Tech Center 2800 • Art Units: 2699 2800 2898
This examiner grants 87% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18508833 | SEMICONDUCTOR MEMORY DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18382166 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18057242 | QUANTUM DOT DEVICE AND ELECTRONIC DEVICE | Final Rejection | SAMSUNG ELECTRONICS CO., LTD. |
| 18478409 | DISPLAY DEVICE | Non-Final OA | LG Display Co., Ltd. |
| 18503013 | Semiconductor Device and Methods of Making and Using Pre-Molded Bridge Die | Final Rejection | STATS ChipPAC Pte. Ltd. |
| 17952339 | LIGHT EMITTING ELEMENT AND DISPLAY DEVICE | Non-Final OA | Magnolia White Corporation |
| 18406150 | DISPLAY DEVICE | Final Rejection | Samsung Display Co., LTD. |
| 18510485 | DISPLAY APPARATUS | Final Rejection | Samsung Display Co., Ltd. |
| 18486970 | INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING | Non-Final OA | QUALCOMM Incorporated |
| 18387772 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | Non-Final OA | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
| 18424871 | SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD LINE DISPOSED SPACED APART FROM EACH OTHER | Non-Final OA | SK hynix Inc. |
| 17962667 | SEMICONDUCTOR MEMORY DEVICE | Final Rejection | SK hynix Inc. |
| 15429403 | ENHANCED LATERAL CAVITY ETCH | Final Rejection | Texas Instruments Incorporated |
| 18346219 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18099482 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING OXIDE FILM AND METHOD FOR SUPPRESSING GENERATION OF LEAKAGE CURRENT | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 17828064 | PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 18449452 | SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE | Final Rejection | Sandisk Technologies, Inc. |
| 18214662 | SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR CARBON NANOTUBE AND MANUFACTURING METHOD THEREOF | Non-Final OA | NANYA TECHNOLOGY CORPORATION |
| 18494946 | SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR DEVICE | Non-Final OA | NEXPERIA B.V. |
| 18489961 | SLOTTED CLIPS FOR REDUCTION OF MOLDING COMPOUND DELAMINATION | Non-Final OA | SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
| 18478452 | SILICON CARBIDE CHANNEL WITH CAPPING SEMICONDUCTOR HAVING HIGHER CHARGE CARRIER MOBILITY | Non-Final OA | GlobalFoundries U.S. Inc. |
| 18511914 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFOR, AND MEMORY | Non-Final OA | Changxin Memory Technologies, Inc. |
| 18167170 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME | Non-Final OA | CHANGXIN MEMORY TECHNOLOGIES, INC. |
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