips (Para [ 0030-0031, 0060-0061]). But Felsl and Sugawara does not disclose explicitly wherein an acceptor concentration of a base region of the MOSFET is 1×1017/cm3 or more. In a similar field of endeavor, TANIOKA discloses wherein an acceptor concentration of a base region of the MOSFET is 1×1017/cm3 or more (Para [ 0070, 0078]). Therefore, it would have been obvious to one of the ordinary skilled in the art before the effective filing date of the invention to combine Felsl and Sugawara in light of TANIOKA teaching “wherein an acceptor concentration of a base region of the MOSFET is 1×1017/cm3 or more (Para [ 0070, 0078])” for further advantage such as to control resistance in the channel region to improve device performance. Regarding claim 10. Felsl and Sugawara in light of TANIOKA discloses the semiconductor module according to claim 9, Felsl further discloses MOSFET of each of the plurality of SiC chips (Para [ 0030-0031, 0060-0061]). But Felsl and Sugawara does not disclose explicitly wherein the acceptor concentration of the base region of the MOSFET is 8×1017/cm3 or more. In a similar field of endeavor, TANIOKA discloses wherein the acceptor concentration of the base region of the MOSFET is 8×1017/cm3 or more (Para [ 0070, 0078]). Therefore, it would have been obvious to one of the ordinary skilled in the art before the effective filing date of the invention to combine Felsl and Sugawara in light of TANIOKA teaching “wherein the acceptor concentration of the base region of the MOSFET is 8×1017/cm3 or more” for further advantage such as to control resistance in the channel region to improve device performance. Claim 11 is rejected under 35 U.S.C. 103 as being unpatentable over Felsl et al (US 2012/0098097 A1; hereafter Felsl) in view of Sugawara (US 2013/0001703 A1; hereafter Sugawara) as applied claims above and further in view of Sandow et al (US 2022/0102478 A1; hereafter Sandow). Regarding claim 11. Felsl and Sugawara discloses semiconductor module according to claim 1, But Felsl and Sugawara does not disclose explicitly wherein a maximum value of a contact resistance of a contact region of the MOSFET of each of the plurality of SiC chips is 9.0 or less. In a similar field of endeavor, Sandow discloses wherein a maximum value of a contact resistance of a contact region of the MOSFET of each of the plurality of SiC chips is 9.0 or less (Para [ 0142]). Therefore, it would have been obvious to one of the ordinary skilled in the art before the effective filing date of the invention to combine Felsl and Sugawara in light of Sandow teaching “wherein a maximum value of a contact resistance of a contact region of the MOSFET of each of the plurality of SiC chips is 9.0 or less (Para [ 0142])” for further advantage such as to control resistance to improve device performance. Claim 20 is rejected under 35 U.S.C. 103 as being unpatentable over Felsl et al (US 2012/0098097 A1; hereafter Felsl) in view of Sugawara (US 2013/0001703 A1; hereafter Sugawara) and FUJIMOTO et al (US 2019/0198620 A1; hereafter FUJIMOTO) as applied claims above and further in view of CHOI et al (US 2014/0175901 A1; hereafter CHOI). Regarding claim 20. Felsl and Sugawara in light of FUJIMOTO discloses semiconductor module according to claim 2, Felsl further disclose wherein even in a state where the parasitic transistor is turned off, the control unit (Para [ 0042]). But Felsl and Sugawara in light of FUJIMOTO does not disclose explicitly control unit controls to a value larger than 0.9 μs, the turn-off time of the MOSFET corresponding. In a similar field of endeavor, CHOI discloses control unit controls to a value larger than 0.9 μs, the turn-off time of the MOSFET corresponding (Para [ 0046]). Therefore, it would have been obvious to one of the ordinary skilled in the art before the effective filing date of the invention to combine Felsl, Sugawara and FUJIMOTO in light of CHOI teaching “control unit controls to a value larger than 0.9 μs, the turn-off time of the MOSFET corresponding (Para [ 0046])” for further advantage such as improving insertion loss characteristics by varying a resistance value of a gate resistor of a metal oxide semiconductor (MOS) transistor. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to MOIN M RAHMAN whose telephone number is (571)272-5002. The examiner can normally be reached 8:30-5:00pm. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Julio Maldonado can be reached at 571-272-1864. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /MOIN M RAHMAN/Primary Examiner, Art Unit 2898
Read full office action

Prosecution Timeline

Oct 18, 2023
Application Filed
May 07, 2026
Non-Final Rejection mailed — §103 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
87%
Grant Probability
99%
With Interview (+14.5%)
2y 4m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 739 resolved cases by this examiner. Grant probability derived from career allowance rate.

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