Prosecution Insights
Prosecution Insights
Tech Center 2800 • Art Units: 2812 2835 2847
This examiner grants 78% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18691902 | CIRCUIT BOARD ASSEMBLY, DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS | Non-Final OA | BOE TECHNOLOGY GROUP CO., LTD. |
| 18918956 | METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD | Non-Final OA | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
| 18770005 | ELECTRONIC DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 18498544 | Display Device | Non-Final OA | LG Display Co., Ltd. |
| 18954437 | FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE | Non-Final OA | VIVO MOBILE COMMUNICATION CO., LTD. |
| 18782574 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | InnoLux Corporation |
| 18416591 | WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE | Non-Final OA | CANON KABUSHIKI KAISHA |
| 18707433 | CIRCUIT BOARD | Non-Final OA | LG INNOTEK CO., LTD. |
| 18835151 | PRINTED DE-COUPLING PLANE FOR PRINTED CIRCUIT BOARDS | Non-Final OA | Microsoft Technology Licensing, LLC |
| 18923719 | WIRING SUBSTRATE | Non-Final OA | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 18958608 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18790090 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18672524 | PRINTED CIRCUIT BOARD | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18386963 | CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18386053 | CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 17939081 | PRINTED CIRCUIT BOARD | Final Rejection | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 17726990 | PRINTED CIRCUIT BOARD WITH EMBEDDED BUMP PADS | Final Rejection | Sandisk Technologies, Inc. |
| 18962418 | EXTERIOR MEMBER AND WIRE HARNESS | Non-Final OA | SUMITOMO WIRING SYSTEMS, LTD. |
| 18704926 | FLEXIBLE SUBSTRATE AND TESTING JIG | Non-Final OA | YOKOWO CO., LTD. |
| 18713194 | ASSEMBLY | Final Rejection | YOKOWO CO., LTD. |
| 18605706 | ELECTRONIC DEVICE | Final Rejection | Advanced Semiconductor Engineering, Inc. |
| 18941214 | Component Carrier With Embedded Interposer Laterally Between Electrically Conductive Structures of Stack | Non-Final OA | AT&S Austria Technologie & Systemtechnik Aktiengesellschaft |
| 18126824 | CERAMIC SUBSTRATE, CERAMIC DIVIDED SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE | Non-Final OA | Proterial, Ltd. |
| 18746067 | COPPER FOIL FOR PRINTED CIRCUIT BOARDS AND MANUFACTURING METHOD THEREOF | Non-Final OA | NAN YA PLASTICS CORPORATION |
| 18859963 | PREPREG, LAMINATED PLATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | Non-Final OA | Resonac Corporation |
| 18858330 | MEMBER FOR SEMICONDUCTOR DEVICE PRODUCTION, AND METHOD FOR PRODUCING SAME | Non-Final OA | Resonac Corporation |
| 18946926 | PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME | Non-Final OA | Absolics Inc. |
| 18744153 | APPARATUSES AND METHODS FOR PROVIDING POWER TO ELECTRONIC DEVICES | Non-Final OA | General Dynamics Mission Systems, Inc. |
| 18819430 | WIRING BOARD AND LAMINATED WIRING BOARD | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
| 18629124 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE | Non-Final OA | SHINKO ELECTRIC INDUSTRIES CO., LTD. |
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