DETAILED ACTION
Notice of Pre-AIA or AIA Status
The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA .
Claim Rejections - 35 USC § 112
The following is a quotation of 35 U.S.C. 112(b):
(b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention.
Claims 9-18,20 rejected under 35 U.S.C. 112(b) or 35 U.S.C. 112 (pre-AIA ), second paragraph, as being indefinite for failing to particularly point out and distinctly claim the subject matter which the inventor or a joint inventor (or for applications subject to pre-AIA 35 U.S.C. 112, the applicant), regards as the invention.
Claim 9 recites the limitation "the molding material". There is insufficient antecedent basis for this limitation in the claim. Claim 9 would be allowable if the “the molding material” were claimed as “a molding material.
Regarding claim 9, the references of the Prior Art of record and considered pertinent to the applicant's disclosure and to the examiner’s knowledge does not teach or render obvious, at least to the skilled artisan, the instant invention regarding: " …including a first aperture disposed above a first portion of the first circuit substrate; …and molding material that at least partially surrounds the first interposer substrate.”, as recited in Claim 9, with the remaining features.
Allowable Subject Matter
Claims 1-8,19 are allowed.
The following is an examiner’s statement of reasons for allowance, which paraphrases and summarizes the claimed invention without intending to be limiting, wherein the legally defined scope of the claimed invention is defined by the allowed claims themselves in view of the written description under 35 USC 112. This statement is not intended to necessarily state all the reasons for allowance or all the details why the claims are allowed and has not been written to specifically or impliedly state that all the reasons for allowance are set forth (MPEP 1302.14).
US-20160013151-A1 discloses a substrate comprising mold filled dicing channels on an interposer. US-20250079402-A1 discloses forming a dicing channel through the second substrate and filling it with molding material , then dicing the package all the way through the first substrate. US-20240099030-A1 discloses etching through a molding material between chips and through an interposer and first substrate.
US-20120126402-A1 discloses etching through a molding material between chips and through a substrate. US-20080217709-A1 discloses a package comprising a first substrate 112, an interposer 114, and a cover116 on the interposer. The package is singulated by etching through the interposer 114. US-20210134690-A1 discloses a package comprising an interposer with apertures on a first substrate, a cover on the interposer, and molding surrounding the interposer. US-20200402942-A1 discloses partially etching through a second substrate, filling the hole with molding material and singulating the package through the molding material which remains on outside surfaces of the second substrate. The art is silent on the limitations cited below in combination with the rest of the claimed limitations.
Regarding claim 1, the references of the Prior Art of record and considered pertinent to the applicant's disclosure and to the examiner’s knowledge does not teach or render obvious, at least to the skilled artisan, the instant invention regarding: " dispensing a molding material in the channels in the second substrate panel such that aperture in the first interposer substrate is surrounded by the molding material…”, as recited in Claim 1, with the remaining features.
Regarding claim 19, the references of the Prior Art of record and considered pertinent to the applicant's disclosure and to the examiner’s knowledge does not teach or render obvious, at least to the skilled artisan, the instant invention regarding: " wherein each singulated assembly further includes a portion of the molding material in the channels that pass through the second substrate panel that remains after dicing through the channels; and wherein the molding material electrically isolates electrically conductive structures of the first interposer substrate.”, as recited in Claim 19, with the remaining features.
Any comments considered necessary by applicant must be submitted no later than the payment of the issue fee and, to avoid processing delays, should preferably accompany the issue fee. Such submissions should be clearly labeled “Comments on Statement of Reasons for Allowance.”
Conclusion
Any inquiry concerning this communication or earlier communications from the examiner should be directed to LAWRENCE C TYNES JR. whose telephone number is (571)270-7606. The examiner can normally be reached 9AM-5PM.
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If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Zandra Smith can be reached at 571-272-2429. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300.
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/LAWRENCE C TYNES JR./Examiner, Art Unit 2899
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