Prosecution Insights
Last updated: October 01, 2026

Examiner: TYNES JR., LAWRENCE C

Tech Center 2800 • Art Units: 2816 2822 2899

This examiner grants 86% of resolved cases

Analysis

Examiner Lawrence C. Tynes Jr. is a member of Tech Center 2800 and operates within Art Unit 2816. With 791 resolved cases, his profile provides a substantial dataset for evaluating prosecution trends. His allowance rate of 85.5% indicates a high frequency of granted patents, suggesting that the examiner is generally open to finding allowable subject matter. This rate serves as a primary benchmark for applicants assessing their chances of success when assigned to his docket.

The median days to allowance for this examiner is 862, which offers a clear expectation for the timeline of a successful application. Practitioners should also consider the interview lift of 8.8%, which shows a positive correlation between direct communication and patent issuance. While the base allowance rate is already high, this lift suggests that interviews can be a useful tool for resolving minor disagreements or clarifying technical points. The 862-day median pendency is a critical figure for budgeting and strategic planning.

For those navigating Art Unit 2816, the combination of an 85.5% allowance rate and an 8.8% interview lift suggests a collaborative environment. The 791 resolved cases indicate that these metrics are stable and representative of the examiner's long-term performance. Applicants may find that while the standard prosecution path is often successful, the added benefit of an interview can help maintain momentum toward the 862-day median resolution. This data-driven approach allows for more precise forecasting of outcomes in Tech Center 2800.

Written from this page's own data; every figure is computed from USPTO records and verified before publication.

Performance Statistics

85.5%
Allow Rate
+17.5% vs TC avg
813
Total Applications
+8.8%
Interview Lift
862
Avg Prosecution Days
Based on 791 resolved cases, 2023–2026

Rejection Statute Breakdown

0.6%
§101 Eligibility
26.6%
§102 Novelty
51.1%
§103 Obviousness
17.8%
§112 Clarity

Currently Pending Office Actions

App #TitleStatusAssignee
18736228 SEMICONDUCTOR DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18732848 SEMICONDUCTOR MEMORY DEVICE Non-Final OA SAMSUNG ELECTRONICS CO., LTD.
18663449 SEMICONDUCTOR DEVICE HAVING SOURCE/DRAIN REGIONS Non-Final OA Samsung Electronics Co., Ltd.
18544881 DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME Non-Final OA Samsung Display Co., LTD.
18389134 DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME Non-Final OA LG DISPLAY CO., LTD.
18715890 SEMICONDUCTOR DEVICE Non-Final OA SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
18353671 Inter-Terminal Die-to-Die Attachment Final Rejection Murata Manufacturing Co., Ltd.
17977091 FAN-OUT PACKAGE HAVING BALL GRID ARRAY SUBSTRATE WITH SIGNAL AND POWER METALLIZATION Non-Final OA TEXAS INSTRUMENTS INCORPORATED
18410303 SEMICONDUCTOR STRUCTURE HAVING NON-SILICIDE SOURCE/DRAIN CONTACT AND METHOD FOR MANUFACTURING THE SAME Final Rejection TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
18779329 SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18744471 METHOD AND DEVICE TO INCREASE NANOSHEET DEVICE WIDTH Non-Final OA Taiwan Semiconductor Manufacturing Co., Ltd.
18767239 Zero Mask High Density Capacitor Non-Final OA Taiwan Semiconductor Manufacturing Company Limited
17641365 HIGH DENSITY PLASMA CVD FOR DISPLAY ENCAPSULATION APPLICATION Non-Final OA Applied Materials, Inc.
18651931 METHOD FOR FORMING CONDUCTORS AND THEIR CONTACTS WHICH CARRY SIGNALS FOR ADVANCED SEMICONDUCTOR MEMORY DEVICES Non-Final OA Nanya Technology Corporation
18813043 ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL Non-Final OA Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
18361081 SINGLE PACKAGE DATA STORAGE DEVICE Non-Final OA Sandisk Technologies, Inc
18674710 ELECTRONIC SYSTEM AND SEMICONDUCTOR MODULE Non-Final OA Advanced Semiconductor Engineering, Inc.
18310072 ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF Final Rejection SILICONWARE PRECISION INDUSTRIES CO., LTD.

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