Office Action Predictor
Last updated: April 15, 2026
Application No. 18/499,599

DIRECT PLUG-IN LED LAMP BEAD WITH INTERNAL RESISTOR

Non-Final OA §103§112
Filed
Nov 01, 2023
Examiner
KIM, TONG-HO
Art Unit
2811
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Linhai Qinghui Light Electricity Lamp Co., LTD.
OA Round
1 (Non-Final)
95%
Grant Probability
Favorable
1-2
OA Rounds
1y 8m
To Grant
96%
With Interview

Examiner Intelligence

Grants 95% — above average
95%
Career Allow Rate
991 granted / 1040 resolved
+27.3% vs TC avg
Minimal +0% lift
Without
With
+0.4%
Interview Lift
resolved cases with interview
Fast prosecutor
1y 8m
Avg Prosecution
42 currently pending
Career history
1082
Total Applications
across all art units

Statute-Specific Performance

§103
42.0%
+2.0% vs TC avg
§102
31.6%
-8.4% vs TC avg
§112
8.6%
-31.4% vs TC avg
Black line = Tech Center average estimate • Based on career data from 1040 resolved cases

Office Action

§103 §112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claims 1-10 are rejected under 35 U.S.C. 112(b) In claim 1, line 9, the limitation of “the blow-shaped stand” renders the claim indefinite because it lacks antecedent basis and no blow-shaped stand was previously recited. Therefore, it is suggested Applicant change “the blow-shaped stand” in claim 1, line 9 to “the bowl-shaped stand”. For examination purposes, the limitation will be interpreted and examined as “the bowl-shaped stand” recited in claim 1. Correction is requested. Claims 2-10 are also rejected as being dependent on claim 1. Claim Rejections - 35 USC § 103 The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action: A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made. Claim(s) 1-2 and 4 is/are rejected under 35 U.S.C. 103 as being unpatentable over Barnett (US 2011/0101409) in view of Fujii (US 6,091,084), and further in view of He (US 2024/0288150). Regarding claim 1, Barnett discloses, in at least figures 1-6 and related text, a direct plug-in light-emitting diode (LED) lamp bead (10, [26]) with an internal resistor (14, [26], [28], [29]), comprising a metal bowl-shaped stand (28 (20/26), [33], [35]), a flat stand (22 for 14, [34]), an LED luminous chip (12, [26]), conductive filaments (32, [36]) and a special adhesive ([36]), wherein the LED luminous chip (12, [26]) is fixed in a bowl of the bowl-shaped stand (28 (20/26), [33], [35]) with the special adhesive ([36]), a resistor chip (14, [26], [28], [29]) is fixed to the flat stand (22 for 14, [34]) with the adhesive ([34]), the bowl-shaped stand (28 (20/26), [33], [35]), the flat stand (22 for 14, [34]), the LED luminous chip (12, [26]), the resistor chip (14, [26], [28], [29]) and the conductive filaments (32, [36]) are integrally packaged with transparent epoxy resin (34, [37]-[39]), and pins (16, [30]) of the bowl-shaped stand (28 (20/26), [33], [35]) and the flat stand (22 for 14, [34]) stretch out of package (package of 10 without 18, figures). Barnett does not explicitly disclose the LED luminous chip has an electrode electrically connected to the bowl-shaped stand through the conductive filaments, as well as an electrode electrically connected to one end of the resistor chip through the conductive filaments, the other end of the resistor chip is electrically connected to the flat stand; pins of the bowl-shaped stand and the flat stand stretch out of an epoxy resin package. Fujii teaches, in at least figures 1-2 and related text, the device comprising the LED luminous chip (1, col. 3/ lines 40-58) has an electrode (29, col. 3/ lines 40-58) electrically connected to the bowl-shaped stand (2, col. 3/ lines 40-58) through the conductive filaments (5, col. 3/ lines 40-58), as well as an electrode (28, col. 3/ lines 40-58) electrically connected to the flat stand (3, col. 3/ lines 40-58); pins (2/3 out of 6, figures) of the bowl-shaped stand (2, col. 3/ lines 40-58) and the flat stand (3, col. 3/ lines 40-58) stretch out of an epoxy resin package (6, col. 3/ lines 40-58), for the purpose of providing semiconductor light emitting device which is capable of preventing a substrate from being electrified with static electricity despite the substrate which is formed by an insulating substrate, having thereon semiconductor layers (col. 1/ line 66-col. 2/ line 3). He teaches, in at least figures 1-2, 4, and related text, the device comprising the LED luminous chip (128, [42]) electrically connected to one end of the resistor chip (127, [42]) through the conductive filaments (connection wires, figure 4), the other end of the resistor chip (127, [42], [131]) is electrically connected to the flat stand (122, [42]) (figures), for the purpose of effectively lowering a short circuit failure between the conducting wires matched with the LED lamp and the LED luminous body ([35]). Barnett, Fujii, and He are analogous art because they all are directed to LED lamp and one of ordinary skill in the art would have had a reasonable expectation of success to modify Barnett with the specified features of Fujii and He because they are from the same field of endeavor. Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have modified the structure disclosed in Barnett to have the LED luminous chip having an electrode electrically connected to the bowl-shaped stand through the conductive filaments, as well as an electrode electrically connected to the flat stand; the pins of the bowl-shaped stand and the flat stand stretching out of an epoxy resin package, as taught by Fujii and the LED luminous chip electrically connected to one end of the resistor chip through the conductive filaments, the other end of the resistor chip being electrically connected to the flat stand, as taught by He, for the purpose of providing semiconductor light emitting device which is capable of preventing a substrate from being electrified with static electricity despite the substrate which is formed by an insulating substrate, having thereon semiconductor layers (col. 1/ line 66-col. 2/ line 3, Fujii) and effectively lowering a short circuit failure between the conducting wires matched with the LED lamp and the LED luminous body ([35], He). Regarding claim 2, Barnett in view of Fujii and He discloses the direct plug-in LED lamp bead with an internal resistor according to claim 1 as described above. Fujii further teaches, in at least figures 1-2 and related text, the LED luminous chip (1, col. 3/ lines 40-58) is fixed in the bowl of the bowl-shaped stand (2, col. 3/ lines 40-58) with a conductive silver adhesive (4, col. 3/ lines 8-15, 40-58), for the purpose of providing semiconductor light emitting device which is capable of preventing a substrate from being electrified with static electricity despite the substrate which is formed by an insulating substrate, having thereon semiconductor layers (col. 1/ line 66-col. 2/ line 3). Regarding claim 4, Barnett in view of Fujii and He discloses the direct plug-in LED lamp bead with an internal resistor according to claim 1 as described above. Fujii further teaches, in at least figures 1-2 and related text, the LED luminous chip (1, col. 3/ lines 40-58) is a double-wire LED luminous chip of a planar structure (figures), for the purpose of providing semiconductor light emitting device which is capable of preventing a substrate from being electrified with static electricity despite the substrate which is formed by an insulating substrate, having thereon semiconductor layers (col. 1/ line 66-col. 2/ line 3). Claim(s) 3 and 9 is/are rejected under 35 U.S.C. 103 as being unpatentable over Barnett (US 2011/0101409) in view of Fujii (US 6,091,084), He (US 2024/0288150), and further in view of Wu (US 2018/0294381). Regarding claim 3, Barnett in view of Fujii and He discloses the direct plug-in LED lamp bead with an internal resistor according to claim 1 as described above. Barnett in view of Fujii and He does not explicitly disclose the LED luminous chip is a single-wire LED luminous chip of a vertical structure. Wu teaches, in at least figure 5 and related text, the device comprising the LED luminous chip (630R/630B/630G, [71]) is a single-wire LED luminous chip of a vertical structure, for the purpose of providing a plurality of LED devices with small sizes ([9]) thereby improving density of integration. Barnett, Fujii, He, and Wu are analogous art because they all are directed to LED and one of ordinary skill in the art would have had a reasonable expectation of success to modify Barnett in view of Fujii and He with the specified features of Wu because they are from the same field of endeavor. Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have modified the structure disclosed in Barnett in view of Fujii and He to have the LED luminous chip being a single-wire LED luminous chip of a vertical structure, as taught by Wu, for the purpose of providing a plurality of LED devices with small sizes ([9], Wu) thereby improving density of integration. Regarding claim 9, Barnett in view of Fujii and He discloses the direct plug-in LED lamp bead with an internal resistor according to claim 1 as described above. Barnett in view of Fujii and He does not explicitly disclose the LED luminous chip is one of red, yellow, blue, green, orange and violet visible light chips. Wu teaches, in at least figure 5 and related text, the device comprising the LED luminous chip (630R/630B/630G, [71]) is one of red, yellow, blue ([71]), green, orange and violet visible light chips, for the purpose of providing a plurality of LED devices with small sizes ([9]) thereby improving density of integration. Barnett, Fujii, He, and Wu are analogous art because they all are directed to LED and one of ordinary skill in the art would have had a reasonable expectation of success to modify Barnett in view of Fujii and He with the specified features of Wu because they are from the same field of endeavor. Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have modified the structure disclosed in Barnett in view of Fujii and He to have the LED luminous chip being one of red, yellow, blue, green, orange and violet visible light chips, as taught by Wu, for the purpose of providing a plurality of LED devices with small sizes ([9], Wu) thereby improving density of integration. Claim(s) 6, 8 and 10 is/are rejected under 35 U.S.C. 103 as being unpatentable over Barnett (US 2011/0101409) in view of Fujii (US 6,091,084), He (US 2024/0288150), and further in view of Kano (US 3,875,456). Regarding claim 6, Barnett in view of Fujii and He discloses the direct plug-in LED lamp bead with an internal resistor according to claim 1 as described above. Barnett in view of Fujii and He does not explicitly disclose the LED luminous chip between the LED luminous chip and the epoxy resin package is coated with a fluorescent powder. Kano teaches, in at least figure 3 and related text, the device comprising the LED luminous chip (7/8, col. 4/ lines 22-44) between the LED luminous chip (7/8, col. 4/ lines 22-44) and the epoxy resin package (6, col. 4/ lines 22-44) is coated with a fluorescent powder (9/10, col. 4/ lines 22-44), for the purpose of providing a plurality of light-emitting diodes individually capable of emitting the light of respectively different colors are disposed close to one another (col. 2/ lines 5-15). Barnett, Fujii, He, and Kano are analogous art because they all are directed to LED and one of ordinary skill in the art would have had a reasonable expectation of success to modify Barnett in view of Fujii and He with the specified features of Kano because they are from the same field of endeavor. Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have modified the structure disclosed in Barnett in view of Fujii and He to have the LED luminous chip between the LED luminous chip and the epoxy resin package being coated with a fluorescent powder, as taught by Kano, for the purpose of providing a plurality of light-emitting diodes individually capable of emitting the light of respectively different colors are disposed close to one another (col. 2/ lines 5-15, Kano). Regarding claim 8, Barnett in view of Fujii and He discloses the direct plug-in LED lamp bead with an internal resistor according to claim 6 as described above. Kano further teaches, in at least figure 3 and related text, the fluorescent powder is one of fluorescent powders (9/10, col. 4/ lines 22-44) allowing the LED luminous chip (7/8, col. 4/ lines 22-44) to emit red light (col. 4/ lines 22-44), yellow light, green light, blue light, orange light, pink light, violet light, white light, and warm white light, for the purpose of providing a plurality of light-emitting diodes individually capable of emitting the light of respectively different colors are disposed close to one another (col. 2/ lines 5-15). Regarding claim 10, Barnett in view of Fujii and He discloses the direct plug-in LED lamp bead with an internal resistor according to claim 1 as described above. Barnett in view of Fujii and He does not explicitly disclose the LED luminous chip is an infrared or ultraviolet invisible light chip. Kano teaches, in at least figure 3 and related text, the device comprising the LED luminous chip (7/8, col. 4/ lines 22-44) is an infrared (col. 4/ lines 22-44) or ultraviolet invisible light chip, for the purpose of providing a plurality of light-emitting diodes individually capable of emitting the light of respectively different colors are disposed close to one another (col. 2/ lines 5-15). Barnett, Fujii, He, and Kano are analogous art because they all are directed to LED and one of ordinary skill in the art would have had a reasonable expectation of success to modify Barnett in view of Fujii and He with the specified features of Kano because they are from the same field of endeavor. Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have modified the structure disclosed in Barnett in view of Fujii and He to have the LED luminous chip being an infrared or ultraviolet invisible light chip, as taught by Kano, for the purpose of providing a plurality of light-emitting diodes individually capable of emitting the light of respectively different colors are disposed close to one another (col. 2/ lines 5-15, Kano). Claim(s) 7 is/are rejected under 35 U.S.C. 103 as being unpatentable over Barnett (US 2011/0101409) in view of Fujii (US 6,091,084), He (US 2024/0288150), and further in view of Takei (US 2011/0255281). Regarding claim 7, Barnett in view of Fujii and He discloses the direct plug-in LED lamp bead with an internal resistor according to claim 1 as described above. Barnett in view of Fujii and He does not explicitly disclose the LED luminous chip is a visible light chip not coated with a fluorescent powder. Takei teaches, in at least figures 2, 3B, and related text, the device comprising the LED luminous chip ([39]) is a visible light chip ([39]) not coated with a fluorescent powder ([41]), for the purpose of suppressing a decrease in extraction efficiency for light emitted from a light-emitting element and a rise in the temperature of the light-emitting element in response to the light emission ([8]). Barnett, Fujii, He, and Takei are analogous art because they all are directed to LED and one of ordinary skill in the art would have had a reasonable expectation of success to modify Barnett in view of Fujii and He with the specified features of Takei because they are from the same field of endeavor. Therefore, it would have been obvious to one of ordinary skill in the art before the effective filing date of the claimed invention to have modified the structure disclosed in Barnett in view of Fujii and He to have the LED luminous chip being a visible light chip not coated with a fluorescent powder, as taught by Takei, for the purpose of suppressing a decrease in extraction efficiency for light emitted from a light-emitting element and a rise in the temperature of the light-emitting element in response to the light emission ([8], Takei). Allowable Subject Matter Claim 5 would be allowable if rewritten to overcome the rejection(s) under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), 2nd paragraph, set forth in this Office action and to include all of the limitations of the base claim and any intervening claims because the prior art of record neither anticipates nor render obvious the limitations of the base claims 1 and 5 that recite "the resistor chip is fixed to the flat stand with a conductive silver adhesive" in combination with other elements of the base claims 1 and 5. Conclusion The prior art made of record and not relied upon is considered pertinent to applicant's disclosure. Any inquiry concerning this communication or earlier communications from the examiner should be directed to TONG-HO KIM whose telephone number is (571)270-0276. The examiner can normally be reached Monday thru Friday; 8:30 AM to 5PM. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Lynne Gurley can be reached at 571-272-1670. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /TONG-HO KIM/Primary Examiner, Art Unit 2811
Read full office action

