Prosecution Insights
Last updated: May 29, 2026
Application No. 18/523,906

SEMICONDUCTOR PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGES, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGING SUBSTRATE

Non-Final OA §102§112
Filed
Nov 30, 2023
Priority
Dec 02, 2022 — provisional 63/429,563
Examiner
YEMELYANOV, DMITRIY
Art Unit
2891
Tech Center
2800 — Semiconductors & Electrical Systems
Assignee
Absolics Inc.
OA Round
1 (Non-Final)
73%
Grant Probability
Favorable
1-2
OA Rounds
1m
Est. Remaining
92%
With Interview

Examiner Intelligence

Grants 73% — above average
73%
Career Allowance Rate
401 granted / 546 resolved
+5.4% vs TC avg
Strong +19% interview lift
Without
With
+18.6%
Interview Lift
resolved cases with interview
Typical timeline
2y 7m
Avg Prosecution
35 currently pending
Career history
593
Total Applications
across all art units

Statute-Specific Performance

§101
0.1%
-39.9% vs TC avg
§103
88.7%
+48.7% vs TC avg
§102
8.4%
-31.6% vs TC avg
§112
2.5%
-37.5% vs TC avg
Black line = Tech Center average estimate • Based on career data from 546 resolved cases

Office Action

§102 §112
DETAILED ACTION Notice of Pre-AIA or AIA Status The present application, filed on or after March 16, 2013, is being examined under the first inventor to file provisions of the AIA . Election/Restrictions Applicant’s election of Invention I, Species IA, Sub-Species AB (Fig. 8, Claims 1-8, 10) in the reply filed on 05/05/2026 is acknowledged. Because applicant did not distinctly and specifically point out the supposed errors in the restriction requirement, the election has been treated as an election without traverse (MPEP § 818.01(a)). Further, Claim 10 is withdrawn from further consideration pursuant to 37 CFR 1.142(b) as being drawn to a nonelected Species B (Fig. 7, see limitation “an angle between the side wall and the recessed surface is an obtuse angle”, there being no allowable generic or linking claim. Election was made without traverse in the reply filed on 05/05/2026. Claim Rejections - 35 USC § 112 The following is a quotation of 35 U.S.C. 112(b): (b) CONCLUSION.—The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the inventor or a joint inventor regards as the invention. The following is a quotation of 35 U.S.C. 112 (pre-AIA ), second paragraph: The specification shall conclude with one or more claims particularly pointing out and distinctly claiming the subject matter which the applicant regards as his invention. Claim 6 recites the limitation "the area of the one surface." In line 2. There is insufficient antecedent basis for this limitation in the claim. For the purposes of examination, the Examiner will treat "the area of the one surface." as --an area of the one surface. -- Claim Rejections - 35 USC § 102 The following is a quotation of the appropriate paragraphs of 35 U.S.C. 102 that form the basis for the rejections under this section made in this Office action: A person shall be entitled to a patent unless – (a)(1) the claimed invention was patented, described in a printed publication, or in public use, on sale, or otherwise available to the public before the effective filing date of the claimed invention. Claim(s) 1-8 is/are rejected under 35 U.S.C. 102(A1) as being anticipated by Kim et al. (KR 2021/0068579 A; Published 06/09/2021) Hereinafter, for the purposes of clarity, all figure and paragraph references will be taken from US equivalent publication US 2022/0051972 A1) Regarding Claim 1, Kim (Fig. 1-10) discloses a semiconductor packaging substrate comprising: a substrate (packaging substrate 20) comprising a one surface, other surface facing the one surface (opposing surfaces of 20), a recessed surface (recessed surface of cavity 28) that the one surface recessed, and a side wall (sidewall of cavity 28) connecting the one surface and the recessed surface (See Fig. 3); and plurality of first vias (232 with 24) that penetrating the recessed surface and the other surface (Fig. 3, 8), wherein the plurality of first vias (232 with 24) comprise a thermal conductive material. (“a metal such as copper which has excellent heat conductivity,”) [0136, 0193, 0225-00227 0232, 0234] Regarding Claim 2, Kim discloses the semiconductor packaging substrate of claim 1, wherein the substrate (20) comprises a glass