DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Response to Amendment/Arguments
Applicant's arguments with respect to claims 1 – 12 have been considered, and have found to be persuasive. Please see the new ground(s) of rejection below.
Claim Rejections - 35 USC § 102
The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action:
A person shall be entitled to a patent unless –
(a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention.
Claims 1 – 4 are rejected under 35 U.S.C. 102(a)(1) as being anticipated by Wang et al. (U.S. Patent Publication No. 2024/0244761).
Regarding claim 1, in Figure 5, Wang discloses an information handling resource comprising: a circuit board (110) comprising an electrically-conductive pad (112); and a plated standoff (120) plated (this is an apparatus claim, thus the method of forming the standoff on the pad holds no patentable weight) onto a surface of the electrically-conductive pad (Figure 5).
Regarding claim 2, Wang discloses a circuit package (130) comprising an electrically-conductive pin (134); and reflowed solder (solder not shown; the solder column 120 is soldered to the connector 134, paragraph [0034], which means the solder is also electrically coupling the pad 112 to the connector 134) electrically coupling the electrically-conductive pad (112) to the electrically-conductive pin (Figure 5).
Regarding claim 3, Wang discloses wherein the circuit package is a bottom-terminated component (Figure 5).
Regarding claim 4, Wang discloses wherein the plated standoff is cylindrical in shape (Figure 5).
Claim Rejections - 35 USC § 103
The following is a quotation of 35 U.S.C. 103 which forms the basis for all obviousness rejections set forth in this Office action:
A patent for a claimed invention may not be obtained, notwithstanding that the claimed invention is not identically disclosed as set forth in section 102, if the differences between the claimed invention and the prior art are such that the claimed invention as a whole would have been obvious before the effective filing date of the claimed invention to a person having ordinary skill in the art to which the claimed invention pertains. Patentability shall not be negated by the manner in which the invention was made.
This application currently names joint inventors. In considering patentability of the claims the examiner presumes that the subject matter of the various claims was commonly owned as of the effective filing date of the claimed invention(s) absent any evidence to the contrary. Applicant is advised of the obligation under 37 CFR 1.56 to point out the inventor and effective filing dates of each claim that was not commonly owned as of the effective filing date of the later invention in order for the examiner to consider the applicability of 35 U.S.C. 102(b)(2)(C) for any potential 35 U.S.C. 102(a)(2) prior art against the later invention.
Claims 5 – 12 are rejected under 35 U.S.C. 103 as being unpatentable over Wang.
Regarding claim 5, in Figure 5, Wang discloses an information handling system comprising: a processor (130); and an information handling resource comprising: a circuit board (110) comprising an electrically-conductive pad (112); and a plated standoff (120) plated (this is an apparatus claim, thus the method of forming the standoff on the pad holds no patentable weight) onto a surface of the electrically-conductive pad (Figure 5). Wang does not specifically disclose package 130 being a processor. However, providing a semiconductor package/chip with processing capability is common place and well known in the art, and is merely a design option for a skilled artisan without the exercise of inventive skill.
Regarding claim 6, Wang discloses a circuit package comprising an electrically-conductive pin (134, Figure 5); and reflowed solder (solder not shown; the solder column 120 is soldered to the connector 134, paragraph [0034], which means the solder is also electrically coupling the pad 112 to the connector 134) electrically coupling the electrically-conductive pad (112) to the electrically-conductive pin (Figure 5).
Regarding claim 7, Wang discloses wherein the circuit package is a bottom-terminated component (Figure 5).
Regarding claim 8, Wang discloses wherein the plated standoff is cylindrical in shape (Figure 5).
Regarding claim 9, in Figure 5, Wang discloses a method comprising: forming a circuit board (110) with an electrically-conductive pad (112); and plating a plated standoff (120) onto a surface of the electrically-conductive pad (Figure 5). Wang does not specifically disclose solder column 120 being plated onto the pad 112. However, forming a solder column/standoff on the surface of a conductive pad via plating is common place and well known in the art, and is merely a design option for a skilled artisan without the exercise of inventive skill.
Regarding claim 10, Wang discloses electrically coupling an electrically-conductive pin (134, Figure 5) of a circuit package (130) to the electrically-conductive pad (112) with reflowed solder (solder not shown; the solder column 120 is soldered to the connector 134, paragraph [0034], which means the solder is also electrically coupling the pad 112 to the connector 134).
Regarding claim 11, Wang discloses wherein the circuit package is a bottom-terminated component (Figure 5).
Regarding claim 12, Wang discloses forming the plated standoff such that the plated standoff is cylindrical in shape (Figure 5).
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to TREMESHA W BURNS whose telephone number is (571)270-3391. The examiner can normally be reached Monday-Friday 8am - 4:30 pm EST.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Timothy Thompson can be reached at (571) 272-2342. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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TREMESHA W. BURNS
Primary Examiner
Art Unit 2847
/TREMESHA W BURNS/Primary Examiner, Art Unit 2847
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