Prosecution Insights
Last updated: August 17, 2026

Examiner: RAHMAN, MOIN M

Tech Center 2800 • Art Units: 2699 2800 2898

This examiner grants 87% of resolved cases

Performance Statistics

87.0%
Allow Rate
+19.0% vs TC avg
804
Total Applications
+14.3%
Interview Lift
874
Avg Prosecution Days
Based on 745 resolved cases, 2023–2026

Rejection Statute Breakdown

0.2%
§101 Eligibility
26.9%
§102 Novelty
56.4%
§103 Obviousness
15.7%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18508833 SEMICONDUCTOR MEMORY DEVICE Non-Final OA Samsung Electronics Co., Ltd.
18382166 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA Samsung Electronics Co., Ltd.
18057242 QUANTUM DOT DEVICE AND ELECTRONIC DEVICE Final Rejection SAMSUNG ELECTRONICS CO., LTD.
18478409 DISPLAY DEVICE Non-Final OA LG Display Co., Ltd.
18503013 Semiconductor Device and Methods of Making and Using Pre-Molded Bridge Die Final Rejection STATS ChipPAC Pte. Ltd.
17952339 LIGHT EMITTING ELEMENT AND DISPLAY DEVICE Non-Final OA Magnolia White Corporation
18406150 DISPLAY DEVICE Final Rejection Samsung Display Co., LTD.
18510485 DISPLAY APPARATUS Final Rejection Samsung Display Co., Ltd.
18486970 INTERPOSER CONNECTION STRUCTURES BASED ON WIRE BONDING Non-Final OA QUALCOMM Incorporated
18387772 THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF Non-Final OA YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18424871 SEMICONDUCTOR CHIP INCLUDING CHIP GUARD STRUCTURE AND UPPER GUARD LINE DISPOSED SPACED APART FROM EACH OTHER Non-Final OA SK hynix Inc.
17962667 SEMICONDUCTOR MEMORY DEVICE Final Rejection SK hynix Inc.
15429403 ENHANCED LATERAL CAVITY ETCH Final Rejection Texas Instruments Incorporated
18346219 SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF Non-Final OA TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18099482 SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING OXIDE FILM AND METHOD FOR SUPPRESSING GENERATION OF LEAKAGE CURRENT Non-Final OA Taiwan Semiconductor Manufacturing Company, Ltd.
17828064 PACKAGING SUBSTRATE INCLUDING A STRESS-ABSORPTION TRENCH AND METHODS OF FORMING THE SAME Non-Final OA Taiwan Semiconductor Manufacturing Company Limited
18449452 SEMICONDUCTOR CHIP WITH VARYING THICKNESS PROFILE Final Rejection Sandisk Technologies, Inc.
18214662 SEMICONDUCTOR DEVICE WITH SEMICONDUCTOR CARBON NANOTUBE AND MANUFACTURING METHOD THEREOF Non-Final OA NANYA TECHNOLOGY CORPORATION
18494946 SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR DEVICE Non-Final OA NEXPERIA B.V.
18489961 SLOTTED CLIPS FOR REDUCTION OF MOLDING COMPOUND DELAMINATION Non-Final OA SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
18478452 SILICON CARBIDE CHANNEL WITH CAPPING SEMICONDUCTOR HAVING HIGHER CHARGE CARRIER MOBILITY Non-Final OA GlobalFoundries U.S. Inc.
18511914 SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFOR, AND MEMORY Non-Final OA Changxin Memory Technologies, Inc.
18167170 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME Non-Final OA CHANGXIN MEMORY TECHNOLOGIES, INC.

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