Prosecution Insights
Last updated: July 17, 2026
Application No. 18/494,857

Method for Manufacturing Electrically Conductive Terminal and Electrically Conductive Terminal

Non-Final OA §102
Filed
Oct 26, 2023
Priority
Oct 26, 2022 — CN 202211320331.4
Examiner
LE, THAO P
Art Unit
2818
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
TE Connectivity Ltd.
OA Round
1 (Non-Final)
93%
Grant Probability
Favorable
1-2
OA Rounds
0m
Est. Remaining
92%
With Interview

Examiner Intelligence

Grants 93% — above average
93%
Career Allowance Rate
747 granted / 807 resolved
+24.6% vs TC avg
Minimal -1% lift
Without
With
+-1.0%
Interview Lift
resolved cases with interview
Fast prosecutor
1y 10m
Avg Prosecution
13 currently pending
Career history
820
Total Applications
across all art units

Statute-Specific Performance

§101
1.3%
-38.7% vs TC avg
§103
62.7%
+22.7% vs TC avg
§102
19.6%
-20.4% vs TC avg
§112
2.2%
-37.8% vs TC avg
Black line = Tech Center average estimate • Based on career data from 807 resolved cases

Office Action

§102
DETAILED ACTION Election/Restrictions Applicant’s election without traverse of claims 12-20 and withdrawal of claims 1-11 in the reply filed on 05/11/2026 is acknowledged. Claim Rejections - 35 USC § 102 In the event the determination of the status of the application as subject to AIA 35 U.S.C. 102 and 103 (or as subject to pre-AIA 35 U.S.C. 102 and 103) is incorrect, any correction of the statutory basis for the rejection will not be considered a new ground of rejection if the prior art relied upon, and the rationale supporting the rejection, would be the same under either status. The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(2) the claimed invention was described in a patent issued under section 151, or in an application for patent published or deemed published under section 122(b), in which the patent or application, as the case may be, names another inventor and was effectively filed before the effective filing date of the claimed invention. Claims 12-20 are rejected under 35 U.S.C. 102(a)(2) as being anticipated by Foyet et al., U.S. Pub. No. 2023/0328899. Regarding claim 12, Foyet discloses: a conductive metal base layer 5; a nickel plating layer 4 formed on a surface of the conductive metal base layer 5; a silver plating layer 3 formed on a surface of the nickel plating layer 4, and a tin plating layer 2 formed on a surface of the silver plating layer 3 (Fig. 3). Regarding claim 13, Foyet discloses further comprising a silver-tin mixed layer (Fig. 3). Regarding claim 14, Foyet discloses a mixture of silver-tin layer. Because the claimed invention is directed to a product rather than a method of making the product, the claim limitation reciting the process by which the silver-tin mixture is made does not distinguish the claimed product and is therefore not given patentable weight. Regarding claim 15, although Foyet fails to disclose the tin plating layer is oxidized to form a tin oxide film layer, it is inherent to anyone having ordinary still in the art that tin planting would be naturally oxidized to become tin oxide. Toyizumi U.S. Pub. No. 2020/0099152 also discloses that tin layer is oxidized to become TiO. Regarding claim 16, Foyet discloses further comprising a lubricant layer 1 coated on a surface of the tin oxide thin film layer. Regarding claim 17, Foyet discloses further comprising a sub-base layer formed on the surface of the conductive metal base layer [0020]-[0024]. Regarding claim 18, Foyet discloses the nickel layer is formed on the sub-base layer(s) [0020]-[0024]. Regarding claim 19, Foyet discloses wherein the conductive metal base layer is a copper alloy layer (Fig. 3). Regarding claim 20, Foyet discloses the base layer is a copper plating layer. Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to THAO P LE whose telephone number is (571)272-1785. The examiner can normally be reached on Monday-Friday 9AM-6PM. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Jeff Natalini can be reached on 571-272-2266. The fax phone number for the organization where this application or proceeding is assigned is 703-872-9306. Information regarding the status of an application may be obtained from the Patent Application Information Retrieval (PAIR) system. Status information for published applications may be obtained from either Private PAIR or Public PAIR. Status information for unpublished applications is available through Private PAIR only. For more information about the PAIR system, see http://pair-direct.uspto.gov. Should you have questions on access to the Private PAIR system, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). /THAO P LE/Primary Examiner, Art Unit 2818
Read full office action

Prosecution Timeline

Oct 26, 2023
Application Filed
Jun 30, 2026
Non-Final Rejection mailed — §102 (current)

Precedent Cases

Applications granted by this same examiner with similar technology

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2y 12m to grant Granted Jul 14, 2026
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Patent 12672586
MICROELECTRONIC DEVICE PACKAGES INCLUDING WIREBONDING AND RELATED METHODS, MEMORY DEVICES, AND ELECTRONIC SYSTEMS
3y 7m to grant Granted Jun 30, 2026
Patent 12672554
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2y 8m to grant Granted Jun 30, 2026
Patent 12666829
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3y 0m to grant Granted Jun 23, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
93%
Grant Probability
92%
With Interview (-1.0%)
1y 10m (~0m remaining)
Median Time to Grant
Low
PTA Risk
Based on 807 resolved cases by this examiner. Grant probability derived from career allowance rate.

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