Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2699 2800 2898
This examiner grants 87% of resolved cases
Moin M. Rahman is an examiner in Art Unit 2699, located within Tech Center 2800. With 756 resolved cases, the examiner has a well-documented history that allows for a detailed analysis of performance metrics. The data shows an allowance rate of 87.0 percent, which suggests a favorable environment for patent applicants. This 87.0 percent rate implies that the majority of applications assigned to this examiner will eventually reach a grant, provided they meet the necessary legal requirements in Art Unit 2699.
The median time to allowance is 880 days, offering a predictable timeline for the prosecution process. This 880-day figure is a helpful benchmark for practitioners when advising clients on the expected duration of their patent applications. Furthermore, the interview lift is 14.2 percent. Although the base allowance rate is already high, the 14.2 percent lift indicates that interviews still provide a measurable benefit in resolving issues and potentially accelerating the path to grant. Practitioners should leverage the 756 resolved cases to inform their strategy, noting that the combination of a high allowance rate and a reasonable pendency makes for an efficient prosecution experience.
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18613324 | MULTI-STACK SEMICONDUCTOR DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18514715 | SUBSTRATE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18508833 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18382166 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18560169 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18406150 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18522409 | DISPLAY DEVICE | Final Rejection | LG Display Co., Ltd. |
| 18055934 | LUMIPHORIC MATERIAL ARRANGEMENTS FOR COVER STRUCTURES OF LIGHT-EMITTING DIODE PACKAGES | Non-Final OA | CreeLED, Inc. |
| 18387772 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 17990794 | ORGANIC SEMICONDUCTOR ELEMENT, ORGANIC EL ELEMENT, AND PHOTODIODE | Final Rejection | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18536918 | PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING | Non-Final OA | International Business Machines Corporation |
| 18632033 | IMAGE SENSING DEVICE | Non-Final OA | SK hynix Inc. |
| 18424871 | SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD LINE DISPOSED SPACED APART FROM EACH OTHER | Non-Final OA | SK hynix Inc. |
| 18514991 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | SK hynix Inc. |
| 18293968 | IMAGE SENSING COMPUTING UNIT AND ITS OPERATING METHOD, IMAGE SENSING COMPUTER AND ELECTRONIC DEVICE | Final Rejection | PEKING UNIVERSITY |
| 15429403 | ENHANCED LATERAL CAVITY ETCH | Final Rejection | Texas Instruments Incorporated |
| 18346219 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18099482 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING OXIDE FILM AND METHOD FOR SUPPRESSING GENERATION OF LEAKAGE CURRENT | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18366297 | Nanowire Stack GAA Device with Inner Spacer and Methods for Producing the Same | Final Rejection | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 18424960 | SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURE WITH VARIABLE RESISTIVITY EPITAXIAL SEMICONDUCTOR LAYERS AND METHODS OF MAKING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 17828064 | PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18704093 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Non-Final OA | Tokyo Electron Limited |
| 18214662 | SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR CARBON NANOTUBE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18489028 | SEMICONDUCTOR MODULE | Final Rejection | FUJI ELECTRIC CO., LTD. |
| 18221501 | METHOD FOR DIVIDING A TRANSPARENT WORKPIECE | Final Rejection | Trumpf Laser- und Systemtechnik Gmbh |
| 18616758 | LIGHT EMITTING APPARATUS AND DISPLAY APPARATUS INCLUDING THE SAME | Non-Final OA | SEOUL VIOSYS CO., LTD. |
| 18478452 | SILICON CARBIDE CHANNEL WITH CAPPING SEMICONDUCTOR HAVING HIGHER CHARGE CARRIER MOBILITY | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18543532 | ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE | Non-Final OA | Adeia Semiconductor Solutions LLC |
| 18431007 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR STRUCTURE | Non-Final OA | Semiconductor Manufacturing International (Shanghai) Corporation |
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