Prosecution Timeline

Nov 01, 2023
Application Filed
Dec 25, 2025
Non-Final Rejection — §103, §112
Mar 27, 2026
Response Filed

Precedent Cases

Applications granted by this same examiner with similar technology

Patent 12598777
LOW TEMPERATURE, HIGH GERMANIUM, HIGH BORON SIGE:B PEPI WITH TITANIUM SILICIDE CONTACTS FOR ULTRA-LOW PMOS CONTACT RESISTIVITY AND THERMAL STABILITY
2y 5m to grant Granted Apr 07, 2026
Patent 12598764
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
2y 5m to grant Granted Apr 07, 2026
Patent 12598787
FIELD EFFECT TRANSISTOR WITH DUAL LAYER ISOLATION STRUCTURE AND METHOD
2y 5m to grant Granted Apr 07, 2026
Patent 12598831
PIXEL SHIELDING USING AIR GAPS
2y 5m to grant Granted Apr 07, 2026
Patent 12598802
High-Voltage Tolerant Device and Detection Circuit
2y 5m to grant Granted Apr 07, 2026
Study what changed to get past this examiner. Based on 5 most recent grants.

AI Strategy Recommendation

Get an AI-powered prosecution strategy using examiner precedents, rejection analysis, and claim mapping.
Powered by AI — typically takes 5-10 seconds

Prosecution Projections

1-2
Expected OA Rounds
95%
Grant Probability
96%
With Interview (+0.4%)
1y 8m
Median Time to Grant
Low
PTA Risk
Based on 1040 resolved cases by this examiner. Grant probability derived from career allow rate.

Sign in for Full Analysis

Enter your email to receive a magic link. No password needed.

Free tier: 3 strategy analyses per month