substrate (21) [0076]. Regarding Claim 3, Kim discloses the semiconductor packaging substrate of claim 1, wherein the substrate (20) comprises an insulator substrate (21) [0076]. Regarding Claim 4, Kim discloses the semiconductor packaging substrate of claim 1, wherein the one surface and the other surface have surface roughness Ra of 10 Å or less, respectively. (“glass substrate 21 can have a considerably flat surface property with a surface roughness (Ra) of 10 angstroms or less) [0148] Regarding Claim 5, Kim discloses the semiconductor packaging substrate of claim 1, wherein the substrate further comprises plurality of second vias (231 with 24) that penetrating the one surface and the other surface. (Fig. 3, 8) Regarding Claim 6, Kim discloses the semiconductor packaging substrate of claim 1, wherein an area of the recessed surface (an area of recessed surface of cavity 28) is 10% or larger than the area of the one surface (an area of surface of 20 with cavity 28). (See Fig. 2-10, at least see areas 222 and 221) The Examiner notes that since the Applicant did not explicitly established metes and bounds of “an area” the Examiner selected areas of the recessed surface and the one surface that would meet claim limitation. Regarding Claim 7, Kim (Fig. 2-10) discloses a semiconductor packages comprising: a substrate (20) comprising a one surface, other surface facing the one surface (opposing surfaces of 20), a recessed surface that the one surface recessed (recessed surface of cavity 28), and a side wall connecting the one surface and the recessed surface (sidewall of cavity 28); plurality of first vias (232 with 24) that penetrating the recessed surface and the other surface; and an element unit (40) disposed on the recessed surface (Fig. 2-10), wherein the plurality of first vias comprise a thermal conductive material. (“a metal such as copper which has excellent heat conductivity,”) [0136, 0193, 0225-00227, 0232, 0234] Regarding Claim 8, Kim discloses semiconductor packages of claim 7, wherein the element unit comprises an active element. (“The cavity element 40 may comprise a transistor.”) [0173] Conclusion Any inquiry concerning this communication or earlier communications from the examiner should be directed to DMITRIY YEMELYANOV whose telephone number is (571)270-7920. The examiner can normally be reached M-F 9a.m.-6p.m. Examiner interviews are available via telephone, in-person, and video conferencing using a USPTO supplied web-based collaboration tool. To schedule an interview, applicant is encouraged to use the USPTO Automated Interview Request (AIR) at http://www.uspto.gov/interviewpractice. If attempts to reach the examiner by telephone are unsuccessful, the examiner’s supervisor, Matthew Landau can be reached at (571) 272-1731. The fax phone number for the organization where this application or proceeding is assigned is 571-273-8300. Information regarding the status of published or unpublished applications may be obtained from Patent Center. Unpublished application information in Patent Center is available to registered users. To file and manage patent submissions in Patent Center, visit: https://patentcenter.uspto.gov. Visit https://www.uspto.gov/patents/apply/patent-center for more information about Patent Center and https://www.uspto.gov/patents/docx for information about filing in DOCX format. For additional questions, contact the Electronic Business Center (EBC) at 866-217-9197 (toll-free). If you would like assistance from a USPTO Customer Service Representative, call 800-786-9199 (IN USA OR CANADA) or 571-272-1000. /DMITRIY YEMELYANOV/Examiner, Art Unit 2891
Read full office action

Prosecution Timeline

Nov 30, 2023
Application Filed
May 20, 2026
Non-Final Rejection mailed — §102, §112 (current)

Precedent Cases

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Study what changed to get past this examiner. Based on 5 most recent grants.

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Prosecution Projections

1-2
Expected OA Rounds
73%
Grant Probability
92%
With Interview (+18.6%)
2y 7m (~1m remaining)
Median Time to Grant
Low
PTA Risk
Based on 546 resolved cases by this examiner. Grant probability derived from career allowance rate.

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