Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2835 2847
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18498544 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18770005 | ELECTRONIC DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 17964972 | SOLDER COMPOSITION AND ELECTRONIC COMPONENT | Non-Final OA | TDK CORPORATION |
| 18416591 | WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18691902 | CIRCUIT BOARD ASSEMBLY, DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18835151 | PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18406451 | SUBSTRATE SUPPORT WITH PRINTED HEATER | Non-Final OA | Tokyo Electron Limited |
| 18782574 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | InnoLux Corporation |
| 18535850 | ELECTRICAL ENCLOSURE INCLUDING IN-MOLD DECORATION | Final Rejection | ABB Schweiz AG |
| 17726990 | PRINTED CIRCUIT BOARD WITH EMBEDDED BUMP PADS | Final Rejection | Sandisk Technologies, Inc. |
| 18790090 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18386963 | CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18386053 | CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 17939081 | PRINTED CIRCUIT BOARD | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18772137 | Pre-Plating of Solder Layer on Solderable Elements for Diffusion Soldering | Non-Final OA | Infineon Technologies AG |
| 18844362 | BGA Radio Frequency Module, Substrate for BGA Radio Frequency Module and Optical Communication Module | Non-Final OA | NTT, Inc. |
| 18704926 | FLEXIBLE SUBSTRATE AND TESTING JIG | Non-Final OA | YOKOWO CO., LTD. |
| 18713194 | ASSEMBLY | Final Rejection | YOKOWO CO., LTD. |
| 18912838 | INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18819430 | WIRING BOARD AND LAMINATED WIRING BOARD | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18126824 | CERAMIC SUBSTRATE, CERAMIC DIVIDED SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE | Final Rejection | Proterial, Ltd. |
| 18698103 | ELECTRICAL FEEDTHROUGH AND METHOD FOR THE PRODUCTION THEREOF | Final Rejection | Vitesco Technologies GmbH |
| 18731214 | ELECTRONIC DEVICE | Non-Final OA | Advanced Semiconductor Engineering, Inc. |
| 18605706 | ELECTRONIC DEVICE | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 18502883 | PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOARD AND CIRCUIT PACKAGE | Non-Final OA | Dell Products L.P. |
| 18859963 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | Non-Final OA | Resonac Corporation |
| 18858330 | MEMBER FOR SEMICONDUCTOR DEVICE PRODUCTION, AND METHOD FOR PRODUCING SAME | Non-Final OA | Resonac Corporation |
| 18836471 | MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND FORMED WIRING MEMBER | Non-Final OA | Resonac Corporation |
| 18836527 | MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND FORMED WIRING MEMBER | Non-Final OA | Resonac Corporation |
| 18860690 | WIRING BOARD STACKED BODY AND METHOD OF MANUFACTURING WIRING BOARD STACKED BODY | Non-Final OA | DAIWA CO., LTD. |
IP Author analyzes examiner patterns and generates tailored response strategies with the highest chance of allowance.
Build Your Strategy