Tech Center 2800 • Art Units: 2811
This examiner grants 95% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18514158 | NAND FLASH DEVICE | Non-Final OA | Samsung Electronics Co., Ltd. |
| 18396389 | Display Panel and Display Device Including the Same | Non-Final OA | LG Display Co., Ltd. |
| 18396366 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18402916 | POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | HYUNDAI MOBIS CO., LTD. |
| 18405786 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | Samsung Display Co., LTD. |
| 18537565 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18537035 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18535237 | DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | Non-Final OA | Samsung Display Co., Ltd. |
| 18508823 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., LTD. |
| 18379993 | SEMICONDUCTOR DEVICE | Non-Final OA | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
| 18290422 | SEMICONDUCTOR PACKAGE | Non-Final OA | LG INNOTEK CO., LTD. |
| 18286840 | DISPLAY APPARATUS, DISPLAY MODULE, AND ELECTRONIC DEVICE | Non-Final OA | SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
| 18574429 | DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE | Non-Final OA | Sharp Display Technology Corporation |
| 18517945 | ISOLATION STRUCTURES FOR MULTI-GATE DEVICES | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18507039 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Ltd. |
| 18355688 | GATE DIELECTRIC LAYERS FOR STACKED MULTI-GATE DEVICE | Non-Final OA | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 18534753 | ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME | Non-Final OA | Innolux Corporation |
| 18090822 | INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL SHARED GATE HIGH-DRIVE THIN FILM TRANSISTORS | Non-Final OA | Intel Corporation |
| 18073213 | INTEGRATED CIRCUIT STRUCTURES WITH CAVITY SPACERS | Non-Final OA | Intel Corporation |
| 17937212 | FORMING METAL GATE CUTS USING MULTIPLE PASSES FOR DEPTH CONTROL | Final Rejection | Intel Corporation |
| 18530896 | BONDABLE PILLARS FOR WIRE BONDS IN A SEMICONDUCTOR PACKAGE | Non-Final OA | Micron Technology, Inc. |
| 18469489 | GATE-TIE-DOWN IN BACKSIDE POWER ARCHITECTURE USING CONTACT JUMPER AND BACKSIDE CONTACT | Non-Final OA | QUALCOMM Incorporated |
| 18469505 | COMPACT LOGIC CELLS USING FULL BACKSIDE CONNECTIVITY | Non-Final OA | QUALCOMM Incorporated |
| 18473484 | SEMICONDUCTOR DEVICE | Non-Final OA | ROHM CO., LTD. |
| 18396524 | POWER MOSFET DEVICE WITH PROTECTION AGAINST THE CONTAMINANTS AND RELATED MANUFACTURING PROCESS | Non-Final OA | STMicroelectronics International N.V. |
| 18336678 | 3D HYBRID MEMORY USING HORIZONTALLY ORIENTED CONDUCTIVE DIELECTRIC CHANNEL REGIONS | Non-Final OA | Tokyo Electron Limited |
| 18491401 | PACKAGE STRUCTURES, FABRICATING METHODS THEREOF, AND MEMORY SYSTEMS | Non-Final OA | Yangtze Memory Technologies Co., Ltd. |
| 18545757 | ELECTRONIC APPARATUS | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18541109 | METHOD FOR MANUFACTURING MICRO-LEDS | Non-Final OA | Commissariat à l'énergie atomique et aux énergies alternatives |
| 18380212 | RESISTIVE RANDOM ACCESS MEMORY DEVICE AND FABRICATION METHOD THEREOF | Non-Final OA | UNITED MICROELECTRONICS CORP. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy