Tech Center 2800 • Art Units: 2816 2822 2899
This examiner grants 85% of resolved cases
| App # | Title | Status | Assignee |
|---|---|---|---|
| 18479591 | SEMICONDUCTOR MEMORY DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Non-Final OA | SAMSUNG ELECTRONICS CO., LTD. |
| 18191212 | SEMICONDUCTOR PACKAGE | Final Rejection | Samsung Electronics Co., Ltd. |
| 18389134 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | Non-Final OA | LG DISPLAY CO., LTD. |
| 17977091 | FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND POWER METALLIZATION | Final Rejection | TEXAS INSTRUMENTS INCORPORATED |
| 18370419 | DISPLAY DEVICE | Non-Final OA | Samsung Display Co., Ltd. |
| 17900033 | SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING | Final Rejection | Microsoft Technology Licensing, LLC |
| 17900153 | SEMICONDUCTOR INTERCONNECT BRIDGE PACKAGING | Non-Final OA | Microsoft Technology Licensing, LLC |
| 17641365 | HIGH DENSITY PLASMA CVD FOR DISPLAY ENCAPSULATION APPLICATION | Final Rejection | Applied Materials, Inc. |
| 18088542 | GALLIUM NITRIDE (GAN) LAYER ON SUBSTRATE CARBURIZATION FOR INTEGRATED CIRCUIT TECHNOLOGY | Non-Final OA | Intel Corporation |
| 18388992 | CAPACITOR COMPONENT | Non-Final OA | SAMSUNG ELECTRO-MECHANICS CO., LTD. |
| 18496225 | ELECTRONIC DEVICE AND ELECTRONIC APPARATUS | Non-Final OA | PanelSemi Corporation |
| 18452601 | SEMICONDUCTOR PACKAGE WITH VARIABLE SOLDER RESIST OPENING DIMENSIONS AND METHODS FOR FORMING THE SAME | Non-Final OA | Taiwan Semiconductor Manufacturing Company Limited |
| 17959373 | ENHANCED SEMICONDUCTOR STRUCTURES | Final Rejection | BroadPak Corporation |
| 18366569 | BONDED DEBUGGING ELEMENTS FOR INTEGRATED CIRCUITS AND METHODS FOR DEBUGGING INTEGRATED CIRCUITS USING SAME | Non-Final OA | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
| 18160406 | Module Comprising a Semiconductor-based Component and Method of Manufacturing the Same | Final Rejection | AT&S Austria Technologie & Systemtechnik AG |
| 18353769 | SEMICONDUCTOR PACKAGES, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE | Non-Final OA | SERIPHY TECHNOLOGY CORPORATION |
| 18326304 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | Final Rejection | Amkor Technology Portugal, S.A. |
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